摘要:
A semiconductor device is provided having a high performance resistance element. In an N-type well isolated by an insulating film, two higher concentration N-type regions are formed. An interlayer insulating film is also formed. In a plurality of openings in the interlayer insulating film, one electrode group having a plurality of electrodes is formed on one N-type region, while a second electrode group having a plurality of electrodes is formed on the other N-type region. The relationship between the two N-type regions is between an island region and an annular region surrounding the island. The annular region of the N-type well between the island region and the annular region serves as a resistor R. Thus, discharge channels for charges applied excessively because of ESD or the like evenly exist in the periphery (four regions) of the one N-type region.
摘要:
A semiconductor device, including an electrostatic discharge protection circuit capable of preventing current from being concentrated in a hot spot through a silicide layer, includes an N-type MOS transistor having a first diffusion region on a semiconductor substrate. This N-type MOS transistor is isolated from another MOS transistor by a first element isolation region. A second diffusion region is formed between the first diffusion region and first element isolation region. The first and second diffusion regions are separated by a second element isolation region. A silicide is formed on the surface of the semiconductor substrate excluding the first and second element isolation regions. A pad is connected to the second N-type diffusion region through a contact. An electrostatic charge injection through the pad and contact is discharged mainly through a first discharge path guided to a channel (P-type well) of the N-type MOS transistor through the second diffusion region (N-type), N-type well under the second element isolation region, and second diffusion region (N-type). A discharge path passing through the silicide layer rarely functions as a discharge path, since the contact resistance value between the silicide layer and first diffusion region is greater than the resistance value of the first diffusion region.
摘要:
A semiconductor device is provided having a high performance resistance element. In an N-type well isolated by an insulating film, two higher concentration N-type regions are formed. An interlayer insulating film is also formed. In a plurality of openings in the interlayer insulating film, one electrode group having a plurality of electrodes is formed on one N-type region, while a second electrode group having a plurality of electrodes is formed on the other N-type region. The relationship between the two N-type regions is between an island region and an annular region surrounding the island. The annular region of the N-type well between the island region and the annular region serves as a resistor R. Thus, discharge channels for charges applied excessively because of ESD or the like evenly exist in the periphery (four regions) of the one N-type region.
摘要:
The invention provides semiconductor devices having an output circuit in which transistors do not fail to achieve their original capability, and electrostatic breakdown is difficult to occur. A semiconductor device is equipped with a semiconductor substrate, an element isolation region formed on the semiconductor substrate, a first impurity diffusion region that is formed in the semiconductor substrate and surrounds the element isolation region, a second impurity diffusion region that is formed in the semiconductor substrate, a first wiring electrode and a second wiring electrode that are electrically connected to the first impurity diffusion region on both sides of the element isolation region, an output terminal that outputs signals to outside, a wiring that electrically connects the first wiring electrode and the second wiring electrode to the output terminal, and a third wiring electrode and a fourth wiring electrode that are electrically connected to the second impurity diffusion region corresponding to the first and second wiring electrodes.
摘要:
A semiconductor device is provided having a high performance resistance element. In an N-type well isolated by an insulating film, two higher concentration N-type regions are formed. An interlayer insulating film is also formed. In a plurality of openings in the interlayer insulating film, one electrode group having a plurality of electrodes is formed on one N-type region, while a second electrode group having a plurality of electrodes is formed on the other N-type region. The relationship between the two N-type regions is between an island region and an annular region surrounding the island. The annular region of the N-type well between the island region and the annular region serves as a resistor R. Thus, discharge channels for charges applied excessively because of ESD or the like evenly exist in the periphery (four regions) of the one N-type region.
摘要:
The invention makes it possible to form thyristers and SCRs that show a good discharge efficiency upon application of static electricity in semiconductor devices using a SOI substrate. A semiconductor device is equipped with a connection terminal for connection with an external element, a dielectric substrate having a semiconductor layer formed therein, a first region of a first conductive type that is formed in the semiconductor layer and electrically connected to the connection terminal, a second region of a second conductive type that is formed in the semiconductor layer and electrically connected to the first region, a third region of the first conductive type that is formed adjacent to the second region in the semiconductor layer, and a fourth region of the second conductive type that is formed adjacent to the third region in the semiconductor layer.
摘要:
A semiconductor device including an electrostatic protection circuit capable of preventing current from being concentrated in a hot spot through a silicide layer. A plurality of salicide N-type MOS transistors isolated by a first diffusion region are formed on a semiconductor substrate of this semiconductor device. An NPN lateral bipolar transistor and a Zener diode are formed as an electrostatic protection circuit for these MOS transistors. The NPN lateral bipolar transistor includes a P-type well and a second diffusion region which is formed in a region isolated by two second isolation regions. The Zener diode is formed by the PN junction between the first diffusion region of the MOS transistor and a third diffusion region. The breakdown start voltage of the Zener diode is set to be lower than the breakdown start voltage of the MOS transistor. A fourth diffusion region which makes up a Schottky diode together with the silicide layer is further provided between the silicide layer and the third diffusion region.
摘要:
An integrated circuit device includes a pad PDx and an electrostatic discharge protection element ESDx formed in a rectangular region and electrically connected with the pad PDx. The pad PDx is disposed in an upper layer of the electrostatic discharge protection element ESDx so that an arrangement direction of the pads is parallel to a long side direction of the region in which the electrostatic discharge protection element ESDx is formed, and the pad PDx overlaps part or the entirety of the electrostatic discharge protection element ESDx.
摘要:
An integrated circuit device includes at least one data driver block for driving data lines, a plurality of control transistors TC1 and TC2, each of the control transistors being provided corresponding to each output line of the data driver block and controlled by using a common control signal, and a pad arrangement region in which data driver pads P1 and P2 for electrically connecting the data lines and the output lines QL1 and QL2 of the data driver block are disposed. The control transistors TC1 and TC2 are disposed in the pad arrangement region.
摘要:
An integrated circuit device includes a first circuit block that includes low-voltage transistors (LVTr) and operates using a first high-potential power supply voltage and a first low-potential power supply voltage, a second circuit block that includes low-voltage transistors (LVTr) and operates using a second high-potential power supply voltage and a second low-potential power supply voltage that differ in power supply system from the first circuit block, and an interface circuit (I/O buffer) provided between the first circuit block and the second circuit block. The interface circuit (I/O buffer) includes medium-voltage transistors (MVTr: transistors of which the thickness of the gate insulating film is larger than that of the low-voltage transistors (LVTr)). An electrostatic discharge protection circuit formed of bidirectional diodes is provided between a first and second low-potential power supply nodes.