公开(公告)号：US20090247057A1

公开(公告)日：2009-10-01

申请号：US11990848

申请日：2006-09-12

申请人： Takuji Kobayashi ,  Hideo Aizawa ,  Masao Umemoto ,  Tadakazu Sone ,  Hiroomi Torii ,  Nobuyuki Takahashi ,  Takashi Tsuzuki

发明人： Takuji Kobayashi ,  Hideo Aizawa ,  Masao Umemoto ,  Tadakazu Sone ,  Hiroomi Torii ,  Nobuyuki Takahashi ,  Takashi Tsuzuki

IPC分类号： B24B37/04 ,  B24B41/00

CPC分类号： B24B37/16

摘要： The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provides a polishing apparatus having such polishing platen. The polishing platen (12) according to the present invention includes a surface to which a polishing pad is attached. The surface of the polishing platen (12) includes a combination of a first surface (20) and a second surface (21) having a surface roughness which is different from that of the first surface (20).

摘要翻译： 本发明提供一种研磨台板，其不需要大的力来从研磨台板的上表面去除抛光垫，因此能够相对容易地从其上去除抛光垫。 本发明还提供一种具有这种研磨台板的抛光装置。 根据本发明的抛光台板（12）包括安装有抛光垫的表面。 研磨台板（12）的表面包括具有不同于第一表面（20）表面粗糙度的第一表面（20）和第二表面（21）的组合。

公开(公告)号：US08118640B2

公开(公告)日：2012-02-21

申请号：US11918254

申请日：2006-04-20

申请人： Nobuyuki Takahashi ,  Tadakazu Sone ,  Takuji Kobayashi ,  Hiroomi Torii

发明人： Nobuyuki Takahashi ,  Tadakazu Sone ,  Takuji Kobayashi ,  Hiroomi Torii

IPC分类号： B24B49/00

CPC分类号： H01L21/67259 ,  B24B37/345 ,  H01L21/30625 ,  H01L21/67751 ,  Y10S414/136 ,  Y10S414/137

摘要： A wafer transferring apparatus includes a top ring for holding a wafer on a lower end surface thereof and a pusher mechanism for transferring the wafer to and from the top ring. The pusher mechanism has a wafer rest for placing the wafer thereon and is arranged to allow the wafer released from the lower end surface of the top ring to be seated on the wafer rest. The pusher mechanism also has a sensor mechanism for detecting when the wafer is properly seated on the wafer rest. The sensor mechanism is adapted to block sensor light emitted from a light-emitting device by the wafer seated on the wafer rest.

摘要翻译： 晶片传送装置包括用于在其下端表面上保持晶片的顶环和用于将晶片传送到顶环的顶推环机构。 推动器机构具有用于将晶片放置在其上的晶片托架，并且被布置成允许从顶环的下端表面释放的晶片被放置在晶片托架上。 推动器机构还具有用于检测晶片何时被正确地安置在晶片托架上的传感器机构。 传感器机构适于阻挡由安装在晶片托架上的晶片从发光器件发射的传感器光。

公开(公告)号：US20090041563A1

公开(公告)日：2009-02-12

申请号：US11918254

申请日：2006-04-20

申请人： Nobuyuki Takahashi ,  Tadakazu Sone ,  Takuji Kobayashi ,  Hiroomi Torii

发明人： Nobuyuki Takahashi ,  Tadakazu Sone ,  Takuji Kobayashi ,  Hiroomi Torii

IPC分类号： H01L21/677 ,  B24B7/00

CPC分类号： H01L21/67259 ,  B24B37/345 ,  H01L21/30625 ,  H01L21/67751 ,  Y10S414/136 ,  Y10S414/137

摘要： A wafer transferring apparatus includes a top ring (60) for holding a wafer (W) on a lower end surface thereof and a pusher mechanism (10) for transferring the wafer (W) to and from the top ring (60). The pusher mechanism (10) has a wafer rest (40a) for placing the wafer (W) thereon and is arranged to allow the wafer (W) released from the lower end surface of the top ring (60) to be seated on the wafer rest (40a). The pusher mechanism (10) also has a sensor mechanism (50) for detecting when the wafer (W) is properly seated on the wafer rest (40a). The sensor mechanism (50) is adapted to block sensor light emitted from a light-emitting device (51) by the wafer (W) seated on the wafer rest (40a).

