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公开(公告)号：US20090134840A1
公开(公告)日：2009-05-28
申请号：US12273244
申请日：2008-11-18
IPC分类号： H02J7/00
CPC分类号： H02J7/0026
摘要： The present invention, by connecting an operational amplifier to a midpoint between a plurality of serially connected battery cells constituting the secondary battery, provides a charging circuit for a secondary battery, which is capable of inhibiting a charge/discharge current from flowing to the midpoint and an input/output current from flowing from the midpoint to each battery cell. The charging circuit has disposed therein excess voltage detectors 4 to 6 for detecting whether the voltage of each of the three lithium ion battery cells 1 to 3, by which a battery is constituted, is an excess voltage, and a charging controller 7 for determining an overcharge state of each battery cell on the basis of the voltages detected by the excess voltage detectors 4 to 6 and then controlling ON/OFF of a charging switch part 8. Voltage followers 101, 102 constituted by an operational amplifier, NPN transistor, and the like are connected to the midpoint between the battery cell 1 and the battery cell 2 and the midpoint between the battery cell 2 and the battery cell 3, respectively. The outputs of the voltage followers 101, 102 are configured as the grounds of the excess voltage detectors 5, 6, respectively.
摘要翻译： 本发明通过将运算放大器连接到构成二次电池的多个串联连接的电池单体之间的中点，提供能够抑制充电/放电电流流向中点的二次电池充电电路，以及 从中点流向每个电池单元的输入/输出电流。 充电电路设置有过电压检测器4〜6，用于检测构成电池的三个锂离子电池单元1〜3中的每一个的电压是否为过电压;以及充电控制器7，用于确定 基于由过电压检测器4〜6检测到的电压，然后控制充电开关部8的接通/断开，对每个电池单元进行过充电状态。由运算放大器NPN晶体管构成的电压跟随器101,102 分别连接到电池单元1和电池单元2之间的中点以及电池单元2和电池单元3之间的中点。 电压跟随器101,102的输出分别被配置为过电压检测器5,6的接地。
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公开(公告)号：US08159187B2
公开(公告)日：2012-04-17
申请号：US12273244
申请日：2008-11-18
IPC分类号： H02J7/00
CPC分类号： H02J7/0026
摘要： An operational amplifier connects to a midpoint between a plurality of serially connected battery cells constituting a secondary battery to provide a charging circuit for inhibiting a charge/discharge current from flowin to the midpoint and an input/output current from flowing from the midpoint to each battery cell. The charging circuit includes excess voltage detectors for detecting whether the voltage is an excess voltage, and a charging controller for determining an overcharge state of each battery cell on the basis of the voltages detected and controlling an ON/OFF of a charging switch. Voltage followers include an operational amplifier, NPN transistor, and the like, connected to a midpoint between a first battery cell and a second battery cell and a midpoint between the second battery cell and the third battery, respectively. The outputs of the voltage followers are configured as the grounds of the excess voltage detectors, respectively.
摘要翻译： 运算放大器连接到构成二次电池的多个串联连接的电池单元之间的中点，以提供用于抑制从流到中点的充电/放电电流的充电电路以及从中点流向每个电池的输入/输出电流 细胞。 充电电路包括用于检测电压是否为过电压的过电压检测器，以及用于根据检测到的电压确定每个电池单元的过充电状态并控制充电开关的接通/断开的充电控制器。 电压跟随器分别连接到第一电池单元和第二电池单元之间的中点以及第二电池单元和第三电池之间的中点的运算放大器，NPN晶体管等。 电压跟随器的输出分别被配置为过电压检测器的接地。
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3.发明授权Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body 有权包括使用密封树脂形成密封体的半导体器件的制造方法公开(公告)号：US07282396B2
公开(公告)日：2007-10-16
申请号：US10983706
申请日：2004-11-09
CPC分类号： H01L23/562 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L21/67144 , H01L21/6715 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/49503 , H01L23/4952 , H01L23/49524 , H01L23/49548 , H01L23/544 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2223/54486 , H01L2224/05554 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/157 , H01L2924/181 , H01L2924/3025 , H01L2924/3512 , H01L2924/3701 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).
摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。
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公开(公告)号：US20100085022A1
公开(公告)日：2010-04-08
申请号：US12588080
申请日：2009-10-02
申请人： Yoshiharu Shimizu , Hitoshi Suzuki
发明人： Yoshiharu Shimizu , Hitoshi Suzuki
IPC分类号： H02J7/04
CPC分类号： H02J7/0004 , H02J7/085 , H02J7/087 , H02J2007/0049
摘要： A charging apparatus includes: a charging voltage output unit; a duty ratio setting unit; a PWM signal output unit; a reference voltage generation unit; a reference voltage limit unit; a detected voltage generation unit; and a charging voltage control unit. The reference voltage generation unit generates a reference voltage for determining whether or not a charging voltage has reached a target charging voltage, by smoothing a PWM signal outputted from the PWM signal output unit. The reference voltage limit unit limits at least one of a maximum value and a minimum value of the reference voltage generated by the reference voltage generation unit.
