公开(公告)号：US20120101191A1

公开(公告)日：2012-04-26

申请号：US13040079

申请日：2011-03-03

申请人： Tetsuya ENOMOTO ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

发明人： Tetsuya ENOMOTO ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

IPC分类号： C08K3/36 ,  C08L71/12 ,  C08L63/02 ,  B82Y30/00

CPC分类号： H01L23/295 ,  C08G59/42 ,  C08G59/621 ,  C08L63/00 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

摘要： A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

摘要翻译： 用于半导体底部填充的热固性树脂组合物，其包含作为必要成分的热固性树脂，固化剂，助熔剂和两种或更多种不同平均粒度的无机填料，其中无机填料包括具有平均值的无机填料 粒径不大于100nm的平均粒度大于100nm的无机填料。

公开(公告)号：US09431314B2

公开(公告)日：2016-08-30

申请号：US13040079

申请日：2011-03-03

申请人： Tetsuya Enomoto ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

发明人： Tetsuya Enomoto ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

IPC分类号： C08L63/00 ,  H01L21/56 ,  H01L23/29 ,  C08G59/42 ,  C08G59/62

CPC分类号： H01L23/295 ,  C08G59/42 ,  C08G59/621 ,  C08L63/00 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

摘要： A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

摘要翻译： 用于半导体底部填充的热固性树脂组合物，其包含作为必要成分的热固性树脂，固化剂，助熔剂和两种或更多种不同平均粒度的无机填料，其中无机填料包括具有平均值的无机填料 粒径不大于100nm的平均粒度大于100nm的无机填料。

公开(公告)号：US20110241228A1

公开(公告)日：2011-10-06

申请号：US13040034

申请日：2011-03-03

申请人： Tetsuya ENOMOTO ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

发明人： Tetsuya ENOMOTO ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

IPC分类号： H01L23/29 ,  H01L21/56 ,  C08L63/00

CPC分类号： H01L21/563 ,  C08G59/4071 ,  C08G59/42 ,  C08G59/686 ,  C08K5/50 ,  C08L63/00 ,  H01L23/293 ,  H01L23/295 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27312 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/8121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/3512

摘要： An epoxy resin composition for a underfilling of a semiconductor comprising an epoxy resin, an acid anhydride, a curing accelerator and a flux agent as essential components, wherein the curing accelerator is a quaternary phosphonium salt, as well as a semiconductor device and manufacturing method employing the same.

摘要翻译： 作为必要成分的环氧树脂，酸酐，固化促进剂，助熔剂的半导体底填充用环氧树脂组合物，其中固化促进剂为季鏻盐，以及半导体装置及其制造方法 一样。

公开(公告)号：US08003207B2

公开(公告)日：2011-08-23

申请号：US12534241

申请日：2009-08-03

申请人： Keisuke Ookubo ,  Teiichi Inada

发明人： Keisuke Ookubo ,  Teiichi Inada

IPC分类号： H01L21/58 ,  B32B7/10

CPC分类号： H01L24/29 ,  C08G59/18 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/35 ,  C09J133/068 ,  C09J133/14 ,  C09J163/00 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises: a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups; an epoxy resin (B); a phenolic epoxy resin curing agent (C); a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250° C. or more; and a photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.

摘要翻译： 一种粘合片，其具有透光性支撑基材和粘合剂粘合层，并且用于切割工序和半导体元件粘合工序中，其中，所述粘合剂粘合层包括：重均分子量 包括官能团; 环氧树脂（B）; 酚醛环氧树脂固化剂（C）; 光反应性单体（D），其中通过紫外光照射获得的固化物的Tg为250℃以上; 和通过用波长200-450nm的紫外光照射产生碱和自由基的光引发剂（E）。

公开(公告)号：US20100129045A1

公开(公告)日：2010-05-27

申请号：US12522433

申请日：2008-03-13

申请人： Tomoaki Shibata ,  Atsushi Takahashi ,  Keisuke Ookubo ,  Tetsurou Iwakura

发明人： Tomoaki Shibata ,  Atsushi Takahashi ,  Keisuke Ookubo ,  Tetsurou Iwakura

IPC分类号： G02B6/00 ,  C08L63/10 ,  C08F20/32 ,  C08F2/46

CPC分类号： G02B6/1221 ,  C08G59/08 ,  C08G59/621 ,  C08K3/36 ,  C08L61/06 ,  C08L63/00 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/35 ,  C09J7/38 ,  C09J161/06 ,  C09J163/00 ,  C09J163/10 ,  C09J2433/00 ,  C09J2463/00 ,  G02B6/138

