公开(公告)号：US08985175B2

公开(公告)日：2015-03-24

申请号：US12811177

申请日：2008-09-29

申请人： Masato Kinouchi ,  Takayuki Goto ,  Satoshi Tawara ,  Takeshi Tsuno ,  Jun Utsumi ,  Kensuke Ide ,  Takenori Suzuki

发明人： Masato Kinouchi ,  Takayuki Goto ,  Satoshi Tawara ,  Takeshi Tsuno ,  Jun Utsumi ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B32B37/10 ,  B23K20/02

CPC分类号： B32B37/1009 ,  B23K20/02 ,  B32B37/10 ,  B32B2309/68 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/67253

摘要： A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.

摘要翻译： 室温粘合机设置有排气装置，气体供给装置，压力计，清洁装置，压力控制器和按压机构。 抽空装置从室抽出气体。 气体供给装置将引入气体供给到室内。 压力表测量室内的压力。 当所述压力处于预定的真空度时，清洁器装置清洗腔室中的第一和第二基板。 压力控制器控制排气装置和气体供给装置，使得压力被调节到目标压力。 当压力设定为所述目标压力时，按压机构按压并结合第一和​​第二基板。

公开(公告)号：US20120031557A1

公开(公告)日：2012-02-09

申请号：US13260041

申请日：2010-10-27

申请人： Masato Kinouchi ,  Takayuki Goto ,  Takeshi Tsuno ,  Kensuke Ide ,  Takenori Suzuki

发明人： Masato Kinouchi ,  Takayuki Goto ,  Takeshi Tsuno ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B29C70/68 ,  B65C9/40

CPC分类号： H01L21/67092 ,  B81C1/00357 ,  B81C99/0025

摘要： A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

摘要翻译： 本发明的多层接合方法包括：通过在接合室中接合第一基板和中间基板来形成第一接合基板; 当所述第一键合衬底布置在所述接合室内时，在所述接合室内传送第二衬底; 以及通过在所述接合室中接合所述第一键合衬底和所述第二衬底来形成第二接合衬底。 根据这样的多层接合方法，可以将上侧基板与中间基板接合，然后将第一接合基板与下侧基板接合，而不从接合室取出第一接合基板。 为此，可以高速且低成本地制造第二粘结衬底。

公开(公告)号：US09023170B2

公开(公告)日：2015-05-05

申请号：US13260041

申请日：2010-10-27

申请人： Masato Kinouchi ,  Takayuki Goto ,  Takeshi Tsuno ,  Kensuke Ide ,  Takenori Suzuki

发明人： Masato Kinouchi ,  Takayuki Goto ,  Takeshi Tsuno ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B29C70/68 ,  H01L21/67 ,  B81C1/00 ,  B81C99/00

摘要： A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

公开(公告)号：US09130000B2

公开(公告)日：2015-09-08

申请号：US13121584

申请日：2009-02-19

申请人： Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Kensuke Ide ,  Takenori Suzuki

发明人： Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： H01L21/30 ,  H01L21/67 ,  B29C65/78 ,  H01L21/683 ,  B23K17/00 ,  B23K37/04 ,  B23K37/047 ,  H01L21/18

CPC分类号： H01L21/67092 ,  B23K17/00 ,  B23K37/0408 ,  B23K37/047 ,  B23K2101/40 ,  B29C65/7897 ,  H01L21/187 ,  H01L21/6833

摘要： A wafer bonding method includes: holding a first substrate with an upper holding mechanism 7 by applying a voltage to the upper holding mechanism 7; generating a bonded substrate by bonding the first substrate and a second substrate held with a lower holding mechanism 8; and dechucking the bonded substrate from the upper holding mechanism 7 after a voltage which attenuates while alternating is applied to the upper holding mechanism 7. By applying the voltage which attenuates while alternating to the upper holding mechanism 7, residual attracting force between the bonded substrate and the upper holding mechanism 7 is reduced, thereby enabling the bonded substrate to be dechucked from the holding mechanism more surely in a shorter time period. As a result, the first substrate and the second substrate can be bonded in a shorter time period.