摘要翻译： 充电装置包括：充电电压输出单元; 占空比设定单元; PWM信号输出单元; 参考电压产生单元; 参考电压限制单元; 检测电压产生单元; 和充电电压控制单元。 参考电压产生单元通过平滑从PWM信号输出单元输出的PWM信号，产生用于确定充电电压是否已达到目标充电电压的参考电压。 参考电压限制单元限制由参考电压产生单元产生的参考电压的最大值和最小值中的至少一个。
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公开(公告)号：US20050116327A1
公开(公告)日：2005-06-02
申请号：US10983706
申请日：2004-11-09
IPC分类号： H01L23/50 , H01L21/44 , H01L21/48 , H01L21/56 , H01L23/02 , H01L23/28 , H01L23/31 , H01L23/48 , H01L23/495 , H01L23/52 , H01L29/40
CPC分类号： H01L23/562 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L21/67144 , H01L21/6715 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/49503 , H01L23/4952 , H01L23/49524 , H01L23/49548 , H01L23/544 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2223/54486 , H01L2224/05554 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/157 , H01L2924/181 , H01L2924/3025 , H01L2924/3512 , H01L2924/3701 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).
摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。
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公开(公告)号：US5912546A
公开(公告)日：1999-06-15
申请号：US972196
申请日：1997-11-18
CPC分类号： H02J7/0091 , H02J7/0031 , H02J7/0042
摘要： A protection arrangement for a battery charger of the type used to charge battery packs used for electromotive tools. A self-holding protector is arranged in the neighborhood of an inserting hole of the battery charger for receiving a storage battery pack 50 to be charged. This self-holding protector element includes two elements electrically connected in parallel. One of these two elements is a bimetal which opens when it heats or flows too much current. The other of the two elements is a positive characteristic thermistor (PCT) which generates heat when a current flows through it. When a battery pack being charged becomes over-charged and heats, the bimetal element of the protector opens, and charging current stops flowing. When the bimetal element opens, electric current flows through the PCT. This current causes the PCT to heat and maintain the bimetal element in its open condition. When the battery pack being charged short-circuits, and a large current flows through it, the bimetal element opens and charging current is interrupted in the same way.
摘要翻译： 用于对用于电动工具的电池组充电的电池充电器的保护装置。 在电池充电器的插入孔附近设置自保持保护器，用于接收要充电的蓄电池组50。 该自保持保护元件包括并联电连接的两个元件。 这两个元件中的一个是双金属，当它加热或流过太多电流时打开。 两个元件中的另一个是当电流流过它时产生热量的正特性热敏电阻（PCT）。 当充电的电池组变得过充电并加热时，保护器的双金属元件打开，并且充电电流停止流动。 当双金属元件打开时，电流流过PCT。 该电流使PCT加热并维持双金属元件处于其开启状态。 当电池组充电短路，并且大电流流经时，双金属元件打开，充电电流以相同的方式中断。
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公开(公告)号：USD271871S
公开(公告)日：1983-12-20
申请号：US472231
申请日：1983-03-04
申请人： Yoshiharu Shimizu
设计人： Yoshiharu Shimizu
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公开(公告)号：US07691677B2
公开(公告)日：2010-04-06
申请号：US12277144
申请日：2008-11-24
IPC分类号： H01L21/44
CPC分类号： H01L23/562 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L21/67144 , H01L21/6715 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/49503 , H01L23/4952 , H01L23/49524 , H01L23/49548 , H01L23/544 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2223/54486 , H01L2224/05554 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/157 , H01L2924/181 , H01L2924/3025 , H01L2924/3512 , H01L2924/3701 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).
摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。
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公开(公告)号：US20070236410A1
公开(公告)日：2007-10-11
申请号：US11727657
申请日：2007-03-27
申请人： Yoshiharu Shimizu
发明人： Yoshiharu Shimizu
CPC分类号： H04N3/20 , G09G3/20 , G09G2320/046 , G09G2320/0626 , G09G2360/16
摘要： A display position of an entire image in one frame of an input image signal is moved as time elapses. When there is a region displayed with a constant image signal level for a predetermined period in the moving image, level adjustment is performed on the image signal for only this region to reduce the signal level of that region.
摘要翻译： 输入图像信号的一帧中的整个图像的显示位置随着时间的推移而移动。 当在运动图像中存在以恒定图像信号电平显示预定周期的区域时，仅对该区域对图像信号进行电平调整，以降低该区域的信号电平。
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公开(公告)号：US08513785B2
公开(公告)日：2013-08-20
申请号：US13101199
申请日：2011-05-05
IPC分类号： H01L23/495
CPC分类号： H01L23/562 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L21/67144 , H01L21/6715 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/49503 , H01L23/4952 , H01L23/49524 , H01L23/49548 , H01L23/544 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2223/54486 , H01L2224/05554 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/157 , H01L2924/181 , H01L2924/3025 , H01L2924/3512 , H01L2924/3701 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).
摘要翻译： 要提高非铅半导体器件的质量。 半导体器件包括用于密封具有树脂的半导体芯片的密封体，设置在密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于外部边缘部分的相应待连接表面的多个引线 密封体的后表面，以及用于将形成在半导体芯片上的焊盘和引线彼此连接的多个引线。 位于密封体的外周部的悬挂引线的端部不会暴露在密封体的背面，而被密封体覆盖。 因此，在树脂成型中不形成悬挂引线的间隔部。 因此，当切割悬挂引线时，密封体的后表面的角部可以由切割模具中的保持器部分的平坦部分支撑，该平坦部分具有比悬挂引线的切割余量足够宽的面积， 从而可以防止树脂的碎裂和提高半导体器件的质量（QFN）。
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