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公开(公告)号：US07368387B2
公开(公告)日：2008-05-06
申请号：US11020545
申请日：2004-12-22
申请人： Takanori Uno , Hiroyasu Sugiyama , Toshiki Owaki
发明人： Takanori Uno , Hiroyasu Sugiyama , Toshiki Owaki
IPC分类号： H01L21/311
CPC分类号： C09K3/1463 , C09G1/02
摘要： A polishing composition includes fumed alumina, alumina other than fumed alumina, colloidal silica, a first organic acid, a second organic acid, an oxidizing agent, and water. When the second organic acid is citric acid, the first organic acid is preferably malic acid, while when the second organic acid is malic acid, the first organic acid is preferably citric acid. When the second organic acid is succinic acid, iminodiacetic acid, itaconic acid, maleic acid, malonic acid, crotonic acid, gluconic acid, glycolic acid, lactic acid, or mandelic acid, the first organic acid is preferably either citric acid or malic acid. The polishing composition can be suitably used for polishing the surface of a substrate for a magnetic disk.
摘要翻译： 抛光组合物包括热解氧化铝，除热解法氧化铝以外的氧化铝，胶体二氧化硅，第一有机酸，第二有机酸，氧化剂和水。 当第二有机酸是柠檬酸时，第一有机酸优选为苹果酸，而当第二有机酸为苹果酸时，第一有机酸优选为柠檬酸。 当第二有机酸是琥珀酸，亚氨基二乙酸，衣康酸，马来酸，丙二酸，巴豆酸，葡糖酸，乙醇酸，乳酸或扁桃酸时，第一有机酸优选是柠檬酸或苹果酸。 抛光组合物可以适用于抛光用于磁盘的基板的表面。
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公开(公告)号：US20050139803A1
公开(公告)日：2005-06-30
申请号：US11020545
申请日：2004-12-22
申请人： Takanori Uno , Hiroyasu Sugiyama , Toshiki Owaki
发明人： Takanori Uno , Hiroyasu Sugiyama , Toshiki Owaki
CPC分类号： C09K3/1463 , C09G1/02
摘要： A polishing composition includes fumed alumina, alumina other than fumed alumina, colloidal silica, a first organic acid, a second organic acid, an oxidizing agent, and water. When the second organic acid is citric acid, the first organic acid is preferably malic acid, while when the second organic acid is malic acid, the first organic acid is preferably citric acid. When the second organic acid is succinic acid, iminodiacetic acid, itaconic acid, maleic acid, malonic acid, crotonic acid, gluconic acid, glycolic acid, lactic acid, or mandelic acid, the first organic acid is preferably either citric acid or malic acid. The polishing composition can be suitably used for polishing the surface of a substrate for a magnetic disk.
摘要翻译： 抛光组合物包括热解氧化铝，除热解法氧化铝以外的氧化铝，胶体二氧化硅，第一有机酸，第二有机酸，氧化剂和水。 当第二有机酸是柠檬酸时，第一有机酸优选为苹果酸，而当第二有机酸为苹果酸时，第一有机酸优选为柠檬酸。 当第二有机酸是琥珀酸，亚氨基二乙酸，衣康酸，马来酸，丙二酸，巴豆酸，葡糖酸，乙醇酸，乳酸或扁桃酸时，第一有机酸优选是柠檬酸或苹果酸。 抛光组合物可以适用于抛光用于磁盘的基板的表面。
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公开(公告)号：US06332831B1
公开(公告)日：2001-12-25
申请号：US09544287
申请日：2000-04-06
申请人： David M. Shemo , W. S. Rader , Toshiki Owaki
发明人： David M. Shemo , W. S. Rader , Toshiki Owaki
IPC分类号： B24B100
CPC分类号： C09K3/1463 , C09G1/02
摘要： A polishing composition for a memory hard disk, which comprises at least the following components (a) to (d): (a) from 0.1 to 50 wt %, based on the total amount of the polishing composition, of at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide, (b) from 0.001 to 10 wt %, based on the total amount of the polishing composition, of at least one periodate selected from the group consisting of periodic acid, potassium periodate, sodium periodate and lithium periodate, (c) a buffer component to adjust the pH of the polishing composition to a range of from 2 to 5, and (d) water.
