摘要:
Disclosed is a sealing agent for photoelectric converters which enables to easily bond upper and lower conductive supporting bodies during production of a photoelectric converter while forming a sealed portion having excellent adhesion strength, moisture resistance reliability, flexibility and the like. Specifically, a photocuring and thermosetting resin composition containing an epoxy resin (a), a thermosetting agent (b), an epoxy(meth)acrylate (c) and a photopolymerization initiator (d), and additionally if necessary, a filler (e), a silane coupling agent (f) and an ion capturing agent (g) is used as a sealing agent for photoelectric converters.
摘要:
A cover-lay film comprising a heat-resistant film and an adhesive layer, wherein the adhesive layer is formed of an epoxy resin composition containing (a) an epoxy resin, (b) a curing agent, (c) a phenolic hydroxyl-containing polyamide-poly(butadiene-acrylonitrile) copolymer, and (d) an ion capturing agent and having a glass transition temperature of 80° C. or higher after cure, and the heat-resistant film mainly comprises a polyimide containing a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component and has a specific coefficient of linear thermal expansion and a specific tensile modulus in both machine and transverse directions.
摘要:
An objective of this application is to provide a sealant for liquid crystals witch is extremely less apt to contaminate liquid crystals and has high adhesion strength. This application discloses a sealant for liquid crystals comprising as essential ingredients (a) a radiation-curable resin represented by the general formula (1): wherein R1 represents a hydrogen atom or a methyl group, R2 represents a hydrogen atom, a halogen atom, a hydroxyl group, a linear, branch or cyclic monovalent alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, m represents an integer of 1 to 4, and may be the same or different, R3 represents a hydrogen atom or a methyl group, and the number n of the repeating units is a positive number in the range of 0 to 20; (b) a photopolymerization initiator; and (c) an inorganic filler having an average particle diameter of 3 μm or less.
摘要翻译:该应用的目的在于提供一种液晶密封剂,其极易污染液晶并具有高粘合强度。 本申请公开了一种液晶密封剂,其包含作为必要成分的(a)由通式(1)表示的可辐射固化树脂:其中R 1表示氢原子或甲基, O 2表示氢原子,卤素原子,羟基,具有1〜10个碳原子的直链,支链或环状一价烷基或碳原子数1〜10的烷氧基,m表示 1〜4的整数,可以相同或不同,R 3表示氢原子或甲基,重复单元的数n为0〜 20; (b)光聚合引发剂; 和(c)平均粒径为3μm以下的无机填料。
摘要:
The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 μm.
摘要:
An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.
摘要:
An objective of this application is to provide a sealant for liquid crystals witch is extremely less apt to contaminate liquid crystals and has high adhesion strength. This application discloses a sealant for liquid crystals comprising as essential ingredients (a) a radiation-curable resin represented by the general formula (1): wherein R1 represents a hydrogen atom or a methyl group, R2 represents a hydrogen atom, a halogen atom, a hydroxyl group, a linear, branch or cyclic monovalent alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, m represents an integer of 1 to 4, and may be the same or different, R3 represents a hydrogen atom or a methyl group, and the number n of the repeating units is a positive number in the range of 0 to 20; (b) a photopolymerization initiator; and (c) an inorganic filler having an average particle diameter of 3 μm or less.
摘要:
Disclosed is a sealing material for liquid crystals having high adhesion strength and excellent gap-forming power at bonding of panels. Also disclosed are a method for producing such a sealing material and a method for producing a liquid crystal display cell which is improved in productivity, high-speed response and reliability. The sealing material for liquid crystals is produced through a step wherein fine particles (D) having an average particle size of not more than 3 μm are dispersed, using a wet dispersion unit (A), in a reactive resin (C) having an epoxy group and/or a (meth)acryloyl group which resin has been dissolved in a solvent (B) and a following step wherein the solvent (B) is removed.
摘要:
Disclosed is a sealing material for liquid crystals having high adhesion strength and excellent gap-forming power at bonding of panels. Also disclosed are a method for producing such a sealing material and a method for producing a liquid crystal display cell which is improved in productivity, high-speed response and reliability. The sealing material for liquid crystals is produced through a step wherein fine particles (D) having an average particle size of not more than 3 μm are dispersed, using a wet dispersion unit (A), in a reactive resin (C) having an epoxy group and/or a (meth)acryloyl group which resin has been dissolved in a solvent (B) and a following step wherein the solvent (B) is removed.
摘要:
The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.
摘要:
The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.