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8 条记录 (耗时 0.022 秒)

    Rotary kiln
    1.
    发明授权
    Rotary kiln 失效
    回转窑

    公开(公告)号：US4626202A

    公开(公告)日：1986-12-02

    申请号：US811533

    申请日：1985-12-20

    申请人： Tatsu Chisaki ,  Toshio Ikenaga ,  Akira Iwabuchi

    发明人： Tatsu Chisaki ,  Toshio Ikenaga ,  Akira Iwabuchi

    IPC分类号： F27B7/02 ,  F27B7/38 ,  F27B7/08 ,  F27B7/10

    CPC分类号： F27B7/02 ,  F27B7/383

    摘要： A rotary kiln includes a cylindrical kiln body supported for rotation about a central axis inclined with respect to a horizontal plane, a cylindrical combustion chamber formed inside the kiln body and extending along the central axis, and a plurality of cylindrical calcination chambers formed inside the kiln body so as to lie parallel with and surround the combustion chamber. The combustion chamber has an outlet at its lower end from which residue produced by combustion of fuel inside the combustion chamber drops for further combustion and/or discharge. Each calcination chamber has an inlet at its elevated end for receiving a supply of raw material to be calcined inside the calcination chamber, an opening at its lowermost end communicating with the outlet of the combustion chamber for receiving high-temperature combustion gases from the interior of the combustion chamber, and an outlet adjacent its lowermost end from which the calcined raw material drops for further calcination and/or collection without contacting the residue from the combustion chamber. Calcination in the calcination chambers is effected by heat transmitted from the combustion chamber through the kiln body and by heat given off by the high-temperature gases received from the combustion chamber.

    摘要翻译： 旋转窑具有：支承用于围绕相对于水平面倾斜的中心轴线旋转的圆筒状窑体，形成在窑体内部且沿着中心轴延伸的圆筒形燃烧室，以及形成在窑内的多个圆筒状煅烧室 从而与燃烧室平行并围绕燃烧室。 燃烧室在其下端具有出口，由燃烧室内的燃料燃烧产生的残留物由此从而进一步燃烧和/或排出。 每个煅烧室在其升高的端部具有入口，用于接收在煅烧室内煅烧的原料供应，其最下端的开口与燃烧室的出口连通，用于从内部接收高温燃烧气体 燃烧室和邻近其最低端的出口，煅烧的原料从该出口附近进一步煅烧和/或收集，而不使来自燃烧室的残余物接触。 煅烧室中的煅烧是通过从燃烧室通过窑体传递的热量和由从燃烧室接收的高温气体释放的热量来实现的。

    Lens and optical pick-up
    5.
    发明授权
    Lens and optical pick-up 失效
    镜头和光学拾音器

    公开(公告)号：US08305867B2

    公开(公告)日：2012-11-06

    申请号：US13152569

    申请日：2011-06-03

    申请人： Shungo Hanashiro ,  Akira Iwabuchi

    发明人： Shungo Hanashiro ,  Akira Iwabuchi

    IPC分类号： G11B7/00

    CPC分类号： G11B7/22 ,  G11B7/1374

    摘要： A lens including: a lens body having first and second surfaces; a flange part formed to protrude from a periphery of the lens body and to have a cylindrical outer circumferential surface; a lens installation surface formed at an outer edge part of the flange part; a recessed part formed as a part of the flange part such that a part of the cylindrical outer circumferential surface is recessed toward the optical axis; and a gate root part located at a central part of the recessed part. The gate root part has a flat surface which is in a same level with respect to the lens installation surface. The gate root part lies on an optical axis side with respect to a virtual curved surface formed by extending the cylindrical outer circumferential surface through the recessed part.

    摘要翻译： 一种透镜，包括：具有第一和第二表面的透镜体; 凸缘部，其形成为从所述透镜体的周边突出并具有圆筒状的外周面; 形成在所述凸缘部的外缘部的透镜安装面; 凹部，其形成为所述凸缘部的一部分，使得所述圆筒形外周面的一部分朝向所述光轴凹陷; 以及位于凹部的中心部的门根部。 门根部具有相对于透镜安装表面处于相同水平面的平坦表面。 门根部相对于通过凹部延伸圆筒形外周面而形成的虚拟曲面位于光轴侧。

    Circuit device
    6.
    发明授权
    Circuit device 有权
    电路设备

    公开(公告)号：US08614397B2

    公开(公告)日：2013-12-24

    申请号：US13188707

    申请日：2011-07-22

    申请人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura ,  Masami Motegi

    发明人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura ,  Masami Motegi

    IPC分类号： H05K1/16

    CPC分类号： H01L21/565 ,  H01L21/481 ,  H01L23/142 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00

    摘要： In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

    摘要翻译： 在本发明的电路装置中，电路板的下表面侧被第二树脂密封剂覆盖，电路板的上表面等被第一树脂密封剂覆盖。 由于主要通过第二树脂密封剂实现对电路器件外部的散热，所以第二树脂密封剂中包含的填料的粒径大于第一树脂密封剂中所含的填料的粒径。 对电路设备外部的散热大大提高。

    CIRCUIT DEVICE
    8.
    发明申请
    CIRCUIT DEVICE 有权
    电路设备

    公开(公告)号：US20120018202A1

    公开(公告)日：2012-01-26

    申请号：US13188707

    申请日：2011-07-22

    申请人： Katsuyoshi MINO ,  Akira Iwabuchi ,  Ko Nishimura ,  Masami Motegi

    发明人： Katsuyoshi MINO ,  Akira Iwabuchi ,  Ko Nishimura ,  Masami Motegi

    IPC分类号： H05K1/18

    CPC分类号： H01L21/565 ,  H01L21/481 ,  H01L23/142 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00

    摘要： In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

    摘要翻译： 在本发明的电路装置中，电路板的下表面侧被第二树脂密封剂覆盖，电路板的上表面等被第一树脂密封剂覆盖。 由于主要通过第二树脂密封剂实现对电路器件外部的散热，所以第二树脂密封剂中包含的填料的粒径大于第一树脂密封剂中所含的填料的粒径。 对电路设备外部的散热大大提高。