摘要： The present invention provides an adhesive composition for an optical waveguide which comprises (a) an epoxy resin, (b) a curing agent and (c) a high molecular compound, in which a total light transmittance and a light transmittance in a wavelength of 700 to 1600 nm in a cured matter of the adhesive composition are 80% or more and in which a transparency is consistent with a heat resistance, an adhesive film for an optical waveguide prepared by forming the above adhesive composition into a film form, an adhesive sheet for an optical waveguide comprising the above adhesive composition and a supporting base material and an optical device produced by using them.

摘要翻译： 本发明提供一种光波导用粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）高分子化合物，其中总的透光率和波长为700的透光率 在粘合剂组合物的固化物中为1600nm，透明度与耐热性一致时为80％以上，通过将上述粘合剂组合物形成为膜状而制备的光波导用粘合膜，粘合片 对于包含上述粘合剂组合物的光波导和支撑基材以及通过使用它们制造的光学装置。

公开(公告)号：US08012580B2

公开(公告)日：2011-09-06

申请号：US12534253

申请日：2009-08-03

申请人： Keisuke Ookubo ,  Teiichi Inada

发明人： Keisuke Ookubo ,  Teiichi Inada

IPC分类号： H01L21/301

CPC分类号： H01L24/29 ,  C08G59/18 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/35 ,  C09J133/068 ,  C09J133/14 ,  C09J163/00 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises: a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups; an epoxy resin (B); a phenolic epoxy resin curing agent (C); a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250° C. or more; and a photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.

摘要翻译： 一种粘合片，其具有透光性支撑基材和粘合剂粘合层，并且用于切割工序和半导体元件粘合工序中，其中，所述粘合剂粘合层包括：重均分子量 包括官能团; 环氧树脂（B）; 酚醛环氧树脂固化剂（C）; 光反应性单体（D），其中通过紫外光照射获得的固化物的Tg为250℃以上; 和通过用波长200-450nm的紫外光照射产生碱和自由基的光引发剂（E）。

公开(公告)号：US07578891B2

公开(公告)日：2009-08-25

申请号：US11596923

申请日：2005-05-17

申请人： Keisuke Ookubo ,  Teiichi Inada

发明人： Keisuke Ookubo ,  Teiichi Inada

IPC分类号： H01L21/58

CPC分类号： H01L24/29 ,  C08G59/18 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/35 ,  C09J133/068 ,  C09J133/14 ,  C09J163/00 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises: a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups; an epoxy resin (B); a phenolic epoxy resin curing agent (C); a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250° C. or more; and a photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.

摘要翻译： 一种粘合片，其具有透光性支撑基材和粘合剂粘合层，并且用于切割工序和半导体元件粘合工序中，其中，所述粘合剂粘合层包括：重均分子量 包括官能团; 环氧树脂（B）; 酚醛环氧树脂固化剂（C）; 光反应性单体（D），其中通过紫外光照射获得的固化物的Tg为250℃以上; 和通过用波长200-450nm的紫外光照射产生碱和自由基的光引发剂（E）。

公开(公告)号：US06369509B1

公开(公告)日：2002-04-09

申请号：US09184949

申请日：1998-11-03

申请人： Keisuke Ookubo ,  Toshiyuki Shima ,  Shinkichi Morimoto

发明人： Keisuke Ookubo ,  Toshiyuki Shima ,  Shinkichi Morimoto

IPC分类号： H01J6136

CPC分类号： H01J61/36 ,  H01J61/0732 ,  H01J61/86

摘要： A short arc lamp in which cylindrical retaining bodies can be easily and reliably attached in upholding parts of the electrodes on a temporary basis and in which also the disadvantages which are caused by an anomalous discharge immediately after starting of lamp operation can be eliminated are achieved in a short arc lamp in which a cathode and an anode opposite one another in an arc tube having side parts on opposite sides, in which the upholding parts of the cathode and anode electrodes are inserted and held in cylindrical retaining bodies, and in which the cylindrical retaining bodies are supported in the shrunken regions of the side tubes by the upholding parts of the electrodes being wound with coil components which border the faces of the cylindrical retaining bodies that face the electrodes, and by the cylindrical retaining bodies being temporarily attached by these coil components. Furthermore, as the coil components, a coil wound which is formed of a flexible foil lead that has been bent in the middle region of the flexible coil lead and wound so that the two ends of the flexible coil lead are located on the side closest to the electrode.

