公开(公告)号：US08133663B2

公开(公告)日：2012-03-13

申请号：US11782233

申请日：2007-07-24

申请人： Taro Yamamoto ,  Hitoshi Kosugi ,  Yoshiaki Yamada ,  Yasuhito Saiga

发明人： Taro Yamamoto ,  Hitoshi Kosugi ,  Yoshiaki Yamada ,  Yasuhito Saiga

IPC分类号： G03F7/26

CPC分类号： G03F7/38 ,  G03F7/2041 ,  G03F7/70341

摘要： A pattern forming method includes forming a resist film or sequentially forming a resist film and a protection film in this order on a surface of a substrate; then, performing immersion light exposure that includes immersing the resist film or the resist film and the protection film formed on the substrate in a liquid during light exposure, thereby forming a predetermined light exposure pattern on the resist film; and performing a development process of the light exposure pattern by use of a development liquid, thereby forming a predetermined resist pattern. After the immersion light exposure and before the development process, the method further includes performing a hydrophilic process of turning a surface of the resist film or the protection film serving as a substrate surface into a hydrophilic state to allow the substrate surface to be wetted with the development liquid overall.

摘要翻译： 图案形成方法包括在基板的表面上依次形成抗蚀剂膜或依次形成抗蚀剂膜和保护膜; 然后，在曝光期间进行浸渍曝光，其中包括将抗蚀剂膜或抗蚀剂膜和形成在基板上的保护膜浸入液体中，从而在抗蚀剂膜上形成预定的曝光图案; 并通过使用显影液进行曝光图案的显影处理，由此形成预定的抗蚀剂图案。 在浸没曝光之后和显影处理之前，该方法还包括进行将抗蚀剂膜或用作基板表面的保护膜的表面转动成亲水性的亲水处理，以允许基板表面被 开发液体整体。

公开(公告)号：US08889337B2

公开(公告)日：2014-11-18

申请号：US11934308

申请日：2007-11-02

申请人： Hitoshi Kosugi ,  Taro Yamamoto ,  Yoshiaki Yamada ,  Yasuhito Saiga

发明人： Hitoshi Kosugi ,  Taro Yamamoto ,  Yoshiaki Yamada ,  Yasuhito Saiga

IPC分类号： G03F7/09 ,  B05C11/02 ,  G03F7/20 ,  G03F7/11 ,  H01L21/67

CPC分类号： G03F7/2041 ,  G03F7/11 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/6715

摘要： Such a film forming method is provided that can prevent peeling of surface films including a resist film from a substrate during immersion exposure.The film forming method includes the steps of forming surface films including a resist film and a protective film covering the resist film over a surface of a wafer, and forming an edge cap film by supplying an edge cap film material to at least a boundary portion including a periphery of the wafer and peripheries of the surface films such as the protective film.

摘要翻译： 提供这样的成膜方法，其可以防止在浸没曝光期间从基底上包括抗蚀剂膜的表面膜的剥离。 成膜方法包括以下步骤：在晶片的表面上形成包括抗蚀剂膜和覆盖抗蚀剂膜的保护膜的表面膜，以及通过将边缘帽膜材料供给到至少包括 晶片的周边以及诸如保护膜的表面膜的周边。

公开(公告)号：US20080118861A1

公开(公告)日：2008-05-22

申请号：US11934308

申请日：2007-11-02

申请人： Hitoshi Kosugi ,  Taro Yamamoto ,  Yoshiaki Yamada ,  Yasuhito Saiga

发明人： Hitoshi Kosugi ,  Taro Yamamoto ,  Yoshiaki Yamada ,  Yasuhito Saiga

IPC分类号： G03C1/00

CPC分类号： G03F7/2041 ,  G03F7/11 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/6715

摘要： Such a film forming method is provided that can prevent peeling of surface films including a resist film from a substrate during immersion exposure.The film forming method includes the steps of forming surface films including a resist film and a protective film covering the resist film over a surface of a wafer, and forming an edge cap film by supplying an edge cap film material to at least a boundary portion including a periphery of the wafer and peripheries of the surface films such as the protective film.

摘要翻译： 提供这样的成膜方法，其可以防止在浸没曝光期间从基底上包括抗蚀剂膜的表面膜的剥离。 成膜方法包括以下步骤：在晶片的表面上形成包括抗蚀剂膜和覆盖抗蚀剂膜的保护膜的表面膜，以及通过将边缘帽膜材料供给到至少包括 晶片的周边以及诸如保护膜的表面膜的周边。

公开(公告)号：US07826032B2

公开(公告)日：2010-11-02

申请号：US11778412

申请日：2007-07-16

申请人： Taro Yamamoto ,  Hitoshi Kosugi ,  Yoshiaki Yamada ,  Yasuhito Saiga

发明人： Taro Yamamoto ,  Hitoshi Kosugi ,  Yoshiaki Yamada ,  Yasuhito Saiga

IPC分类号： G03B27/42 ,  G21K5/10

CPC分类号： G03F7/38 ,  G03F7/168 ,  G03F7/70341 ,  G03F7/70991 ,  Y10S438/908

摘要： A circulation system for a high refractive index liquid includes a first collecting section configured to collect a high refractive index liquid used in an immersion light exposure section; a first supply section configured to supply the high refractive index liquid collected in the first collecting section to a cleaning section as a cleaning liquid; a second collecting section configured to collect the high refractive index liquid used in the cleaning section; and a second supply section configured to supply the high refractive index liquid collected in the second collecting section to the immersion light exposure section, wherein the high refractive index liquid is circulated between the immersion light exposure section and the cleaning section.

