公开(公告)号：US08401492B2

公开(公告)日：2013-03-19

申请号：US12786677

申请日：2010-05-25

申请人： Takanori Uejima ,  Hisanori Murase ,  Ken Tonegawa

发明人： Takanori Uejima ,  Hisanori Murase ,  Ken Tonegawa

IPC分类号： H04B1/38 ,  H04B1/44 ,  H04B1/28

CPC分类号： H04B1/44

摘要： A high frequency switch module includes a laminated circuit component that includes an antenna electrode connected to a single antenna, a plurality of communication electrodes connected to a plurality of high frequency communication circuits to transmit, receive, or transmit and receive plural kinds of communication signals, and a land arranged to mount a switch IC on, and a switch IC that is mounted on the laminated circuit component and includes a common terminal connected to the single antenna through the laminated circuit component, and a plurality of communication circuit terminals connected to the plurality of high frequency communication circuits through the laminated circuit component. The switch IC is provided with switch circuits between the communication circuit terminals and the common terminal, and all of the switch circuits have the same or substantially the same resistance against transmission power applied at the time of transmission.

摘要翻译： 高频开关模块包括层叠电路部件，其包括连接到单个天线的天线电极，连接到多个高频通信电路以发送，接收或发送和接收多种通信信号的多个通信电极， 以及布置成安装开关IC的区域和安装在层叠电路部件上的开关IC，并且包括通过层叠电路部件连接到单个天线的公共端子，以及多个连接到多个的多个通信电路端子 的高频通信电路通过层叠电路部件。 开关IC在通信电路端子和公共端子之间设置有开关电路，并且所有开关电路具有与发送时施加的发送功率相同或基本上相同的电阻。

公开(公告)号：US08253483B2

公开(公告)日：2012-08-28

申请号：US13314339

申请日：2011-12-08

申请人： Takanori Uejima ,  Hisanori Murase

发明人： Takanori Uejima ,  Hisanori Murase

IPC分类号： H01L25/00

CPC分类号： H04B1/48 ,  H01L2224/16 ,  H04B1/006

摘要： A high-frequency switch module that significantly reduces deterioration of high-frequency characteristics and improves harmonic wave distortion characteristics includes a high-frequency switch and SAW filters mounted on a multilayer substrate. Low pass filters are provided within the multilayer substrate. The terminals of the high-frequency switch are located on the bottom surface of the semiconductor substrate. The high-frequency switch includes a high-frequency circuit ground terminal and a control circuit ground terminal, the multilayer substrate includes therein a ground electrode which is electrically connected to a top surface connection electrode to which the high-frequency circuit ground terminal is connected, and a wiring electrode electrically connected to a top surface connection electrode to which the control circuit ground terminal is connected is arranged so as to be insulated from the ground electrode.

摘要翻译： 高频开关模块，显着降低高频特性的劣化，提高谐波失真特性，包括安装在多层基板上的高频开关和SAW滤波器。 低通滤波器设置在多层基板内。 高频开关的端子位于半导体基板的底面上。 高频开关包括高频电路接地端子和控制电路接地端子，多层基板包括与高频电路接地端子连接的顶面连接电极电连接的接地电极， 电连接到与控制电路接地端子连接的顶面连接电极的布线电极被布置成与接地电极绝缘。

公开(公告)号：US08654542B2

公开(公告)日：2014-02-18

申请号：US13232101

申请日：2011-09-14

申请人： Hisanori Murase ,  Takanori Uejima

发明人： Hisanori Murase ,  Takanori Uejima

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H01P1/15 ,  H01P1/10 ,  H05K1/0227 ,  H05K1/0237 ,  H05K2201/09663 ,  H05K2201/09972

摘要： In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.

摘要翻译： 在高频开关模块中，开关IC安装在多层板上以形成高频开关模块。 多层板包括两个内部布线和两个内部接地电极。 当从多层板的层叠方向观察时，内部接地电极以间隔彼此间隔开。 第一内部布线位于第一内部接地电极的上表面侧，并且与RF布线完全分离，并且第一内部布线包括用于向开关IC供电的电源布线。 第二内部布线位于第二内部接地电极的上表面侧，并且与电源布线完全分离，并且第二内部布线包括RF信号通过其传播的信号布线。

公开(公告)号：US08248144B2

公开(公告)日：2012-08-21

申请号：US13089338

申请日：2011-04-19

申请人： Hisanori Murase ,  Takanori Uejima

发明人： Hisanori Murase ,  Takanori Uejima

IPC分类号： H03L7/06

CPC分类号： H04B1/006

摘要： A high-frequency switch module includes a multi-layer substrate, and a switch circuit mounted on the multi-layer substrate. The multi-layer substrate includes a terminal through which a plurality of high-frequency signals in a plurality of frequency bands are input and output, a plurality of switch terminals, terminals to which control signals to control the switch circuit are supplied, current paths that connect the terminals to the switch circuit, and resistors that are provided on the current paths and have resistance values greater than the resistance values of the current paths. The switch circuit connects the terminal to the switch terminals corresponding to the frequency bands of high-frequency signals input and output through the terminal based on the control signals.

