摘要:
Pattern formation simulations are performed based on design layout data subjected to OPC processing with a plurality of process parameters set in process conditions. A worst condition of the process conditions is calculated based on risk points extracted from simulation results. The design layout data or the OPC processing is changed such that when a pattern is formed under the worst condition based on the changed design layout data or the changed OPC processing a number of the risk points or a risk degree of the risk points of the pattern is smaller than the simulation result.
摘要:
A method of manufacturing a semiconductor device, which forms a pattern by performing pattern transformation steps multiple times, comprises setting finished pattern sizes for patterns to be formed in each consecutive two pattern transformation steps among the plurality of pattern transformation steps based on a possible total amount of in-plane size variation of the patterns to be formed in the consecutive two pattern transformation steps.
摘要:
A design layout data creating method includes creating design layout data of a semiconductor device such that patterns formed on a wafer when patterns corresponding to the design layout data are formed on the wafer have a pattern coverage ratio within a predetermined range in a wafer surface and total peripheral length of the patterns formed on the wafer when the patterns corresponding to the design layout are formed on the wafer is pattern peripheral length within a predetermined range.
摘要:
A mask inspection method according to the embodiments, original data corresponding to a semiconductor integrated circuit pattern to be formed on a substrate is created. After that, original production simulation which mocks an original production process is performed on the original data to derive information relating to an original pattern shape in the case of forming an original pattern corresponding to the original data on an original. After that, whether or not the information relating to an original pattern shape satisfies a predetermined value decided based on the original production process is determined.
摘要:
A pattern dimension calculation method according to one embodiment calculates a taper shape of a mask member used as a mask when a circuit pattern is processed in an upper layer of the circuit pattern formed on a substrate. The method calculates an opening angle facing the mask member from a shape prediction position on the circuit pattern on the basis of the taper shape. The method calculates a dimension of the circuit pattern according to the opening angle formed at the shape prediction position.
摘要:
According to one embodiment, a method of manufacturing a nonvolatile semiconductor storage device includes a memory-cell forming step, a first wire forming step, and a second wire forming step. The memory-cell forming step is forming dummy memory cells arranged at a predetermined space apart from an end memory cell located at an end of a group of memory cells set in contact with the same first or second wire among the memory cells, the dummy memory cells having a laminated structure same as that of the memory cells and being set in contact with no second wire.
摘要:
A method of manufacturing a semiconductor device according to an embodiment includes determining a second exposure parameter including exposure parameters except for an exposure amount from a dimension distribution information so that a resist pattern of a first resist pattern formed based on a second pattern has a desired dimension in a plurality of regions to be shot within a surface of a wafer.
摘要:
The present invention provides a rubber composition for a tread which enables improvement in fuel economy, breaking performance, and abrasion resistance in a balanced manner; a method for producing the rubber composition; and a heavy-load tire. The present invention relates to a rubber composition for a tread of a heavy-load tire, including a modified natural rubber having a phosphorus content of 200 ppm or less, and carbon black.