摘要翻译： 用于高折射率液体的循环系统包括：第一收集部分，被配置为收集在浸没曝光部分中使用的高折射率液体; 第一供给部构造成将收集在第一收集部中的高折射率液体供给到作为清洗液的清洗部; 第二收集部，其构造成收集在所述清洗部中使用的高折射率液体; 以及第二供给部，被构造成将在第二收集部中收集的高折射率液体供给到浸没曝光部，其中高折射率液体在浸没曝光部和清洁部之间循环。

公开(公告)号：US07651285B2

公开(公告)日：2010-01-26

申请号：US11907131

申请日：2007-10-09

申请人： Hitoshi Kosugi ,  Taro Yamamoto ,  Yoshiaki Yamada ,  Yasuhito Saiga

发明人： Hitoshi Kosugi ,  Taro Yamamoto ,  Yoshiaki Yamada ,  Yasuhito Saiga

IPC分类号： G03D5/00 ,  G03B27/32 ,  B05C11/02

CPC分类号： G03B27/52 ,  G03F7/2028

摘要： An edge exposure apparatus performing an exposure process on an edge portion of a wafer having a coating film (resist film) formed thereon includes position detection means for detecting positional data of an outer edge of a wafer held by a spin chuck, an exposure portion for performing an exposure process on the edge portion of the wafer, a development nozzle supplying a developer to the exposed region, and alignment means for horizontally moving the spin chuck. An exposure process is performed by the exposure portion on the edge portion of the wafer held by the spin chuck while the alignment means is controlled, based on the positional data of the outer edge of the wafer which is detected by the position detection means, such that the positional relation between the outer edge of the wafer and the exposure portion is kept constant.

摘要翻译： 在其上形成有涂膜（抗蚀剂膜）的晶片的边缘部分进行曝光处理的边缘曝光装置包括位置检测装置，用于检测由旋转卡盘保持的晶片的外边缘的位置数据， 对晶片的边缘部分进行曝光处理，将显影剂供应到曝光区域的显影喷嘴以及用于使旋转卡盘水平移动的对准装置。 基于由位置检测装置检测到的晶片的外边缘的位置数据，通过控制对准装置的由旋转卡盘保持的晶片的边缘部分上的曝光部分进行曝光处理， 晶片的外边缘与曝光部分之间的位置关系保持恒定。

公开(公告)号：US20080088809A1

公开(公告)日：2008-04-17

申请号：US11907131

申请日：2007-10-09

申请人： Hitoshi Kosugi ,  Taro Yamamoto ,  Yoshiaki Yamada ,  Yasuhito Saiga

发明人： Hitoshi Kosugi ,  Taro Yamamoto ,  Yoshiaki Yamada ,  Yasuhito Saiga

IPC分类号： G03B27/52 ,  G03C5/00

CPC分类号： G03B27/52 ,  G03F7/2028

摘要： An edge exposure apparatus performing an exposure process on an edge portion of a wafer having a coating film (resist film) formed thereon includes position detection means for detecting positional data of an outer edge of a wafer held by a spin chuck, an exposure portion for performing an exposure process on the edge portion of the wafer, a development nozzle supplying a developer to the exposed region, and alignment means for horizontally moving the spin chuck. An exposure process is performed by the exposure portion on the edge portion of the wafer held by the spin chuck while the alignment means is controlled, based on the positional data of the outer edge of the wafer which is detected by the position detection means, such that the positional relation between the outer edge of the wafer and the exposure portion is kept constant.

摘要翻译： 在其上形成有涂膜（抗蚀剂膜）的晶片的边缘部分进行曝光处理的边缘曝光装置包括位置检测装置，用于检测由旋转卡盘保持的晶片的外边缘的位置数据， 对晶片的边缘部分进行曝光处理，将显影剂供应到曝光区域的显影喷嘴以及用于使旋转卡盘水平移动的对准装置。 基于由位置检测装置检测到的晶片的外边缘的位置数据，通过控制对准装置的由旋转卡盘保持的晶片的边缘部分上的曝光部分进行曝光处理， 晶片的外边缘与曝光部分之间的位置关系保持恒定。

公开(公告)号：US07733472B2

公开(公告)日：2010-06-08

申请号：US11832188

申请日：2007-08-01

申请人： Taro Yamamoto ,  Hitoshi Kosugi

发明人： Taro Yamamoto ,  Hitoshi Kosugi

IPC分类号： G01N21/00

CPC分类号： G03F7/70341 ,  G03F7/16

摘要： A method is used for determining a condition of a predetermined process for preparing a process target, which includes a coating film formed on a substrate and including a resist film. This is to prevent film peeling from occurring in the coating film when performing immersion light exposure after the predetermined process. The method includes preparing test targets, each of which includes a sample film corresponding to the coating film and formed on a sample substrate corresponding to the substrate; performing a test process on each of the test targets in a testing unit, which imitates an immersion light exposure apparatus, under a condition corresponding to a designated immersion light exposure condition; and determining a condition of the predetermined process to be used for the coating film, based on a result of the test process.

