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    Polishing liquid for metal and polishing method using the same
    1.
    发明授权
    Polishing liquid for metal and polishing method using the same 有权
    抛光液用于金属和抛光方法使用

    公开(公告)号：US09202709B2

    公开(公告)日：2015-12-01

    申请号：US12399984

    申请日：2009-03-09

    申请人： Takamitsu Tomiga ,  Tomoo Kato ,  Tadashi Inaba ,  Masaru Yoshikawa

    发明人： Takamitsu Tomiga ,  Tomoo Kato ,  Tadashi Inaba ,  Masaru Yoshikawa

    IPC分类号： C09K13/06 ,  H01L21/321 ,  C09G1/02 ,  C09K3/14

    CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1454 ,  C09K3/1463

    摘要： A liquid for polishing a metal is provided that is used for chemically and mechanically polishing a conductor film including copper or a copper alloy in production of a semiconductor device, and a polishing method using the metal-polishing liquid is also provided. The liquid includes: (a) colloidal silica particles having an average primary particle size of from 10 nm to 25 nm and an average secondary particle size of from 50 nm to 70 nm; (b) a metal anticorrosive agent; (c) at least one compound selected from the group consisting of a surfactant and a water-soluble polymer compound; (d) an oxidizing agent; and (e) an organic acid.

    摘要翻译： 提供了一种用于抛光金属的液体，其用于在制造半导体器件时用于化学和机械抛光包括铜或铜合金的导体膜，并且还提供了使用该金属抛光液的抛光方法。 液体包括：（a）平均一次粒径为10nm〜25nm，平均二次粒径为50nm〜70nm的胶态二氧化硅粒子; （b）金属防腐剂; （c）至少一种选自表面活性剂和水溶性高分子化合物的化合物; （d）氧化剂; 和（e）有机酸。

    Metal polishing slurry and chemical mechanical polishing method
    2.
    发明申请
    Metal polishing slurry and chemical mechanical polishing method 审中-公开
    金属抛光浆和化学机械抛光方法

    公开(公告)号：US20100075500A1

    公开(公告)日：2010-03-25

    申请号：US12382461

    申请日：2009-03-17

    申请人： Masaru Yoshikawa ,  Tadashi Inaba ,  Hiroshi Inada ,  Takamitsu Tomiga

    发明人： Masaru Yoshikawa ,  Tadashi Inaba ,  Hiroshi Inada ,  Takamitsu Tomiga

    IPC分类号： H01L21/463 ,  H01L21/465 ,  C09K13/00 ,  C07D249/04 ,  C07D249/08

    CPC分类号： C09G1/02 ,  B24B37/044 ,  H01L21/3212

    摘要： The invention provides a metal polishing slurry containing a compound represented by the general formula (1): (X1)n-L wherein X1 represents a heterocycle containing at least one nitrogen atom, n represents an integer of 2 or more, and L represents a linking group having a valence of 2 or more, provided that X1s whose number is n may be the same or different, an oxidizer and an organic acid; and a method of chemical mechanical polishing using such slurry. The metal polishing slurry and the chemical mechanical polishing method are used in chemical mechanical polishing in the step of manufacturing semiconductor devices and enable a high polishing rate to be achieved while causing minimal dishing in polishing an object (wafer).

    摘要翻译： 本发明提供含有通式（1）表示的化合物：（X1）nL的金属研磨浆料，其中，X1表示含有至少一个氮原子的杂环，n表示2以上的整数，L表示连结基 化合价为2以上，条件是其数为n的X1可以相同或不同，为氧化剂和有机酸; 以及使用这种浆料的化学机械抛光的方法。 在制造半导体器件的步骤中使用金属抛光浆料和化学机械抛光方法进行化学机械抛光，并且能够在抛光物体（晶片）的同时最小化凹陷时实现高抛光速率。

    Metal polishing composition and chemical mechanical polishing method
    4.
    发明授权
    Metal polishing composition and chemical mechanical polishing method 有权
    金属抛光组合物和化学机械抛光方法

    公开(公告)号：US08202445B2

    公开(公告)日：2012-06-19

    申请号：US12404353

    申请日：2009-03-16

    申请人： Sumi Takamiya ,  Tadashi Inaba ,  Atsushi Mizutani ,  Tomoo Kato ,  Toshiyuki Saie

    发明人： Sumi Takamiya ,  Tadashi Inaba ,  Atsushi Mizutani ,  Tomoo Kato ,  Toshiyuki Saie

    IPC分类号： C09K13/06

    CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1409

    摘要： The invention provides a metal polishing composition that is used in chemical mechanical polishing in production of a semiconductor device, and includes an oxidizing agent, an abrasive grain, and at least one compound selected from compounds represented by the following formula (I) and the following formula (II). The invention also provides a chemical mechanical polishing method that uses the metal polishing composition. In formula (I), R1 represents a hydrogen atom or an alkyl group, and Ph represents a phenyl ring. In formula (II), R2 represents a hydrogen atom or an alkyl group, and Ph represents a phenyl ring.

