摘要:
This invention relates to a silicone composition comprising: (A) a mixture of (i) a linear trimethylsiloxy-terminated polydiorganosiloxane containing at least 2 alkenyl groups having at least 4 carbon atoms and (ii) optionally a linear dimethylalkenylsiloxy-terminated polydiorganosiloxane, (B) a polyorganohydrogensiloxane, (C) a catalytic quantity of a platinum catalyst, and (D) an inhibitor. The silicone compositions of this invention make it possible to form cured release films with low resistance to peeling when peeling is carried out at high speeds, and with the possibility of controlling the resistance to peeling between low and high values when peeling is carried out at low speeds. The silicone compositions of this invention also are not subject to a decrease in the coefficient of residual adhesion in the adhesive material applied onto a cured release film.
摘要:
The present invention relates to a curable silicone release coating composition comprising a mixture of an organopolysiloxane containing at least two alkenyl groups per compound, an organohydrogensilicon compound, inhibitors having a boiling point of up to 130.degree. C. at atmospheric pressure, inhibitors having a boiling point of at least 170.degree. C. at atmospheric pressure a platinum group metal-containing catalyst, and optionally a diluent. The silicone release coating compositions are stable when stored at room temperature, especially when the composition is used on a coating roll for the production of a thin films. The compositions of this invention also quickly form a cured film having good release properties for adhesive materials at a comparatively low temperatures.
摘要:
The present invention relates to silicone release coating compositions comprising (A) a mixture of (i) a dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer and (ii) a dimethylsiloxanemethylvinylsiloxane copolymer, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an organic solvent. The silicone release coating compositions of the present invention provide small release resistance values both at low and high peeling velocities and do not impair the residual adhesion of tacky substances that have come into contact with the coating.
摘要:
The present invention relates to a process for forming a laminate and the laminate using silicone release coating compositions comprising (A) a mixture of (i) a dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer and (ii) a dimethylsiloxane-methylvinylsiloxane copolymer, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an organic solvent. The silicone release coating compositions of the present invention provide small release resistance values both at low and high peeling velocities and do not impair the residual adhesion of tacky substances that have come into contact with the coating.
摘要:
This invention relates to a silicone release coating composition comprising an organopolysiloxane having at least 2 alkenyl groups in each molecule, an organopolysiloxane having at least 3 silicon-bonded hydrogen atoms in each molecule, a carbon-carbon triple bond-functional alcohol having a boiling point at ambient pressure of at least 140.degree. C., an organosilicon compound having at least 3 carbon-carbon triple bond-functional hydrocarbon groups bonded across oxygen to silicon, and a platinum catalyst. The silicone release coating compositions of this invention have excellent bath stability, form a very stable thin film on applicator rolls, cure rapidly even at relatively low temperatures, have stable curing characteristics during the course of bath aging, and exhibit stable release values during the course of bath aging.
摘要:
A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
摘要:
This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300.
摘要:
A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a [R22SiO2/2]b [R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c & equals; 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0≦b≦0.8; and, on average satisfies the following condition: 0.2≦c≦1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.
摘要翻译:可固化的有机硅组合物包括:(A)由下式给出的硅氧烷单元式(1)表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷:[R 1 3 sub> SiO 2 1/2 sub> 2 sub> 2 sub> 2 sub> > 2/2 b> b> i> 3 b> R 1,R 2,R 3和R 3是一价有机基团,其中至少两个含有环氧基并且不含芳环; 大于20摩尔%的R 3是芳基; a + b + c等于1;平均而言,“a”满足以下条件:0 <= a <= 0.8;平均 ,“b”满足以下条件:0 <= b <= 0.8;平均满足下列条件:0.2 <= c <= 1.0); (B)具有至少两个含有酚羟基的一价有机基团的直链有机聚硅氧烷; 和(C)固化促进剂。
摘要:
A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a[R22SiO2/2]b[R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c equals 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0.2≦b≦0.8; and, on average, “c” satisfies the following condition: 0.2
摘要翻译:可固化的有机硅组合物包括:(A)由下面给出的硅氧烷单元式(1)表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷:[R 13 SiO 1/2] a [R 22 SiO 2 / 2] b [R3SiO3 / 2] c(其中R1,R2和R3是一价有机基团,其中至少两个是含有环氧基并且不含芳环的一价有机基团;大于20摩尔%的R3是 芳基; a + b + c等于1;平均而言,“a”满足以下条件:0&nlE; a&nlE; 0.8;平均而言,“b”满足以下条件:0.2&nlE; b&nlE; 0.8; ,“c”满足以下条件:0.2
摘要:
Silicone resins containing monorganosiloxane and diorganosiloxane units and exhibiting reproducible values of molecular weight and dispersity are prepared by condensing a mixture of hydrolyzed silanes, adjusting the solids content of the condensed resin and then subjecting the resultant product to a re-equilibration reaction in the presence of an alkali metal compound.