摘要翻译： 一种方法用于确定用于制备处理目标的预定方法的条件，其包括形成在基板上并包括抗蚀剂膜的涂膜。 这是为了防止在预定处理之后进行浸没曝光时在涂膜中发生膜剥离。 该方法包括制备测试对象，每个测试对象包括与涂膜相对应的样品膜，并形成在与该基板相对应的样品基板上; 在与指定的浸没式曝光条件相对应的条件下对模拟浸没式曝光装置的测试单元中的每个测试目标进行测试处理; 并基于测试过程的结果确定用于涂膜的预定处理的条件。

公开(公告)号：US20080037013A1

公开(公告)日：2008-02-14

申请号：US11832188

申请日：2007-08-01

申请人： Taro Yamamoto ,  Hitoshi Kosugi

发明人： Taro Yamamoto ,  Hitoshi Kosugi

IPC分类号： G01N21/88 ,  G01N21/75

CPC分类号： G03F7/70341 ,  G03F7/16

摘要： A method is used for determining a condition of a predetermined process for preparing a process target, which includes a coating film formed on a substrate and including a resist film. This is to prevent film peeling from occurring in the coating film when performing immersion light exposure after the predetermined process. The method includes preparing test targets, each of which includes a sample film corresponding to the coating film and formed on a sample substrate corresponding to the substrate; performing a test process on each of the test targets in a testing unit, which imitates an immersion light exposure apparatus, under a condition corresponding to a designated immersion light exposure condition; and determining a condition of the predetermined process to be used for the coating film, based on a result of the test process.

摘要翻译： 一种方法用于确定用于制备处理目标的预定方法的条件，其包括形成在基板上并包括抗蚀剂膜的涂膜。 这是为了防止在预定处理之后进行浸没曝光时在涂膜中发生膜剥离。 该方法包括制备测试对象，每个测试对象包括与涂膜相对应的样品膜，并形成在与该基板相对应的样品基板上; 在与指定的浸没式曝光条件相对应的条件下对模拟浸没式曝光装置的测试单元中的每个测试目标进行测试处理; 并基于测试过程的结果确定用于涂膜的预定处理的条件。

公开(公告)号：US08578953B2

公开(公告)日：2013-11-12

申请号：US12000670

申请日：2007-12-14

申请人： Yasushi Takiguchi ,  Taro Yamamoto ,  Akihiro Fujimoto ,  Shuuichi Nishikido ,  Dai Kumagai ,  Naoto Yoshitaka ,  Takahiro Kitano ,  Yoichi Tokunaga

发明人： Yasushi Takiguchi ,  Taro Yamamoto ,  Akihiro Fujimoto ,  Shuuichi Nishikido ,  Dai Kumagai ,  Naoto Yoshitaka ,  Takahiro Kitano ,  Yoichi Tokunaga

IPC分类号： B08B3/00 ,  B08B1/02

CPC分类号： H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

摘要： A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

摘要翻译： 公开的用于清洁基板的背面的基板清洁装置包括：第一基板支撑部，其构造成在基板的背面的第一区域处支撑基板，所述背面朝下; 第二基板支撑部，其构造成在所述基板的背面的第二区域处支撑所述基板，所述第二区域与所述第一区域分离; 清洗液供给部，构成为向所述基板的背面供给清洗液; 干燥部，其构造成干燥所述基板的背面的第二区域; 以及清洁部，其构造成当所述基板被所述第一基板支撑部支撑所述基板时，清洁所述基板的背面的第三区域，所述第三区域包括所述第二区域以及所述基板的背面的第四区域， 基板由第二基板支撑部分支撑，除了后表面的第二区域之外的第四区域。

公开(公告)号：US08518494B2

公开(公告)日：2013-08-27

申请号：US11672230

申请日：2007-02-07

申请人： Taro Yamamoto ,  Hideharu Kyouda

发明人： Taro Yamamoto ,  Hideharu Kyouda

IPC分类号： B05D1/36

CPC分类号： H01L21/67017 ,  G03F7/11 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/70341 ,  H01L21/67051 ,  H01L21/6715

摘要： Disclosed is a technique for preventing a water-repellent protective film formed on a resist film from peeling off during immersion exposure. A resist film is formed on the front surface of a substrate and then the peripheral edge portion of the resist film is removed. Before forming a water-repellent protective film onto the resist film, an adhesion-improving fluid, preferably hexamethyldisilazane gas, for improving the adhesion of the water-repellent protective film, is supplied to the region from which the resist film is removed.