Packaging for sports equipment
    4.
    发明授权

    公开(公告)号:US06290062B1

    公开(公告)日:2001-09-18

    申请号:US09444873

    申请日:1999-11-22

    IPC分类号: B65D8500

    摘要: Packaging for sports equipment has an enclosure and a hologram formed on at least a portion thereof for diffusely reflecting incident light. A marking layer is formed on the hologram and of an organic ink, an inorganic ink, or an ink containing a dye or pigment having the color attributes of lightness, saturation and hue, at least one of which varies due to interference with diffusely reflected light from the hologram. Alternatively, the marking layer is formed on the first hologram by laminating one or more second hologram layers thereon. This construction gives the packaging a highly decorative and elegant appearance.

    Golf ball-containing box
    5.
    发明授权
    Golf ball-containing box 失效
    高尔夫球包装盒

    公开(公告)号:US06354436B2

    公开(公告)日:2002-03-12

    申请号:US09492810

    申请日:2000-01-28

    申请人: Takahisa Ohno

    发明人: Takahisa Ohno

    IPC分类号: B65D8558

    CPC分类号: B65D5/62

    摘要: A paper base having a thin metallization on at least a portion of its surface is folded into a box for accommodating golf balls. The box has an elegant appearance, can be disposed of without problems, and can be effectively manufactured.

    摘要翻译: 在其表面的至少一部分上具有薄金属化的纸基被折叠成用于容纳高尔夫球的盒子。 该箱子外形美观,可以无故处理,可以有效地制造。

    Semiconductor substrate and device with a surface layer structure
    6.
    发明授权
    Semiconductor substrate and device with a surface layer structure 失效
    具有表面层结构的半导体衬底和器件

    公开(公告)号:US5396082A

    公开(公告)日:1995-03-07

    申请号:US205771

    申请日:1994-03-04

    IPC分类号: H01L29/205 H01L29/161

    CPC分类号: H01L29/205

    摘要: The semiconductor device has a semiconductor substrate composed essentially of a III-V compound semiconductor containing Ga and As, and a surface layer structure provided on the semiconductor substrate and this layer has a composition different from that of the semiconductor substrate. The surface layer structure includes a strained layer epitaxially grown on the surface of the semiconductor substrate and composed essentially of at least one-element selected from the group consisting of indium, gallium, aluminum and boron, and at least one element selected from the group consisting of arsenic and phosphorus. The strained layer has a composition different from that of the semiconductor substrate The strained layer has a valence band maximum lower in energy than that of the valence band maximum of the semiconductor substrate.

    摘要翻译: 半导体器件具有基本上由包含Ga和As的III-V族化合物半导体构成的半导体衬底以及设置在半导体衬底上的表面层结构,该层具有不同于半导体衬底的组成。 表面层结构包括外延生长在半导体衬底的表面上并且基本上由选自铟,镓,铝和硼的至少一种元素组成的应变层,以及至少一种选自以下的元素: 的砷和磷。 应变层具有与半导体衬底的组成不同的组成。应变层具有与半导体衬底的价带最大值的能量最低的价带。