摘要翻译： 高频开关模块包括多层基板和安装在多层基板上的开关电路。 多层基板包括多个频带中的多个高频信号被输入和输出的端子，多个开关端子，供给用于控制开关电路的控制信号的端子，电流通路 将端子连接到开关电路，以及在电流路径上提供的电阻器，其电阻值大于电流路径的电阻值。 开关电路基于控制信号，将端子与通过端子输入和输出的高频信号的频带相对应的开关端子连接。

公开(公告)号：US09084348B2

公开(公告)日：2015-07-14

申请号：US12960581

申请日：2010-12-06

申请人： Hisanori Murase ,  Takanori Uejima

发明人： Hisanori Murase ,  Takanori Uejima

IPC分类号： H05K1/02 ,  H01L21/48 ,  H01L23/00

CPC分类号： H05K1/0228 ,  H01L21/4857 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/48091 ,  H05K1/0243 ,  H05K2201/10053

摘要： A high frequency module includes RF terminal lands at a first layer that is a surface layer of a multilayer substrate on which RF terminal electrodes of a switch IC are mounted that are arranged in a line. Each of the RF terminal lands is electrically connected to one end of a lead electrode at a second layer via a via hole. Some of the lead electrodes extend from corresponding ones of the RF terminal lands in an outward direction away from a side of the switch IC. The remaining ones of the lead electrodes extend from corresponding ones of the RF terminal lands in an inward direction that is opposite to the outward direction.

摘要翻译： 高频模块包括作为多层基板的表面层的第一层的RF端子焊盘，其上安装有开关IC的RF端子电极，其布置成一行。 每个RF端子平台通过通孔与第二层的引线电极的一端电连接。 一些引线电极从远离开关IC的一侧的向外的方向从相应的RF端子区域延伸出来。 剩余的引线电极沿着与向外方向相反的向内方向从相应的RF端子区域延伸。

公开(公告)号：US08558641B2

公开(公告)日：2013-10-15

申请号：US12905275

申请日：2010-10-15

申请人： Hisanori Murase ,  Takanori Uejima

发明人： Hisanori Murase ,  Takanori Uejima

IPC分类号： H01P5/12 ,  H03H7/46 ,  H04B1/38 ,  H03H9/70 ,  H03H9/72

CPC分类号： H01P1/213 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/19105 ,  H03H2001/0085 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/112

摘要： In a high-frequency module, a duplexer element and a matching element are mounted on a surface of a multilayer substrate. On a layer close to the surface, an individual-terminal-side wiring electrode connected to an individual terminal of the duplexer element is provided. On two layers below the layer close to the surface, first and second ground electrodes are respectively provided. On a layer below the layers on which the first and second ground electrodes are provided, a common-terminal-side wiring electrode connected to the common terminal of the duplexer element and one end of the matching element is provided. On a layer close to a bottom surface of the multilayer substrate, a third ground electrode connected to the other end of the matching element is provided.

摘要翻译： 在高频模块中，双面器元件和匹配元件安装在多层基板的表面上。 在靠近表面的层上，设置连接到双工器元件的单个端子的单个端子侧布线电极。 在靠近表面的层下方的两层上分别设置有第一和第二接地电极。 在设置有第一和第二接地电极的层下面的层上，设置连接到双工器元件的公共端子和匹配元件的一端的公共端子侧布线电极。 在靠近多层基板的底面的层上，设置与匹配元件的另一端连接的第三接地电极。

公开(公告)号：US08466733B2

公开(公告)日：2013-06-18

申请号：US12889456

申请日：2010-09-24

申请人： Takanori Uejima ,  Hisanori Murase

发明人： Takanori Uejima ,  Hisanori Murase

IPC分类号： H03K17/00

CPC分类号： H04B1/18 ,  H03H7/0123 ,  H03H7/1766 ,  H03H7/38 ,  H03H7/465 ,  H03H2001/0085 ,  H04B1/0458

摘要： A high-frequency switch module includes a switch IC. An impedance matching circuit is connected to the antenna port of the switch IC. The impedance matching circuit includes a high-pass filter and a low-pass filter. The high-pass filter is disposed on the side of the antenna port, and is a substantially L-shaped circuit including a capacitor and an inductor. The antenna port is connected to the ground by the inductor.

摘要翻译： 高频开关模块包括开关IC。 阻抗匹配电路连接到开关IC的天线端口。 阻抗匹配电路包括高通滤波器和低通滤波器。 高通滤波器设置在天线端口的侧面，并且是包括电容器和电感器的大致L形电路。 天线端口由电感器接地。

公开(公告)号：US08373492B2

公开(公告)日：2013-02-12

申请号：US13547084

申请日：2012-07-12

申请人： Hisanori Murase ,  Takanori Uejima

发明人： Hisanori Murase ,  Takanori Uejima

IPC分类号： H03K17/56

CPC分类号： H04B1/006

摘要： A high-frequency switch module includes a multi-layer substrate, and a switch circuit mounted on the multi-layer substrate. The multi-layer substrate includes a terminal through which a plurality of high-frequency signals in a plurality of frequency bands are input and output, a plurality of switch terminals, terminals to which control signals to control the switch circuit are supplied, current paths that connect the terminals to the switch circuit, and resistors that are provided on the current paths and have resistance values greater than the resistance values of the current paths. The switch circuit connects the terminal to the switch terminals corresponding to the frequency bands of high-frequency signals input and output through the terminal based on the control signals.

摘要翻译： 高频开关模块包括多层基板和安装在多层基板上的开关电路。 多层基板包括多个频带中的多个高频信号被输入和输出的端子，多个开关端子，供给用于控制开关电路的控制信号的端子，电流通路 将端子连接到开关电路，以及在电流路径上提供的电阻器，其电阻值大于电流路径的电阻值。 开关电路基于控制信号，将端子与通过端子输入和输出的高频信号的频带相对应的开关端子连接。