公开(公告)号：US08614397B2

公开(公告)日：2013-12-24

申请号：US13188707

申请日：2011-07-22

申请人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura ,  Masami Motegi

发明人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura ,  Masami Motegi

IPC分类号： H05K1/16

CPC分类号： H01L21/565 ,  H01L21/481 ,  H01L23/142 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00

摘要： In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

摘要翻译： 在本发明的电路装置中，电路板的下表面侧被第二树脂密封剂覆盖，电路板的上表面等被第一树脂密封剂覆盖。 由于主要通过第二树脂密封剂实现对电路器件外部的散热，所以第二树脂密封剂中包含的填料的粒径大于第一树脂密封剂中所含的填料的粒径。 对电路设备外部的散热大大提高。

公开(公告)号：US08624408B2

公开(公告)日：2014-01-07

申请号：US13189121

申请日：2011-07-22

申请人： Katsuyoshi Mino ,  Masaru Kanakubo ,  Akira Iwabuchi ,  Masami Motegi

发明人： Katsuyoshi Mino ,  Masaru Kanakubo ,  Akira Iwabuchi ,  Masami Motegi

IPC分类号： H01L23/29

CPC分类号： H01L23/295 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3675 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/1034 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

摘要翻译： 在本发明的电路装置中，电路基板的下表面侧及其侧面的一部分被第二树脂密封剂覆盖，电路基板的上表面侧等被第一树脂密封剂 。 由于主要通过第二树脂密封剂实现对电路器件外部的散热，所以第二树脂密封剂中包含的填料的粒径大于第一树脂密封剂中所含的填料的粒径。 对电路设备外部的散热大大提高。

公开(公告)号：US20120021568A1

公开(公告)日：2012-01-26

申请号：US13189155

申请日：2011-07-22

申请人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura

发明人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura

IPC分类号： H01L21/56

CPC分类号： H01L21/565 ,  H01L23/3135 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K5/064 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Provided is a method of manufacturing a circuit device in which a circuit element is resin-sealed with sealing resins formed integrally with each other. In the present invention, a resin sheet and a circuit board are housed in a cavity of a mold, and thereafter a first sealing resin formed of a tablet in melted form is injected into the cavity. At the time of injecting the first sealing resin, a second sealing resin formed of the resin sheet in melted form is not yet cured and is maintained in liquid form. Accordingly, the injected first sealing resin and the second sealing resin are mixed at the boundary therebetween, preventing the generation of a gap in the boundary portion and therefore preventing the deterioration of the moisture resistance and withstand voltage at the boundary portion.

摘要翻译： 提供一种电路装置的制造方法，其中电路元件由彼此一体形成的密封树脂进行树脂密封。 在本发明中，将树脂片和电路板容纳在模具的空腔中，然后将由熔融形式的片剂形成的第一密封树脂注入到空腔中。 在注射第一密封树脂时，由熔融形式的树脂片形成的第二密封树脂尚未固化并保持液体形式。 因此，注入的第一密封树脂和第二密封树脂在它们之间的边界处混合，从而防止在边界部分产生间隙，从而防止边界部分的耐湿性和耐受电压的劣化。

公开(公告)号：US08481367B2

公开(公告)日：2013-07-09

申请号：US13189155

申请日：2011-07-22

申请人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura

发明人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura

IPC分类号： H01L25/00

CPC分类号： H01L21/565 ,  H01L23/3135 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K5/064 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Provided is a method of manufacturing a circuit device in which a circuit element is resin-sealed with sealing resins formed integrally with each other. In the present invention, a resin sheet and a circuit board are housed in a cavity of a mold, and thereafter a first sealing resin formed of a tablet in melted form is injected into the cavity. At the time of injecting the first sealing resin, a second sealing resin formed of the resin sheet in melted form is not yet cured and is maintained in liquid form. Accordingly, the injected first sealing resin and the second sealing resin are mixed at the boundary therebetween, preventing the generation of a gap in the boundary portion and therefore preventing the deterioration of the moisture resistance and withstand voltage at the boundary portion.

摘要翻译： 提供一种电路装置的制造方法，其中电路元件由彼此一体形成的密封树脂进行树脂密封。 在本发明中，将树脂片和电路板容纳在模具的空腔中，然后将由熔融形式的片剂形成的第一密封树脂注入到空腔中。 在注射第一密封树脂时，由熔融形式的树脂片形成的第二密封树脂尚未固化并保持液体形式。 因此，注入的第一密封树脂和第二密封树脂在它们之间的边界处混合，从而防止在边界部分产生间隙，从而防止边界部分的耐湿性和耐受电压的劣化。

公开(公告)号：US08084301B2

公开(公告)日：2011-12-27

申请号：US12557882

申请日：2009-09-11

申请人： Katsuyoshi Mino ,  Masaru Kanakubo ,  Masami Motegi

发明人： Katsuyoshi Mino ,  Masaru Kanakubo ,  Masami Motegi

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/49551 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/0166 ,  H05K2203/1316 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a circuit device manufacturing method for coating a bottom surface of a circuit board with a thin coating of sealing resin. In the present invention, a circuit board having a circuit element such as a semiconductor element embedded therein is placed in a molding die, and a resin sheet containing a thermosetting resin is interposed between the circuit board and a bottom surface of an inner wall of the molding die. Under this condition, the molding die is heated to about 180° C., and a sealing resin in liquid form is injected through a gate. Thereby, the bottom surface of the circuit board can be coated with a thin coating of the sealing resin made of the molten resin sheet.

摘要翻译： 提供了一种用薄型密封树脂涂覆电路板底面的电路器件制造方法。 在本发明中，将具有嵌入其中的半导体元件等电路元件的电路基板放置在成型模具中，将含有热固化性树脂的树脂片插入在电路基板与内部的内壁的底面之间 成型模具。 在这种条件下，将模具加热至约180℃，并通过浇口注入液体形式的密封树脂。 由此，电路板的底面可以涂覆有由熔融树脂片制成的密封树脂的薄涂层。

公开(公告)号：US07957158B2

公开(公告)日：2011-06-07

申请号：US11928782

申请日：2007-10-30

申请人： Sadamichi Takakusaki ,  Noriaki Sakamoto ,  Katsuyoshi Mino

发明人： Sadamichi Takakusaki ,  Noriaki Sakamoto ,  Katsuyoshi Mino

IPC分类号： H05K7/10

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.

摘要翻译： 提供了具有改进的包装密度的电路装置。 本发明的电路装置包括：电路板，其表面被绝缘层覆盖; 形成在绝缘层的表面上的导电图案; 电连接到导电图案的电路元件; 并且连接到由导电图案形成的焊盘的引线。 此外，控制元件固定到由引线的一部分形成的台面部的上表面，并且台肩部的后表面与电路板的上表面间隔开。