公开(公告)号：US20110193244A1

公开(公告)日：2011-08-11

申请号：US13025783

申请日：2011-02-11

申请人： Takashi MASUKO ,  Keisuke Ookubo ,  Keiichi Hatakeyama ,  Masami Yusa

发明人： Takashi MASUKO ,  Keisuke Ookubo ,  Keiichi Hatakeyama ,  Masami Yusa

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L21/6835 ,  C09J7/10 ,  C09J7/35 ,  C09J2201/36 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2221/68395 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00014

摘要： An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape to be laminated, can reduce a thermal stress such as warpage of a wafer, can simplify a step of manufacturing a semiconductor device, and is excellent in heat resistance and humidity resistance reliance, an adhesive sheet in which the adhesive film and a dicing tape are laminated, as well as a semiconductor device.

摘要翻译： 本发明的目的是提供一种芯片粘附粘合剂膜，其可以在低于超薄晶片的保护带的软化温度或切割胶带的温度下层压在晶片的背面上 可以降低晶片的翘曲等热应力，能够简化半导体装置的制造工序，耐热性和耐湿性依赖性优异，粘贴薄膜和切割胶带的粘合片层叠， 以及半导体器件。