摘要翻译： 一种用于存储硬盘的抛光组合物，其至少包含以下组分（a）至（d）：（a））：基于抛光组合物的总量为0.1至50重量％的至少一种研磨剂 来自由二氧化硅，氧化铝，氧化铈，氧化锆，氧化钛，氮化硅和二氧化锰组成的组，（b）基于抛光组合物的总量的0.001至10重量％的至少一种 选自高碘酸，高碘酸钾，高碘酸钠和高碘酸锂的高碘酸盐，（c）将抛光组合物的pH调节至2至5的范围的缓冲组分，和（d）水。
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公开(公告)号：US06280490B1
公开(公告)日：2001-08-28
申请号：US09405222
申请日：1999-09-27
申请人： W. Scott Rader , David M. Shemo , Toshiki Owaki
发明人： W. Scott Rader , David M. Shemo , Toshiki Owaki
IPC分类号： C09K314
CPC分类号： C09K3/1463 , G11B5/8404
摘要： A polishing composition for a memory hard disk, which comprises the following components (a) to (d): (a) from 0.1 to 50 wt %, based on the total amount of the polishing composition, of at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide, (b) from 0.001 to 10 wt %, based on the total amount of the polishing composition, of at least one iron salt selected from the group consisting of iron nitrate, iron sulfate, ammonium iron sulfate, iron perchlorate, iron chloride, iron citrate, ammonium iron titrate, iron oxalate, ammonium iron oxalate and an iron chelate complex salt of ethylenediaminetetraacetic acid, (c) from 0.01 to 30 wt %, based on the total amount of the polishing composition, of at least one peroxydisulfate salt selected from the group consisting of ammonium peroxydisulfate, potassium peroxydisulfate and sodium peroxydisulfate, and (d) water.
摘要翻译： 一种用于存储硬盘的抛光组合物，其包含以下组分（a）至（d）：（a））：0.1至50重量％，基于抛光组合物的总量，选自 由二氧化硅，氧化铝，氧化铈，氧化锆，氧化钛，氮化硅和二氧化锰组成的组，（b）基于抛光组合物的总量，0.001至10重量％的至少一种铁盐 选自硝酸铁，硫酸铁，硫酸铁铵，高氯酸铁，氯化铁，柠檬酸铁，滴定铁，草酸铁，草酸铁铵和乙二胺四乙酸的铁螯合络合物，（c）0.01 至少30重量％，基于抛光组合物的总量，选自过氧化二硫酸铵，过二硫酸钾和过氧化二硫酸钠中的至少一种过氧化二硫酸盐，和（d）水。
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公开(公告)号：US6117220A
公开(公告)日：2000-09-12
申请号：US441295
申请日：1999-11-16
申请人： Hitoshi Kodama , Toshiki Owaki , Katsumi Tani , Noritaka Yokomichi , Takashi Tokuue , Norio Fujioka , Tetsuya Sayama
发明人： Hitoshi Kodama , Toshiki Owaki , Katsumi Tani , Noritaka Yokomichi , Takashi Tokuue , Norio Fujioka , Tetsuya Sayama
CPC分类号： C09G1/02 , C09K3/1463
摘要： A polishing composition for a memory hard disc, which comprises the following components (a) to (d):(a) water,(b) at least one compound selected from the group consisting of a polystyrenesulfonic acid, and its salts,(c) a compound selected from the group consisting of an inorganic acid and an organic acid, and their salts, other than component (b), and(d) at least one abrasive selected from the group consisting of aluminum oxide, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide.
