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    LAMINATE STRUCTURE, ELECTRONIC DEVICE, AND DISPLAY DEVICE
    1.
    发明申请
    LAMINATE STRUCTURE, ELECTRONIC DEVICE, AND DISPLAY DEVICE 有权
    层压结构，电子器件和显示器件

    公开(公告)号：US20100181571A1

    公开(公告)日：2010-07-22

    申请号：US12669290

    申请日：2008-07-15

    申请人： Takanori TANO ,  Atsushi Onodera ,  Koei Suzuki ,  Hidenori Tomono

    发明人： Takanori TANO ,  Atsushi Onodera ,  Koei Suzuki ,  Hidenori Tomono

    IPC分类号： H01L33/16 ,  H01L29/786 ,  B32B3/26 ,  B32B27/34

    CPC分类号： H01L51/0545 ,  H01L51/0022 ,  H01L51/052 ,  H01L51/055 ,  Y10T428/24612

    摘要： A laminate structure is disclosed that has a region having high surface free energy and a region having low surface free energy that are well separated, has high adhesiveness between an underlying layer and a conductive layer, and can be formed easily with low cost. The laminate structure includes a wettability-variable layer including a first surface free energy region of a first film thickness and a second surface free energy region of a second film thickness, and a conductive layer formed on the second surface free energy region of the wettability-variable layer. The second film thickness is less than the first film thickness and the surface free energy of the second surface free energy region is made higher than the surface free energy of the first surface free energy region by applying a predetermined amount of energy on the second surface free energy region.

    摘要翻译： 公开了具有高表面自由能的区域和良好分离的具有低表面自由能的区域，在下层和导电层之间具有高粘合性的层压结构，并且可以容易地以低成本形成。 层叠结构包括可湿性变化层，其包括第一膜厚度的第一表面自由能区域和第二膜厚度的第二表面自由能区域，以及形成在可湿润性层的第二表面自由能区域上的导电层， 可变层。 第二膜厚度小于第一膜厚度，并且通过在第二表面上施加预定量的能量而使第二表面自由能区域的表面自由能高于第一表面自由能区域的表面自由能 能量区。

    METHOD OF FORMING STACKED-LAYER WIRING, STACKED-LAYER WIRING, AND ELECTRONIC ELEMENT
    2.
    发明申请
    METHOD OF FORMING STACKED-LAYER WIRING, STACKED-LAYER WIRING, AND ELECTRONIC ELEMENT 有权
    堆叠层布线方法，堆叠布线和电子元件

    公开(公告)号：US20150008589A1

    公开(公告)日：2015-01-08

    申请号：US14320836

    申请日：2014-07-01

    申请人： Koei SUZUKI ,  Takanori TANO ,  Hiroshi MIURA ,  Atsushi ONODERA

    发明人： Koei SUZUKI ,  Takanori TANO ,  Hiroshi MIURA ,  Atsushi ONODERA

    IPC分类号： H01L23/48 ,  H01L21/768

    CPC分类号： H01L23/481 ,  H01L21/288 ,  H01L21/76802 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76825 ,  H01L21/76837 ,  H01L21/76843 ,  H01L21/76879 ,  H01L27/124 ,  H01L27/1292 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/1208 ,  H05K3/1258 ,  H05K3/4664 ,  H05K2201/0376 ,  H05K2203/107 ,  H05K2203/1173 ,  H01L2924/00

    摘要： A method of forming a stacked-layer wiring includes forming first wettability variable layer on a substrate using material that changes surface energy by energy application; forming first conductive layer in or on the first wettability variable layer; forming second wettability variable layer on the first wettability variable layer using material that changes surface energy by energy application; forming concave portion to become wiring pattern of second conductive layer to the second wettability variable layer while concurrently forming high surface energy area on surface exposed by forming the concave portion by changing surface energy; forming via hole by exposing a part of the first conductive layer while concurrently forming high surface energy area on surface exposed by forming the via hole by changing surface energy; and applying conductive ink to the high surface energy area to form the second conductive layer and via simultaneously.

    摘要翻译： 形成堆叠层布线的方法包括：使用通过能量施加而改变表面能的材料在基板上形成第一润湿性变化层; 在第一润湿性变化层中或上面形成第一导电层; 使用通过能量施加改变表面能的材料在第一润湿性变化层上形成第二润湿性变化层; 形成凹部以成为第二导电层的布线图案到第二可润湿性变化层，同时通过改变表面能而形成凹部而露出的表面上形成高表面能区域; 通过暴露第一导电层的一部分而形成通孔，同时通过通过改变表面能形成通孔而在暴露的表面上形成高表面能区域; 以及将导电油墨施加到高表面能区域以形成第二导电层并同时通过。

    WIRING BOARD AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    WIRING BOARD AND MANUFACTURING METHOD THEREOF 有权
    接线板及其制造方法

    公开(公告)号：US20150008019A1

    公开(公告)日：2015-01-08

    申请号：US14318757

    申请日：2014-06-30

    申请人： Hiroshi MIURA ,  Koei SUZUKI ,  Atsushi ONODERA ,  Takanori TANO

    发明人： Hiroshi MIURA ,  Koei SUZUKI ,  Atsushi ONODERA ,  Takanori TANO

    IPC分类号： H05K1/02 ,  H05K3/12

    CPC分类号： H05K3/1258 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/0026 ,  H05K3/1208 ,  H05K2201/0154 ,  H05K2201/09827 ,  H05K2203/108 ,  H05K2203/1173

    摘要： A wiring board includes a variable wettability layer situated on a top surface of a support board and containing a material of which a critical surface tension changes by energy given thereto. A conductive layer is situated inside a concave portion formed in the variable wettability layer. The concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between the side walls is reduced toward a bottom of the concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of the conductive layer. Upper edges of the side walls are formed in gently curved surfaces.

    摘要翻译： 布线板包括可变润湿层，其位于支撑板的顶表面上，并且包含临界表面张力由施加的能量而改变的材料。 导电层位于形成在可变润湿性层中的凹部内。 凹部具有形成在锥形表面中的相对的侧壁，其倾斜，使得侧壁之间的距离沿着与导电层的导电方向垂直的平面截取的横截面形状朝向凹部的底部减小。 侧壁的上边缘以轻柔的曲面形成。