摘要翻译： 晶片接合方法包括：通过向上保持机构7施加电压来保持具有上保持机构7的第一基板; 通过接合第一基板和保持有下保持机构8的第二基板来产生键合基板; 并且在交替施加到上保持机构7上的电压被衰减的电压之后从上保持机构7脱扣。通过施加与上保持机构7交替的衰减的电压，键合衬底与接合衬底之间的残留吸引力 上部保持机构7减少，从而能够在更短的时间内更可靠地使接合基板从保持机构拔出。 结果，第一基板和第二基板可以在更短的时间内粘合。

公开(公告)号：US09005390B2

公开(公告)日：2015-04-14

申请号：US13530714

申请日：2012-06-22

申请人： Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Satoshi Tawara ,  Jun Utsumi ,  Yoichiro Tsumura ,  Kensuke Ide ,  Takenori Suzuki

发明人： Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Satoshi Tawara ,  Jun Utsumi ,  Yoichiro Tsumura ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B29C65/00 ,  B32B37/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/673 ,  H01L21/68 ,  H01L21/683

CPC分类号： H01L21/67778 ,  H01L21/67092 ,  H01L21/6732 ,  H01L21/67748 ,  H01L21/68 ,  H01L21/683 ,  Y10T156/1744

摘要： A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.

摘要翻译： 室温接合装置包括角度调节装置，支撑保持第一基板的第一样品台，以便能够改变第一样品台的方向; 第一驱动装置，其沿第一方向驱动第一级; 第二驱动装置，驱动在不与第一方向平行的第二方向上保持第二基板的第二样品台; 以及当所述第二基板和所述第一基板接触时，在所述第一方向上支撑所述第二样品台的托架支撑台。 该装置可以施加超过第二驱动装置的耐受负载的负载在第一和第二基板上。 此外，该装置使用角度调节装置来改变与第二基板平行的第一基板的方向，并将较大的负载均匀地施加在接合表面上。

公开(公告)号：US09443711B2

公开(公告)日：2016-09-13

申请号：US14345984

申请日：2012-02-24

申请人： Masato Kinouchi ,  Takayuki Goto ,  Takeshi Tsuno ,  Kensuke Ide ,  Takenori Suzuki

发明人： Masato Kinouchi ,  Takayuki Goto ,  Takeshi Tsuno ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01L21/02 ,  H01L21/67011 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/6831

摘要： A room-temperature bonding apparatus of the present invention includes: a plurality of first beam sources configured to emit a plurality of first activation beams which are irradiated to a first activation surface of a first substrate; a plurality of second beam sources configured to emit a plurality of second activation beams which are irradiated to a second activation surface of a second substrate; and a pressure welding mechanism configured to bond the first substrate and the second substrate by bring the first activation surface and the second activation surface contact, after the first activation surface and the second activation surface are irradiated. The room-temperature bonding apparatus can more uniformly irradiate to the first activation surface and the second activation surface, so that the first substrate and the second substrate can be more appropriately bonded with each other, compared with another room-temperature bonding apparatus which irradiates the first activation surface and the second activation surface by using one beam source.

摘要翻译： 本发明的室温接合装置包括：多个第一光束源，被配置为发射照射到第一基板的第一激活表面的多个第一激活光束; 多个第二光束源，被配置为发射多个第二激活光束，其被照射到第二基板的第二激活表面; 以及压力焊接机构，其被配置为在所述第一激活表面和所述第二激活表面被照射之后使所述第一激活表面和所述第二激活表面接触来接合所述第一基板和所述第二基板。 与另外的室温接合装置相比，室温接合装置能够更均匀地照射到第一活化面和第二活化面，使得第一基板和第二基板能够更适当地接合 第一激活表面和第二激活表面。

公开(公告)号：US08906175B2

公开(公告)日：2014-12-09

申请号：US13139085

申请日：2009-09-29

申请人： Masato Kinouchi ,  Takayuki Goto ,  Satoshi Tawara ,  Takeshi Tsuno ,  Jun Utsumi ,  Kensuke Ide ,  Takenori Suzuki

发明人： Masato Kinouchi ,  Takayuki Goto ,  Satoshi Tawara ,  Takeshi Tsuno ,  Jun Utsumi ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B29C65/00 ,  B31B1/60 ,  B32B37/00 ,  H01L21/67 ,  H01L21/683 ,  B23K20/02

CPC分类号： H01L21/6838 ,  B23K20/02 ,  B23K2101/40 ,  H01L21/67201 ,  Y10T156/10 ,  Y10T156/17

摘要： A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.

