Cover-lay film and printed circuit board having the same
    2.
    发明授权
    Cover-lay film and printed circuit board having the same 失效
    覆盖膜和印刷电路板具有相同的性能

    公开(公告)号:US06794031B2

    公开(公告)日:2004-09-21

    申请号:US10252697

    申请日:2002-09-24

    IPC分类号: B32B702

    摘要: A cover-lay film comprising a heat-resistant film and an adhesive layer, wherein the adhesive layer is formed of an epoxy resin composition containing (a) an epoxy resin, (b) a curing agent, (c) a phenolic hydroxyl-containing polyamide-poly(butadiene-acrylonitrile) copolymer, and (d) an ion capturing agent and having a glass transition temperature of 80° C. or higher after cure, and the heat-resistant film mainly comprises a polyimide containing a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component and has a specific coefficient of linear thermal expansion and a specific tensile modulus in both machine and transverse directions.

    摘要翻译: 1.一种覆盖膜,包括耐热膜和粘合剂层,其中所述粘合剂层由环氧树脂组合物形成,所述环氧树脂组合物包含(a)环氧树脂,(b)固化剂,(c)含酚羟基的 聚酰胺 - 聚(丁二烯 - 丙烯腈)共聚物,(d)离子捕获剂,固化后玻璃化转变温度为80℃以上,耐热膜主要包含含有3,3' 4,4'-联苯四羧酸组分和对苯二胺组分,并且在机器横向上具有特定的线性热膨胀系数和比拉伸模量。

    Sealing material for liquid crystal and method for producing same
    7.
    发明申请
    Sealing material for liquid crystal and method for producing same 审中-公开
    液晶密封材料及其制造方法

    公开(公告)号:US20090188616A1

    公开(公告)日:2009-07-30

    申请号:US12383130

    申请日:2009-03-20

    摘要: Disclosed is a sealing material for liquid crystals having high adhesion strength and excellent gap-forming power at bonding of panels. Also disclosed are a method for producing such a sealing material and a method for producing a liquid crystal display cell which is improved in productivity, high-speed response and reliability. The sealing material for liquid crystals is produced through a step wherein fine particles (D) having an average particle size of not more than 3 μm are dispersed, using a wet dispersion unit (A), in a reactive resin (C) having an epoxy group and/or a (meth)acryloyl group which resin has been dissolved in a solvent (B) and a following step wherein the solvent (B) is removed.

    摘要翻译: 公开了一种用于液晶的密封材料,其具有高的粘合强度和在接合面板时具有优异的间隙形成能力。 还公开了一种生产这种密封材料的方法和一种提高生产率,高速响应和可靠性的液晶显示单元的制造方法。 通过使用湿分散单元(A)在具有环氧树脂的反应性树脂(C)中分散平均粒径不大于3μm的细颗粒(D)的步骤来制备液晶用密封材料 基团和/或已经溶解在溶剂(B)中的(甲基)丙烯酰基和其中除去溶剂(B)的后续步骤。

    Sealing Material for Liquid Crystal and Method for Producing Same
    8.
    发明申请
    Sealing Material for Liquid Crystal and Method for Producing Same 审中-公开
    液晶密封材料及其制造方法

    公开(公告)号:US20080063816A1

    公开(公告)日:2008-03-13

    申请号:US10591201

    申请日:2005-03-11

    IPC分类号: C09K19/52 B29C71/04 C08L63/00

    摘要: Disclosed is a sealing material for liquid crystals having high adhesion strength and excellent gap-forming power at bonding of panels. Also disclosed are a method for producing such a sealing material and a method for producing a liquid crystal display cell which is improved in productivity, high-speed response and reliability. The sealing material for liquid crystals is produced through a step wherein fine particles (D) having an average particle size of not more than 3 μm are dispersed, using a wet dispersion unit (A), in a reactive resin (C) having an epoxy group and/or a (meth)acryloyl group which resin has been dissolved in a solvent (B) and a following step wherein the solvent (B) is removed.

    摘要翻译: 公开了一种用于液晶的密封材料,其具有高的粘合强度和在接合面板时具有优异的间隙形成能力。 还公开了一种生产这种密封材料的方法和一种提高生产率,高速响应和可靠性的液晶显示单元的制造方法。 通过使用湿分散单元(A)在具有环氧树脂的反应性树脂(C)中分散平均粒径不大于3μm的细颗粒(D)的步骤来制备液晶用密封材料 基团和/或已经溶解在溶剂(B)中的(甲基)丙烯酰基和其中除去溶剂(B)的后续步骤。

    Adhesive aid composition
    9.
    发明授权
    Adhesive aid composition 失效
    粘合剂组合物

    公开(公告)号:US07517553B2

    公开(公告)日:2009-04-14

    申请号:US10573303

    申请日:2004-05-11

    IPC分类号: B05D1/38

    摘要: The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.

    摘要翻译: 本发明提供一种粘合剂组合物,其具有优异的聚酰亚胺膜粘合强度,而不降低机械性能并且可用于电材料领域。 本发明的粘合剂助剂组合物含有含酚羟基的聚酰胺和作为必要成分的溶剂。 含酚羟基的聚酰胺优选具有由式(1)表示的链段:(其中R1表示二价芳族基团,n表示取代基的平均数,为1〜4的正数)。 本发明的粘合剂组合物适合用于粘合聚酰亚胺薄膜。

    Adhesive aid composition
    10.
    发明申请
    Adhesive aid composition 失效
    粘合剂组合物

    公开(公告)号:US20070026227A1

    公开(公告)日:2007-02-01

    申请号:US10573303

    申请日:2004-05-11

    IPC分类号: B32B7/12 B32B27/00

    摘要: The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.

    摘要翻译: 本发明提供一种粘合剂组合物,其具有优异的聚酰亚胺膜粘合强度,而不降低机械性能并且可用于电材料领域。 本发明的粘合剂助剂组合物含有含酚羟基的聚酰胺和作为必要成分的溶剂。 含酚羟基的聚酰胺优选具有由式(1)表示的链段:(其中R 1表示二价芳族基团,n表示取代基的平均数,为正数1 到4)。 本发明的粘合剂组合物适合用于粘合聚酰亚胺薄膜。