摘要:
The semiconductor device has a semiconductor substrate composed essentially of a III-V compound semiconductor containing Ga and As, and a surface layer structure provided on the semiconductor substrate and this layer has a composition different from that of the semiconductor substrate. The surface layer structure includes a strained layer epitaxially grown on the surface of the semiconductor substrate and composed essentially of at least one-element selected from the group consisting of indium, gallium, aluminum and boron, and at least one element selected from the group consisting of arsenic and phosphorus. The strained layer has a composition different from that of the semiconductor substrate The strained layer has a valence band maximum lower in energy than that of the valence band maximum of the semiconductor substrate.
摘要:
A high-quality GaAs-type crystal thin film using an inexpensive Si wafer with good thermal release characteristics is achieved. Provided is a semiconductor wafer comprising a single-crystal Si wafer; an insulating layer that has an open region and that is formed on the wafer; a Ge layer that is epitaxially grown on the wafer in the open region; and a GaAs layer that is epitaxially grown on the Ge layer, wherein the Ge layer is formed by (i) placing the wafer in a CVD reaction chamber that can create an ultra-high vacuum low-pressure state, (ii) performing a first epitaxial growth at a first temperature at which raw material gas can thermally decompose, (iii) performing a second epitaxial growth at a second temperature that is higher than the first temperature, (iv) performing a first annealing, at a third temperature that is loss than a melting point of Ge, on epitaxial layers formed by the first and second epitaxial growths, and (v) performing a second annealing at a fourth temperature that is lower than the third temperature. The Ge layer may he formed by repeating the first annealing and the second annealing a plurality of times, and the insulating layer may be a silicon oxide layer.
摘要:
An on-chip amplifier includes first element that curtails the velocity of an incoming light to the amplifier. A second element is doped so as to make the frequency of the incoming light equal to the electron frequency in order to allow for electron-photon wave interaction, so that when current flows through the amplifier, electron power is transferred to the incoming light, resulting in amplification of the incoming light.
摘要:
A waveguide-semiconductor coupling device includes a waveguide structure that includes a multimode interferometer (MMI) structure so as to minimize the reflections of TE modes in the coupling device. A mesa structure is coupled to the waveguide structure so as to minimize the reflections of TM modes in the coupling device.
摘要:
A photonic bandgap device includes a first mirror region including alternating layers of different materials. A second mirror region includes alternating layers of different materials. An air gap cavity region is positioned between the first mirror region and second region. The air gap cavity changes its thickness when a voltage is applied so that the device is tuned to a particular resonant wavelength.
摘要:
A method of reducing the scattering losses that involves smoothing of the core/cladding interface and/or change of waveguide geometry in high refractive index difference waveguides. As an example, the SOI-based Si/SiO2 waveguides are subjected to an oxidation reaction at high temperatures, after the waveguide patterning process. By oxidizing the rough silicon core surfaces after the patterning process, the core/cladding interfaces are smoothened, reducing the roughness scattering in waveguides.
摘要:
To prevent decreases in fatigue strength of a base material by relieving the residual stress of a weld. A method for welding a deposit metal to a base material with reduced residual stress, comprising a step of welding a deposit metal to a base material; and a step of plastically deforming into a recess, an area on the surface of the base material around a peripheral portion of the deposit metal. The invention is also directed to a welded block joint between a wire and a base material, characterized by comprising a deposit metal receiving an end portion of the wire and welded to the base material, wherein an area which is plastically deformed into a recess is formed on the base material surface at a peripheral portion of the deposit metal.
摘要:
A solar cell that has a photoactive region; a Lambertian surface on the topside of the photoactive region; and a photonic crystal on the backside of the photoactive region.
摘要:
A light-emitting device having a ring optical resonator and capable of laser oscillation by a novel structure realized by working out the mechanism of light emission. The light-emitting device having a ring optical resonator fabricated on a base is characterized in that the optical resonator has a core made of a semiconductor and serving to propagate light and a clad formed on at least the base side of the core in the stack direction out of the base side and the opposite side of the core, at least the ring inner and outer peripheral surfaces of the core are covered with a transparent body having an index of refraction lower than that of the space or the clad, and a part of the ring inner and outer peripheral surfaces of the clad are covered with a transparent body having an index of refraction lower than that of the space or the clad.
摘要:
A silicon solar cell includes a silicon substrate (10) having a p-n junction structure fabricated by forming an n-type silicon substrate an a p-type silicon substrate by n-type impurity diffusion. The silicon substrate (10) contains multiple diffusing bodies (12) diffusing incident light (11) in all directions as shown by arrows (11a to 11g). Since the diffuse light beams travel along the light-receiving surface (10a) at long distances, the lengths that the light beams travel are long accordingly, and the light absorption is enhanced. Even holes (pipe-like holes) formed in the light-receiving surface (10a) of the silicon substrate (10) formed after the anodization step enhance the light internal persistence rate higher than that of conventional silicon substrates like silicon substrates (10) containing air balls (12). The silicon substrate exhibiting a light internal persistence rate approximate to those of silicon substrates containing air balls can be fabricated by a simpler manufacturing method without any annealing step.