Group III nitride semiconductor light emitting device
    1.
    发明授权
    Group III nitride semiconductor light emitting device 有权
    III族氮化物半导体发光器件

    公开(公告)号:US09231370B2

    公开(公告)日:2016-01-05

    申请号:US13453743

    申请日:2012-04-23

    摘要: A group III nitride semiconductor laser device includes a laser structure, an insulating layer, an electrode and dielectric multilayers. The laser structure includes a semiconductor region on a semi-polar primary surface of a hexagonal group III nitride semiconductor support base. The dielectric multilayers are on first and second end-faces for the laser cavity. The c-axis of the group III nitride tilts by an angle ALPHA from the normal axis of the primary surface in the waveguide axis direction from the first end-face to the second end-faces. A pad electrode has first to third portions provided on the first to third regions of the semiconductor regions, respectively. An ohmic electrode is in contact with the third region through an opening of the insulating layer. The first portion has a first arm, which extends to the first end-face edge. The third portion is away from the first end-face edge.

    摘要翻译: III族氮化物半导体激光器件包括激光器结构,绝缘层,电极和电介质多层。 激光器结构包括在六方晶III族氮化物半导体支撑基体的半极性主表面上的半导体区域。 电介质多层在激光腔的第一和第二端面上。 III族氮化物的c轴从第一端面到第二端面在波导轴线方向上从主面的法线倾斜角度ALPHA。 焊盘电极具有分别设置在半导体区域的第一至第三区域上的第一至第三部分。 欧姆电极通过绝缘层的开口与第三区域接触。 第一部分具有延伸到第一端面边缘的第一臂。 第三部分远离第一端面边缘。

    III-nitride semiconductor laser device and method for fabricating III-nitride semiconductor laser device
    2.
    发明授权
    III-nitride semiconductor laser device and method for fabricating III-nitride semiconductor laser device 有权
    III族氮化物半导体激光器件及其制造方法

    公开(公告)号:US08953656B2

    公开(公告)日:2015-02-10

    申请号:US13354053

    申请日:2012-01-19

    摘要: A Group III nitride semiconductor laser device includes a laser structure including a support substrate with a semipolar primary surface of a hexagonal Group III nitride semiconductor, and a semiconductor region thereon, and an electrode, provided on the semiconductor region, extending in a direction of a waveguide axis in the laser device. The c-axis of the nitride semiconductor is inclined at an angle ALPHA relative to a normal axis to the semipolar surface toward the waveguide axis direction. The laser structure includes first and second fractured faces intersecting with the waveguide axis. A laser cavity of the laser device includes the first and second fractured faces extending from edges of first and second faces. The first fractured face includes a step provided at an end face of an InGaN layer of the semiconductor region and extending in a direction from one side face to the other of the laser device.

    摘要翻译: III族氮化物半导体激光器件包括激光器结构,其包括具有六方晶III族氮化物半导体的半极性主表面的支撑衬底和其上的半导体区域,以及设置在半导体区域上的电极,沿着 波导轴在激光装置中。 氮化物半导体的c轴相对于朝向波导轴方向的半极性表面的法线轴线以一角度ALPHA倾斜。 激光器结构包括与波导轴相交的第一和第二断裂面。 激光装置的激光腔包括从第一和第二面的边缘延伸的第一和第二断裂面。 第一断裂面包括设置在半导体区域的InGaN层的端面并沿从激光器件的一个侧面到另一个的方向延伸的台阶。

    Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device
    6.
    发明授权
    Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device 有权
    III族氮化物半导体激光器件以及III族氮化物半导体激光器件的制造方法

    公开(公告)号:US08420419B2

    公开(公告)日:2013-04-16

    申请号:US13404310

    申请日:2012-02-24

    IPC分类号: H01L21/00

    摘要: A method of fabricating a III-nitride semiconductor laser device includes: preparing a substrate product, where the substrate product has a laser structure, the laser structure includes a semiconductor region and a substrate of a hexagonal III-nitride semiconductor, the substrate has a semipolar primary surface, and the semiconductor region is formed on the semipolar primary surface; scribing a first surface of the substrate product to form a scribed mark, the scribed mark extending in a direction of an a-axis of the hexagonal III-nitride semiconductor; and after forming the scribed mark, carrying out breakup of the substrate product by press against a second region of the substrate product while supporting a first region of the substrate product but not supporting the second region thereof, to form another substrate product and a laser bar.