摘要翻译： 一种用于记忆硬盘的抛光组合物，其包含以下组分（a）至（d）：（a）水，（b）至少一种选自聚苯乙烯磺酸及其盐的化合物，（c ）选自无机酸和有机酸的化合物及其盐，除了组分（b）和（d）至少一种选自氧化铝，二氧化硅，氧化铈 ，氧化锆，氧化钛，氮化硅和二氧化锰。
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公开(公告)号：US5226955A
公开(公告)日：1993-07-13
申请号：US946908
申请日：1992-09-18
申请人： Toshiki Owaki
发明人： Toshiki Owaki
CPC分类号： C09G1/02
摘要： A polishing composition for memory hard discs used to obtain polished surfaces of a high precision and a high quality with a high stock removal rate. The composition consists of water, alumina polishing agent, and polishing accelerator, and polishes surfaces of alumite, aluminum, and non-electrolytically nickel plated memory hard discs. The polishing accelerator is one kind selected from the group of molybdate of ammonium molybdate, lithium molybdate, sodium molybdate and potassium molybdate, or a kind selected from the group of molybdate and aluminum salt such as aluminum nitrate or aluminum oxalate, or another one kind selected from the group of molybdate and nickel sulfate, nickel nitrate, nickel sulfamate, and nickel acetate. The addition quantity of the substance above is 0.1 to 20%, the weight ratio of the polishing agent is 2 to 30%, and the mean particle diameter is 0.3 to 10 .mu.m.
摘要翻译： 一种用于存储硬盘的抛光组合物，用于以高精度和高质量获得抛光表面，具有高的原料去除率。 该组合物由水，氧化铝抛光剂和抛光促进剂组成，并对耐酸铝，铝和非电解镀镍记忆硬盘的表面进行抛光。 抛光促进剂是选自钼酸铵，钼酸锂，钼酸钠和钼酸钾的钼酸盐或选自钼酸盐和铝盐如硝酸铝或草酸铝的一种或选自另一种的那些 来自钼酸盐和硫酸镍，硝酸镍，氨基磺酸镍和乙酸镍。 上述物质的添加量为0.1〜20％，研磨剂的重量比为2〜30％，平均粒径为0.3〜10μm。
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公开(公告)号：US20050136803A1
公开(公告)日：2005-06-23
申请号：US10980446
申请日：2004-11-03
申请人： Keigo Ohashi , Toshiki Owaki
发明人： Keigo Ohashi , Toshiki Owaki
CPC分类号： G11B5/8404 , C03C19/00
摘要： A polishing composition of the present invention contains silicon dioxide, an acid, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The acid is, for example, hydrochloric acid, phosphoric acid, sulfuric acid, phosphonic acid, nitric acid, phosphinic acid, boric acid, acetic acid, itaconic acid, succinic acid, tartaric acid, citric acid, maleic acid, glycolic acid, malonic acid, methanesulfonic acid, formic acid, malic acid, gluconic acid, alanine, glycin, lactic acid, hydroxyethylidene diphosphonic acid, nitrilotris(methylene phosphonic acid), or phosphonobutane tricarboxylic acid. The pH of the polishing composition is preferably in the range of 0.5 to 6. The polishing composition can be suitably used in applications for polishing a glass substrate.
摘要翻译： 本发明的抛光组合物含有二氧化硅，酸和水。 二氧化硅是例如胶体二氧化硅，热解二氧化硅或沉淀二氧化硅。 酸是例如盐酸，磷酸，硫酸，膦酸，硝酸，次膦酸，硼酸，乙酸，衣康酸，琥珀酸，酒石酸，柠檬酸，马来酸，乙醇酸，丙二酸 酸，甲磺酸，甲酸，苹果酸，葡萄糖酸，丙氨酸，甘氨酸，乳酸，羟基亚乙基二膦酸，次氮基三（亚甲基膦酸）或膦酰基丁烷三羧酸。 抛光组合物的pH优选在0.5至6的范围内。该抛光组合物可适用于玻璃基底的研磨用途。
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公开(公告)号：US20070004323A1
公开(公告)日：2007-01-04
申请号：US11516131
申请日：2006-09-06
申请人： Keigo Ohashi , Toshiki Owaki
发明人： Keigo Ohashi , Toshiki Owaki
CPC分类号： G11B5/8404 , C03C19/00
摘要： A polishing composition of the present invention contains silicon dioxide, an acid, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The acid is, for example, hydrochloric acid, phosphoric acid, sulfuric acid, phosphonic acid, nitric acid, phosphinic acid, boric acid, acetic acid, itaconic acid, succinic acid, tartaric acid, citric acid, maleic acid, glycolic acid, malonic acid, methanesulfonic acid, formic acid, malic acid, gluconic acid, alanine, glycin, lactic acid, hydroxyethylidene diphosphonic acid, nitrilotris(methylene phosphonic acid), or phosphonobutane tricarboxylic acid. The pH of the polishing composition is preferably in the range of 0.5 to 6. The polishing composition can be suitably used in applications for polishing a glass substrate.