摘要翻译： 一种短弧灯，其中可以临时地将圆柱形保持体容易且可靠地附接在电极的支撑部分中，并且还可以消除由灯操作开始后立即出现的异常放电引起的缺点， 一种短弧灯，其中阴极和阳极在电弧管中彼此相对，在相对侧具有侧部，阴极和阳极电极的支撑部分插入并保持在圆柱形保持体中，其中圆柱形 保持体通过电极的支撑部分被支撑在侧管的缩小区域中，线圈部件与面对电极的圆柱形保持体的面相交，线圈部件与由这些线圈临时附接的圆柱形保持体 组件。 此外，作为线圈部件，由柔性箔引线形成的卷绕在柔性线圈的中间区域中的弯曲的线圈引出并缠绕，使得柔性线圈引线的两端位于最接近 电极。

公开(公告)号：US20120048332A1

公开(公告)日：2012-03-01

申请号：US13217666

申请日：2011-08-25

申请人： Shigenori Shimizu ,  Hiroyuki Izawa ,  Keisuke Ookubo ,  Shigeaki Funyu ,  Yutaka Okada ,  Keiko Funyu ,  Naotaka Tanaka

发明人： Shigenori Shimizu ,  Hiroyuki Izawa ,  Keisuke Ookubo ,  Shigeaki Funyu ,  Yutaka Okada ,  Keiko Funyu ,  Naotaka Tanaka

IPC分类号： H01L31/05 ,  H01L31/18 ,  C09J133/00 ,  C09J163/02 ,  C09J171/10

CPC分类号： C08L7/00 ,  C08L33/00 ,  C08L71/12 ,  C09J163/00 ,  H01L31/022425 ,  H01L31/0504 ,  Y02E10/50

摘要： There are provided an adhesive film for a solar cell electrode providing a solar cell capable of reducing adverse effects on photovoltaic cells caused by heating or pressure and having sufficient solar cell characteristics, and a method for manufacturing a solar cell module using the same. The adhesive film for a solar cell electrode is an adhesive film used for electrical connection between photovoltaic cell surface electrodes and wiring members, wherein the adhesive film contains a crystalline epoxy resin, a curing agent and a film forming material.

摘要翻译： 提供了一种用于太阳能电池电极的粘合膜，其提供能够减少由加热或压力引起的并且具有足够的太阳能电池特性的对光伏电池的不利影响的太阳能电池，以及使用该太阳能电池的太阳能电池模块的制造方法。 用于太阳能电池电极的粘合膜是用于光伏电池表面电极和布线构件之间的电连接的粘合膜，其中粘合剂膜含有结晶环氧树脂，固化剂和成膜材料。

公开(公告)号：US20110281399A1

公开(公告)日：2011-11-17

申请号：US13194633

申请日：2011-07-29

申请人： Keisuke OOKUBO ,  Teiichi Inada

发明人： Keisuke OOKUBO ,  Teiichi Inada

IPC分类号： H01L21/58

CPC分类号： H01L24/29 ,  C08G59/18 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/35 ,  C09J133/068 ,  C09J133/14 ,  C09J163/00 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises: a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups; an epoxy resin (B); a phenolic epoxy resin curing agent (C); a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250° C. or more; and a photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.

摘要翻译： 一种粘合片，其具有透光性支撑基材和粘合剂粘合层，并且用于切割工序和半导体元件粘合工序中，其中，所述粘合剂粘合层包括：重均分子量 包括官能团; 环氧树脂（B）; 酚醛环氧树脂固化剂（C）; 光反应性单体（D），其中通过紫外光照射获得的固化物的Tg为250℃以上; 和通过用波长200-450nm的紫外光照射产生碱和自由基的光引发剂（E）。