公开(公告)号：US20110079422A1

公开(公告)日：2011-04-07

申请号：US12994774

申请日：2008-05-26

申请人： Taras Kushita ,  Jun Sakai ,  Hikaru Kouta

发明人： Taras Kushita ,  Jun Sakai ,  Hikaru Kouta

IPC分类号： H05K1/11

CPC分类号： H05K1/0245 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09636 ,  H05K2201/09718

摘要： A multilayer substrate is provided with a conductor plane region in which a plurality of conductor planes are disposed; a clearance region disposed adjacent to the conductor plane region so that the plurality of conductor planes are excluded from the clearance region. A plurality of signal vias are disposed through the clearance region so that the plurality of signal vias are isolated from the plurality of conductor planes. A conductor post is connected to one of the plurality of conductor planes and disposed between two of the signal vias in the clearance region.

摘要翻译： 多层基板设置有布置有多个导体平面的导体平面区域; 与所述导体平面区域相邻设置的间隙区域，以使所述多个导体平面从所述间隙区域排除。 多个信号通孔设置穿过间隙区域，使得多个信号通孔与多个导体平面隔离。 导体柱连接到多个导体平面中的一个并且设置在间隙区域中的两个信号通孔之间。

公开(公告)号：US20150077197A1

公开(公告)日：2015-03-19

申请号：US14401426

申请日：2012-05-15

申请人： Taras Kushita ,  Takashi Harada

发明人： Taras Kushita ,  Takashi Harada

IPC分类号： H01P1/203 ,  H01P7/08

CPC分类号： H01P1/203 ,  H01P1/20345 ,  H01P1/2088 ,  H01P7/082 ,  H05K1/0222 ,  H05K1/0298 ,  H05K1/16

摘要： A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias. The artificial dielectric comprises a conductive plate connected to the first signal via and an isolating slit isolating the first conductive plate from the group of ground vias.

摘要翻译： 本发明的滤波器包括多层基板，两个端子，接地导体和混合谐振器。 多层基板包括多个导体层和被配置为将所述多个导体层彼此隔离的电介质。 混合谐振器设置在多层衬底中，并且包括第一和第二谐振元件和连接第一和所述第二谐振元件的耦合条。 每个谐振元件包括信号通孔，一组接地通孔和人造电介质。 每个信号通孔设置穿过多层基板。 每组接地孔通过多层基板设置并且被配置为围绕信号通道。 每个人造电介质设置在多层基板中，并且在信号通孔和一组接地通孔之间。 人造电介质包括连接到第一信号通孔的导电板和将第一导电板与一组接地通孔隔离的隔离狭缝。