摘要翻译： 本发明的抛光组合物含有二氧化硅，酸和水。 二氧化硅是例如胶体二氧化硅，热解二氧化硅或沉淀二氧化硅。 酸是例如盐酸，磷酸，硫酸，膦酸，硝酸，次膦酸，硼酸，乙酸，衣康酸，琥珀酸，酒石酸，柠檬酸，马来酸，乙醇酸，丙二酸 酸，甲磺酸，甲酸，苹果酸，葡萄糖酸，丙氨酸，甘氨酸，乳酸，羟基亚乙基二膦酸，次氮基三（亚甲基膦酸）或膦酰基丁烷三羧酸。 抛光组合物的pH优选在0.5至6的范围内。该抛光组合物可适用于玻璃基底的研磨用途。
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公开(公告)号：US20070004322A1
公开(公告)日：2007-01-04
申请号：US11516000
申请日：2006-09-05
申请人： Keigo Ohashi , Toshiki Owaki
发明人： Keigo Ohashi , Toshiki Owaki
CPC分类号： G11B5/8404 , B24B37/044 , C09G1/02
摘要： A polishing composition contains silicon dioxide, an alkaline compound, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The alkaline compound is, for example, ammonium carbonate, potassium carbonate, sodium carbonate, ammonium hydrogen carbonate, potassium hydrogen carbonate, sodium hydrogen carbonate, ammonium phosphate, potassium phosphate, sodium phosphate, ammonium hydrogen phosphate, potassium hydrogen phosphate, or sodium hydrogen phosphate. The polishing composition can be suitably used in applications for polishing a glass substrate.
摘要翻译： 抛光组合物含有二氧化硅，碱性化合物和水。 二氧化硅是例如胶体二氧化硅，热解二氧化硅或沉淀二氧化硅。 碱性化合物是例如碳酸铵，碳酸钾，碳酸钠，碳酸氢铵，碳酸氢钾，碳酸氢钠，磷酸铵，磷酸钾，磷酸钠，磷酸氢铵，磷酸氢钾或磷酸氢钠 。 抛光组合物可以适用于玻璃基板的研磨用途。
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公开(公告)号：US20050148291A1
公开(公告)日：2005-07-07
申请号：US10996782
申请日：2004-11-24
申请人： Keigo Ohashi , Toshiki Owaki
发明人： Keigo Ohashi , Toshiki Owaki
CPC分类号： G11B5/8404 , B24B37/044 , C09G1/02
摘要： A polishing composition contains silicon dioxide, an alkaline compound, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The alkaline compound is, for example, ammonium carbonate, potassium carbonate, sodium carbonate, ammonium hydrogen carbonate, potassium hydrogen carbonate, sodium hydrogen carbonate, ammonium phosphate, potassium phosphate, sodium phosphate, ammonium hydrogen phosphate, potassium hydrogen phosphate, or sodium hydrogen phosphate. The polishing composition can be suitably used in applications for polishing a glass substrate.
摘要翻译： 抛光组合物含有二氧化硅，碱性化合物和水。 二氧化硅是例如胶体二氧化硅，热解二氧化硅或沉淀二氧化硅。 碱性化合物是例如碳酸铵，碳酸钾，碳酸钠，碳酸氢铵，碳酸氢钾，碳酸氢钠，磷酸铵，磷酸钾，磷酸钠，磷酸氢铵，磷酸氢钾或磷酸氢钠 。 抛光组合物可以适用于玻璃基板的研磨用途。
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