摘要翻译： 晶片传送装置包括用于在其下端表面上保持晶片（W）的顶环（60）和用于将晶片（W）传送到顶环（60）的推动机构（10）。 推动器机构（10）具有用于将晶片（W）放置在其上的晶片托架（40a），并且布置成允许从顶环（60）的下端表面释放的晶片（W）被放置在晶片 休息（40a）。 推动器机构（10）还具有用于检测晶片（W）何时被正确地安置在晶片托架（40a）上的传感器机构（50）。 传感器机构（50）适于阻挡由位于晶片座（40a）上的晶片（W）从发光器件（51）发射的传感器光。

公开(公告)号：US20090067959A1

公开(公告)日：2009-03-12

申请号：US11665963

申请日：2007-02-21

申请人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： H01L21/67

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理装置的研磨装置包括：用于研磨半导体晶片（W）的多个研磨部（3a，3b）和用于转印晶片（W）的摆动传送装置（7）。 摆动传送器（7）包括适于夹紧晶片（W）的晶片夹紧机构（112），用于沿着晶片夹持机构（102）的框架（102）垂直移动的垂直移动机构（104,106） 抛光部分（3a）的外壳和用于使晶片夹紧机构（112）围绕与框架（102）相邻的轴摆动的摆动机构（108,110）。

公开(公告)号：US20120193506A1

公开(公告)日：2012-08-02

申请号：US13404409

申请日：2012-02-24

申请人： Nobuyuki TAKAHASHI ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki TAKAHASHI ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： F16M11/20

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理设备的抛光装置包括用于抛光半导体晶片（W）的多个抛光部分和用于传送晶片（W）的摆动传送器。 摆动传送器包括适于夹紧晶片（W）的晶片夹持机构，用于沿着抛光部分的壳体的框架垂直移动晶片夹持机构的垂直移动机构，以及用于使晶片夹紧机构摆动的摆动机构 靠近框架的轴。

公开(公告)号：US07083506B2

公开(公告)日：2006-08-01

申请号：US10895395

申请日：2004-07-21

申请人： Hiroomi Torii ,  Hideo Aizawa ,  Soichi Isobe

发明人： Hiroomi Torii ,  Hideo Aizawa ,  Soichi Isobe

IPC分类号： B24B7/00

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/013 ,  B24B53/12 ,  B24B57/02

摘要： A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

公开(公告)号：US07645185B2

公开(公告)日：2010-01-12

申请号：US11826628

申请日：2007-07-17

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B7/00

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

摘要翻译： 衬底传送机构包括顶环，用于装载衬底的衬底装载器和推动器机构，其中衬底装载器包括顶环引导件，并且推动器机构包括顶环引导升降台，顶环导向器和 顶部环形引导升降台在由基座装载机由推动机构向上移动的状态下由顶环保持的基板下方形成密封空间，其中基板通过在顶部环上排出密封空间而脱离，同时在 同时从设置在顶环的基板保持面的通孔注入流体。

公开(公告)号：US20070093186A1

公开(公告)日：2007-04-26

申请号：US11603194

申请日：2006-11-22

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

公开(公告)号：US06783445B2

公开(公告)日：2004-08-31

申请号：US09962330

申请日：2001-09-26

申请人： Hiroomi Torii ,  Hideo Aizawa ,  Soichi Isobe

发明人： Hiroomi Torii ,  Hideo Aizawa ,  Soichi Isobe

IPC分类号： B24B5300

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/013 ,  B24B53/12 ,  B24B57/02

摘要： A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

公开(公告)号：US20070264914A1

公开(公告)日：2007-11-15

申请号：US11826628

申请日：2007-07-17

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.