    摘要翻译： 本发明提供一种用于制造半导体器件的化学机械抛光中的金属抛光组合物，包括氧化剂，磨粒和至少一种选自下式（I）表示的化合物和下述式 式（II）。 本发明还提供了使用金属抛光组合物的化学机械抛光方法。 在式（I）中，R 1表示氢原子或烷基，Ph表示苯基。 式（II）中，R 2表示氢原子或烷基，Ph表示苯基。

    Silver halide color photosensitive material
    6.
    发明授权
    Silver halide color photosensitive material 失效
    卤化银色感光材料

    公开(公告)号：US07244551B2

    公开(公告)日：2007-07-17

    申请号：US11315092

    申请日：2005-12-23

    申请人： Junichiro Hosokawa ,  Naoharu Kiyoto ,  Ryoji Nishimura ,  Takashi Hoshimiya ,  Tadashi Inaba

    发明人： Junichiro Hosokawa ,  Naoharu Kiyoto ,  Ryoji Nishimura ,  Takashi Hoshimiya ,  Tadashi Inaba

    IPC分类号： G03C1/46 ,  G03C1/08 ,  G03C7/26 ,  G03C7/32

    CPC分类号： G03C1/46 ,  G03C7/30558 ,  Y10S430/156

    摘要： A silver halide color photosensitive material comprising a support and, superimposed thereon, a blue-sensitive layer unit, a green-sensitive layer unit and a red-sensitive layer unit, each of these light-sensitive layer units composed of at least one silver halide emulsion layer, together with at least one non-sensitive layer, wherein compound (A) is contained in at least one layer in the silver halide color photosensitive material, compound (A) being a compound capable of releasing compound (Ac1) by oxidation coupling reaction with a color developing agent, compound (Ac1) being a heterocyclic compound which when added, is capable of enhancing the sensitivity of the photosensitive material as compared with that exhibited when not added, provided that the heterocyclic ring of the heterocyclic compound has 1 or 2 hetero atoms.

    摘要翻译： 一种卤化银色感光材料，其包含支撑体，并叠加有蓝色感光层单元，感光层单元和红色感光层单元，这些感光层单元由至少一种卤化银 乳剂层，以及至少一个非敏感层，其中化合物（A）包含在卤化银色感光材料中的至少一层中，化合物（A）是能够通过氧化偶合来释放化合物（Ac1）的化合物 与彩色显影剂反应，化合物（Ac1）是杂环化合物，当加入时，与不加入时所显示的相比，能够提高感光材料的敏感性，条件是杂环化合物的杂环具有1或 2个杂原子。

    Silver halide emulsion and chemical sensitization method thereof
    9.
    发明授权
    Silver halide emulsion and chemical sensitization method thereof 失效
    卤化银乳剂及其化学增感方法

    公开(公告)号：US06638705B1

    公开(公告)日：2003-10-28

    申请号：US10208826

    申请日：2002-08-01

    申请人： Hiroyuki Suzuki ,  Masafumi Mizuno ,  Kohzaburoh Yamada ,  Hirotomo Sasaki ,  Tadashi Inaba

    发明人： Hiroyuki Suzuki ,  Masafumi Mizuno ,  Kohzaburoh Yamada ,  Hirotomo Sasaki ,  Tadashi Inaba

    IPC分类号： G03C109

    CPC分类号： G03C1/09 ,  G03C2001/091

    摘要： A silver halide emulsion chemically sensitized by at least one compound having a bond of anionic chalcogenide to gold(I) cation and capable of releasing a gold-chalcogen anion species and a method for chemically sensitizing a silver halide emulsion, comprising adding at least one compound having a bond of anionic chalcogenide to gold(I) cation and capable of releasing a gold-chalcogen anion species are disclosed.

    摘要翻译： 通过至少一种具有阴离子硫族化物键与金（I）阳离子并且能够释放金 - 硫族化合物阴离子物质的化合物和用于对卤化银乳剂进行化学增感的方法化学致敏的卤化银乳剂，包括将至少一种化合物 公开了具有阴离子硫属元素与金（I）阳离子并能释放金 - 硫族元素阴离子物质的键。

    Gas sensor using ionic conductor
    10.
    发明授权
    Gas sensor using ionic conductor 失效
    气体传感器采用离子导体

    公开(公告)号：US5520789A

    公开(公告)日：1996-05-28

    申请号：US364749

    申请日：1994-12-27

    申请人： Hideaki Takahashi ,  Tadashi Inaba ,  Haruyoshi Kondo

    发明人： Hideaki Takahashi ,  Tadashi Inaba ,  Haruyoshi Kondo

    IPC分类号： G01N27/41 ,  G01N27/406 ,  G01N27/407 ,  G01N27/409

    CPC分类号： G01N27/4075

    摘要： A gas sensor using an ionic conductor has a thin-film gas detection portion on an alumina substrate. The gas detection portion comprises a zirconia ionic conductor layer, a pair of platinum electrodes provided with the ionic conductor layer interposed therebetween, and a pair of junction layers positioned between the ionic conductor layer and each electrode and formed in a state in which the substances of the ionic conductor layers and the electrodes are mixed therein.The gas sensor using an ionic conductor is formed by sequentially forming a first electrode, a first junction layer, an ionic conductor layer, a second junction layer, and a second electrode by a physical vapor deposition method on a substrate, wherein the first and second junction layers are formed to be in a state in which the substances of the ionic conductor layers and the electrodes are both present.

    摘要翻译： 使用离子导体的气体传感器在氧化铝基板上具有薄膜气体检测部。 气体检测部分包括氧化锆离子导体层，设置有介于其间的离子导体层的一对铂电极和位于离子导体层与每个电极之间的一对接合层，并且形成在其中物质 离子导体层和电极混合在一起。 使用离子导体的气体传感器通过在基板上通过物理气相沉积法依次形成第一电极，第一接合层，离子导体层，第二接合层和第二电极而形成，其中第一和第二 接合层形成为处于离子导体层和电极的物质都存在的状态。