Semiconductor laser device and manufacturing method thereof
    2.
    发明授权
    Semiconductor laser device and manufacturing method thereof 失效
    半导体激光器件及其制造方法

    公开(公告)号:US5963572A

    公开(公告)日:1999-10-05

    申请号:US773346

    申请日:1996-12-26

    IPC分类号: H01S5/22 H01S5/223 H01S3/19

    摘要: A semiconductor laser device including an n-type cladding layer, an active layer, a p-type cladding layer having a ridge portion, an n-type optical confinement layer formed on the flat portion and side surfaces of the ridge portion of the p-type cladding layer, and an n-type current blocking layer formed on the n-type optical confinement layer in this order. The optical confinement layer is composed of a low resistivity layer doped with n-type impurity, which has a smaller refractive index than the p-type cladding layer and a bandgap energy greater than the energy of lasing light. The optical confinement layer has an impurity concentration of 5.times.10.sup.7 cm.sup.-3 or less. The n-type current blocking layer has a thickness of 0.4 .mu.m or less.

    摘要翻译: 一种半导体激光装置,包括n型包层,有源层,具有脊部的p型包覆层,形成在平坦部分上的n型光限制层和p型包层, 型包层,以及n型光限制层上形成的n型电流阻挡层。 光限制层由掺杂有n型杂质的低电阻率层构成,其折射率比p型覆层更小,并且带隙能量大于激光的能量。 光学限制层的杂质浓度为5×10 7 cm -3以下。 n型电流阻挡层的厚度为0.4μm以下。