摘要翻译： 根据本发明的室温接合装置设置有具有减压的内部空间的负载锁定室; 以及设置在负载锁定室中的盒。 所述盒包括当所述基板被放置在所述盒上时形成为接触基板的岛部。 当基板被放置在盒上时，形成用于岛部分的流动通道，以将盒和基板之间的空间连接到外部。 因此，室温接合装置可以防止当内部空间减压时由于气体使基板移动到墨盒。

公开(公告)号：US20120247645A1

公开(公告)日：2012-10-04

申请号：US13504356

申请日：2010-11-30

申请人： Keiichiro Tsutsumi ,  Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Takenori Suzuki ,  Kensuke Ide

发明人： Keiichiro Tsutsumi ,  Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Takenori Suzuki ,  Kensuke Ide

IPC分类号： B32B41/00 ,  B32B37/08 ,  B32B37/06

CPC分类号： H01L21/67092 ,  H01L21/187

摘要： The present invention includes an activating step S2 of activating, by irradiating a first substrate surface of a first substrate and a second substrate surface of a second substrate with particles, the second substrate surface and the first substrate surface, and a bonding step S4 of bonding the second substrate and the first substrate together by bringing the second substrate surface and the first substrate surface into contact with each other after a temperature difference between a temperature of the first substrate and a temperature of the second substrate becomes equal to or lower than a predetermined value. According to this bonding method, warpage occurring in a bonded substrate obtained can be further reduced compared with other bonding methods of bonding both substrates before the temperature difference between the temperature of the first substrate and the temperature of the second substrate becomes equal to or lower than a predetermined value.

摘要翻译： 本发明包括激活步骤S2，通过用第二基板表面和第一基板表面照射第一基板的第一基板表面和第二基板的第二基板表面，以及接合步骤S4 第二基板和第一基板通过使第二基板表面和第一基板表面在第一基板的温度和第二基板的温度之间的温度差等于或低于预定的温度之间彼此接触而一起 值。 根据该接合方法，与在第一基板的温度和第二基板的温度之间的温度差变为等于或低于第一基板的温度差之前的两个基板的其他接合方法相比，获得的接合基板的翘曲可以进一步降低 预定值。

公开(公告)号：US09064910B2

公开(公告)日：2015-06-23

申请号：US13260041

申请日：2010-10-27

申请人： Masato Kinouchi ,  Takayuki Goto ,  Takeshi Tsuno ,  Kensuke Ide ,  Takenori Suzuki

发明人： Masato Kinouchi ,  Takayuki Goto ,  Takeshi Tsuno ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B29C70/68 ,  H01L21/67 ,  B81C1/00 ,  B81C99/00

CPC分类号： H01L21/67092 ,  B81C1/00357 ,  B81C99/0025

摘要： A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

摘要翻译： 本发明的多层接合方法包括：通过在接合室中接合第一基板和中间基板来形成第一接合基板; 当所述第一键合衬底布置在所述接合室内时，在所述接合室内传送第二衬底; 以及通过在所述接合室中接合所述第一键合衬底和所述第二衬底来形成第二接合衬底。 根据这样的多层接合方法，可以将上侧基板与中间基板接合，然后将第一接合基板与下侧基板接合，而不从接合室取出第一接合基板。 为此，可以高速且低成本地制造第二粘结衬底。

公开(公告)号：US08857487B2

公开(公告)日：2014-10-14

申请号：US12919997

申请日：2008-03-11

申请人： Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Satoshi Tawara ,  Jun Utsumi ,  Yoichiro Tsumura ,  Kensuke Ide ,  Takenori Suzuki

发明人： Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Satoshi Tawara ,  Jun Utsumi ,  Yoichiro Tsumura ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B29C65/00 ,  B32B37/00 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/67778 ,  H01L21/67092 ,  H01L21/6732 ,  H01L21/67748 ,  H01L21/68 ,  H01L21/683 ,  Y10T156/1744

摘要： A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate. Further, the room temperature bonding apparatus can use the angle adjustment mechanism to change a direction of the first substrate such that the first substrate and the second substrate come into parallel contact with each other, and uniformly impose the larger load on a bonding surface.

摘要翻译： 室温接合装置包括：角度调节机构，其将保持第一基板的第一样品台支撑到第一阶段，以便能够改变第一样品台的方向; 第一驱动装置，其以第一方向驱动第一级; 第二驱动装置，其驱动在不与第一方向平行的第二方向上保持第二基板的第二样品台; 以及当第二基板和第一基板彼此压接时支撑第一方向上的第二样品台的托架支撑台。 在这种情况下，室温接合装置可以在第一基板和第二基板上施加超过第二驱动装置的承受负荷的较大载荷。 此外，室温接合装置可以使用角度调节机构来改变第一基板的方向，使得第一基板和第二基板彼此平行接触，并且在接合表面上均匀地施加较大的负载。