    摘要翻译: 一种制造III族氮化物半导体激光器件的方法包括:制备衬底产品,其中衬底产品具有激光结构,激光结构包括半导体区域和六边形III族氮化物半导体的衬底,该衬底具有半极性 主表面,并且半导体区域形成在半极性主表面上; 划定基板产品的第一表面以形成划刻标记,所述划线标记沿所述六边形III族氮化物半导体的a轴方向延伸; 并且在形成划线之后,在支撑基板产品的第一区域但不支撑其第二区域的同时通过压靠基板产品的第二区域将基板产品分解,形成另一基板产品和激光条 。

    Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device
    7.
    发明授权
    Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device 失效
    III族氮化物半导体激光器件以及III族氮化物半导体激光器件的制造方法

    公开(公告)号:US08139619B2

    公开(公告)日:2012-03-20

    申请号:US13209054

    申请日:2011-08-12

    IPC分类号: H01S5/00

    摘要: Provided are a group-III nitride semiconductor laser device with a laser cavity to enable a low threshold current on a semipolar surface of a hexagonal group-III nitride, and a method for fabricating the group-III nitride semiconductor laser device on a stable basis. Notches, e.g., notch 113a and others, are formed at four respective corners of a first surface 13a located on the anode side of a group-III nitride semiconductor laser device 11. The notch 113a or the like is a part of a scribed groove provided for separation of the device 11. The scribed grooves are formed with a laser scriber and the shape of the scribed grooves is adjusted by controlling the laser scriber. For example, a ratio of the depth of the notch 113a or the like to the thickness of the group-III nitride semiconductor laser device 11 is not less than 0.05 and not more than 0.4, a tilt of a side wall surface at an end of the notch 113a is not less than 45° and not more than 85°, and a tilt of a side wall surface at an end of the notch 113b is not less than 10° and not more than 30°.

    摘要翻译: 提供了具有激光腔的III族氮化物半导体激光器件,其能够在六边形III族氮化物的半极性表面上实现低阈值电流,以及稳定地制造III族氮化物半导体激光器件的方法。 在位于III族氮化物半导体激光装置11的阳极侧的第一表面13a的四个相应的角部处形成缺口,例如凹口113a等。凹口113a等是设置在划线槽中的一部分 用于分离设备11.划线槽由激光划线器形成,并且通过控制激光划线机来调节划线槽的形状。 例如,凹口113a的深度等于III族氮化物半导体激光器件11的厚度的比率不小于0.05且不大于0.4,则侧壁表面的端部的倾斜度 凹口113a不小于45°并且不大于85°,并且凹口113b的端部处的侧壁表面的倾斜度不小于10°并且不大于30°。

    Method of fabricating group-III nitride semiconductor laser device
    8.
    发明授权
    Method of fabricating group-III nitride semiconductor laser device 失效
    III族氮化物半导体激光器件的制造方法

    公开(公告)号:US08105857B2

    公开(公告)日:2012-01-31

    申请号:US12837306

    申请日:2010-07-15

    IPC分类号: H01L21/18

    摘要: A method for fabricating a III-nitride semiconductor laser device includes: forming a substrate product having a laser structure; scribing a first surface of the substrate product to form a scribed mark, which extends along a reference line indicative of a direction of the a-axis of the hexagonal III-nitride semiconductor, on the first surface, a scribed mark; mounting the substrate product on a breaking device to support first and second regions of the substrate product by first and second support portions, respectively, of the breaking device; and carrying out breakup of the substrate product by press in alignment with the scribed mark in a third region, without supporting the third region of the substrate product located between the first and second regions, to form another substrate product and a laser bar. First and second end faces of the laser bar form a laser cavity of the III-nitride semiconductor laser device.

    摘要翻译: 一种制造III族氮化物半导体激光器件的方法包括:形成具有激光结构的衬底产品; 划定衬底产品的第一表面以形成刻痕,其沿着表示六边形III族氮化物半导体的a轴的方向的参考线延伸在第一表面上,划线标记; 将所述基板产品安装在断开装置上以分别通过所述断路装置的第一和第二支撑部分支撑所述基板产品的第一和第二区域; 并且在不支撑位于第一和第二区域之间的基板产品的第三区域的情况下,在第三区域中通过压制与基板标记对准地分解基板产品,以形成另一基板产品和激光条。 激光棒的第一和第二端面形成III族氮化物半导体激光器件的激光腔。