摘要:
An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.
摘要:
An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.
摘要:
The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.
摘要:
An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.
摘要:
In one embodiment, method of forming fibers is provided. The method includes modifying a first exposed edge of at least one core of a first fiber. The first fiber has a first end, a second end, and a length between the first end and the second end. The second end has the first exposed edge of the core, and the first exposed edge has a first diffusion state. The first fiber may transmit light along the core. The modification of the first exposed edge includes modifying the first diffusion state of the first exposed edge of the core to a second diffusion state such that light exiting the first exposed edge in the second diffusion state is spread over a greater number of angles relative to angles of the light exiting the first exposed edge in the first diffusion state.
摘要:
In one embodiment, fiber assemblies are provided. The fiber assemblies may have a first fiber and a second fiber. The first fiber may have at least one core having a length and first and second ends. The second end may have a first connector. The second fiber may have at least one core having a length and first and second ends. The second end may have a second connector having at least one magnet. The first connector may be engaged to the second connector, and the at least one magnet may be operated to engage the first connector to the second connector.
摘要:
The invention accurately determines propagation delay for a sawtooth pattern. Through measurement, the actual delays added per bend in the sawtooth pattern are determined and the values are then used in a CAD tool. The invention can add a known amount of propagation delay to a wire length by routing net wires close together without using a large amount of board space.
摘要:
A connector with multiple redundant contact points is disclosed. The multiple contacts are formed by a main contact point on a main beam and an auxiliary contact point connected to the main beam by a secondary beam in the shape of a loop or spring.
摘要:
High speed power supply transients are suppressed in a system having fast edges and where a radial transmission line exists between the power supply and ground planes, by terminating the edges of the PCB in it characteristic impedance. In practice, this means approximating a continuous construct with many spaced instances of a discrete resistance. The dissipative terminations themselves are resistive, and if placed directly between the power supply and ground would needlessly dissipate a great deal of DC power. To prevent that they are AC coupled with a high quality coupling capacitor of sufficient capacitance to allow the resulting impedance to appear predominately resistive at and above the lowest frequency of interest, say, 100 MHz. Because of the confused nature of the reflection that may be generated at arbitrary locations within the interior of the PCB, there may well be "hot spots" within that interior that would benefit from the placement of a selected AC coupled load at or near such a spot.
摘要:
Methods and apparatus for optical architectures are disclosed. An optical architecture includes first and second riser cards and first and second components carried by the first and second riser cards respectively. The optical architecture also includes a first matrix to fan-out a multi-bit optical input signal into first and second outbound signals, and first and second fiber optic cables to carry the first and second outbound signals to the first and second riser cards, respectively.