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1.发明申请Adhesive Sheet, Semiconductor Device, and Process for Producing Semiconductor Device 有权粘合片，半导体装置和半导体装置的制造方法公开(公告)号：US20070241434A1
公开(公告)日：2007-10-18
申请号：US11578939
申请日：2005-04-20
申请人： Teiichi Inada , Michio Mashino , Michio Uruno , Tetsuro Iwakura
发明人： Teiichi Inada , Michio Mashino , Michio Uruno , Tetsuro Iwakura
IPC分类号： H01L21/301 , B32B7/12
CPC分类号： H01L24/29 , C08K3/36 , C08L2666/02 , C09J7/10 , C09J163/00 , C09J2205/102 , C09J2463/00 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/27 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/94 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/15311 , Y10T428/25 , Y10T428/28 , Y10T428/287 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/0532 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/20752 , H01L2224/27 , H01L2224/32245 , H01L2224/48247
摘要： An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of −50° C. to 50° C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 μm.
摘要翻译： 本发明的目的是提供一种能够填充由于基板的布线或者附着在半导体芯片等上的线的不规则性的粘合片，在切割时不会形成树脂毛刺，并且具有令人满意的耐热性和耐湿性 。 本发明涉及一种粘合片，其包含100重量份的树脂，其包含15〜40重量％的含有交联官能团的高分子量组分，其重均分子量为100,000以上，Tg为 - 50〜50℃，60〜85重量％的以环氧树脂为主要成分的热固性成分和40〜180重量份的填料，所述粘合片的厚度为10〜250 妈妈
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2.发明授权Adhesive sheet, semiconductor device, and process for producing semiconductor device 有权粘合片，半导体装置以及半导体装置的制造方法公开(公告)号：US08017444B2
公开(公告)日：2011-09-13
申请号：US11578939
申请日：2005-04-20
申请人： Teiichi Inada , Michio Mashino , Michio Uruno , Tetsuro Iwakura
发明人： Teiichi Inada , Michio Mashino , Michio Uruno , Tetsuro Iwakura
IPC分类号： H01L21/00
CPC分类号： H01L24/29 , C08K3/36 , C08L2666/02 , C09J7/10 , C09J163/00 , C09J2205/102 , C09J2463/00 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/27 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/94 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/15311 , Y10T428/25 , Y10T428/28 , Y10T428/287 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/0532 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/20752 , H01L2224/27 , H01L2224/32245 , H01L2224/48247
摘要： An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of −50° C. to 50° C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 μm.
摘要翻译： 本发明的目的是提供一种能够填充由于基板的布线或者附着在半导体芯片等上的线的不规则性的粘合片，在切割时不会形成树脂毛刺，并且具有令人满意的耐热性和耐湿性 。 本发明涉及一种粘合片，其包含100重量份的树脂，其包含15〜40重量％的含有交联官能团的高分子量组分，其重均分子量为100,000以上，Tg为 - 50〜50℃，60〜85重量％的以环氧树脂为主要成分的热固性成分和40〜180重量份的填料，所述粘合片的厚度为10〜250 μm。
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3.发明申请ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开粘合片，半导体器件及制造半导体器件的方法公开(公告)号：US20110287250A1
公开(公告)日：2011-11-24
申请号：US13204379
申请日：2011-08-05
申请人： Teiichi Inada , Michio Mashino , Michio Uruno , Tetsuro Iwakura
发明人： Teiichi Inada , Michio Mashino , Michio Uruno , Tetsuro Iwakura
CPC分类号： H01L24/29 , C08K3/36 , C08L2666/02 , C09J7/10 , C09J163/00 , C09J2205/102 , C09J2463/00 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/27 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/94 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/15311 , Y10T428/25 , Y10T428/28 , Y10T428/287 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/0532 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/20752 , H01L2224/27 , H01L2224/32245 , H01L2224/48247
摘要： An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of −50° C. to 50° C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 μm.
摘要翻译： 本发明的目的是提供一种能够填充由于基板的布线或者附着在半导体芯片等上的线的不规则性的粘合片，在切割时不会形成树脂毛刺，并且具有令人满意的耐热性和耐湿性 。 本发明涉及一种粘合片，其包含100重量份的树脂，其包含15〜40重量％的含有交联官能团的高分子量组分，其重均分子量为100,000以上，Tg为 - 50〜50℃，60〜85重量％的以环氧树脂为主要成分的热固性成分和40〜180重量份的填料，所述粘合片的厚度为10〜250 μm。
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