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公开(公告)号：US20220146936A1
公开(公告)日：2022-05-12
申请号：US17092867
申请日：2020-11-09
申请人： Daniel J. Nawrocki , Yasumasa Akatsuka , Katie Han
发明人： Daniel J. Nawrocki , Yasumasa Akatsuka , Katie Han
摘要： Disclosed and claimed herein are photoimageable dielectric compositions for dielectric passivation layers, dielectric protection layers as well as dielectric redistribution layers for use in the manufacture of semiconductors, semiconductor packages and circuit board constructions. More specifically it relates to photoimageable polymers containing vinyl groups capable of being crosslinked during processing and post cured at lower temperatures and shorter times than conventional dielectric materials. The processed compositions are characterized by low dielectric constants and low dissipation factors as well as low moisture uptake, chemical and thermal stability, flexibility and excellent HAST (Highly Accelerated Stress Test) and TCT (Thermal Cycling Test) results. The invention also relates to low dk/df dielectric compositions that are not photoimageable
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2.发明申请Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof 审中-公开纤维包含热固性聚酰胺树脂组合物，无纺织物及其生产方法公开(公告)号：US20120178332A1
公开(公告)日：2012-07-12
申请号：US13395972
申请日：2010-10-22
CPC分类号： D04H1/549 , C08L63/00 , C08L77/10 , D01D5/0007 , D01F6/80 , D01F6/90 , D04H1/587 , D04H1/728 , Y10T428/298 , Y10T442/626 , C08L2666/20 , C08L2666/22
摘要： The present invention relates to a fiber comprising a heat curable polyamide resin composition containing both a) a phenolic hydroxy group-containing polyamide and b) an epoxy resin having two or more epoxy groups in one molecule, a nanofiber comprising said resin composition obtained by electrospinning method, a nonwoven fabric obtained by applying heat treatment to a laminate of said nanofiber, a method for producing said nanofiber by electrospinning method and a heat curable polyamide resin composition for fiber. A nonwoven fabric can be obtained only by subjecting a deposit of the nanofiber obtained by electrospinning method to heat treatment, nanofibers in the obtained nonwoven fabric are bonded to each other by heat-curing, and the nonwoven fabric has such characteristics that its mechanical strength, heat resistance and chemical resistance are excellent and that it has a high strength.
摘要翻译： 本发明涉及包含含有a）含酚羟基的聚酰胺和b）在一分子中具有两个或更多个环氧基的环氧树脂的热固化性聚酰胺树脂组合物的纤维，包含通过静电纺丝得到的所述树脂组合物的纳米纤维 方法，通过对所述纳米纤维的层压体进行热处理获得的无纺布，通过静电纺丝法生产所述纳米纤维的方法和用于纤维的热固化性聚酰胺树脂组合物。 通过将通过静电纺丝法得到的纳米纤维的沉积物进行热处理，可以得到无纺布，通过热固化将得到的无纺布中的纳米纤维彼此接合，无纺布的机械强度， 耐热性和耐化学性优异，强度高。
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3.发明授权公开(公告)号：US07608336B2
公开(公告)日：2009-10-27
申请号：US11148471
申请日：2005-06-09
CPC分类号： C08L63/00 , Y10T428/31511 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725 , C08L2666/20
摘要： The invention relates to an epoxy resin composition containing (a) an epoxy resin and (b) a phenolic hydroxy group-containing polyamide resin having the structure represented by Formula (1), a method of curing the composition, a varnish, prepreg, or sheet using the composition, and an epoxy resin composition having the polyamide resin represented by Formula (1) as the active component.Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a flame resistance even though the cured compositions do not contain a halogen flame retardant, an antimony compound, or the like and are superior in heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like. (wherein, l and m are averages, satisfying the formula: m/(l+m)=0.01; and l+m is a positive number of 2 to 200. Ar1 represents a bivalent aromatic group; Ar2 represents a phenolic hydroxyl group-containing bivalent aromatic group; and Ar3 represents: -ph(R1)n- or -ph(R2)n-X-ph(R3)n-, wherein, -ph(R1)n-, -ph(R2)n- and -ph(R3)n- represent respectively R1-substituted, R2-substituted and R3-substituted phenylene groups, or an unsubstituted phenylene group; n is an integer of 0 to 3; R1, R2 and R3 each independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, S, CO, SO2 or a single bond).
摘要翻译： 本发明涉及包含（a）环氧树脂和（b）具有由式（1）表示的结构的含酚羟基的聚酰胺树脂的环氧树脂组合物，该组合物的固化方法，清漆，预浸料或 和具有由式（1）表示的聚酰胺树脂作为活性成分的环氧树脂组合物。 根据本发明的环氧树脂组合物的固化产物在形成薄膜时具有足够的高柔性，即使固化组合物不含卤素阻燃剂，锑化合物等，也具有阻燃性，并且是 耐热性和粘合性优异，因此在广泛的应用中非常有用，例如作为模制材料，铸造材料，层压材料，油漆，粘合剂，抗蚀剂等。 （其中，l和m是平均值，满足公式：m /（1 + m）= 0.01; l + m是2〜200的正数.Ar1表示二价芳基; Ar2表示酚羟基 - 含有二价芳基; Ar 3表示-ph（R 1）n或-ph（R 2）n X-ph（R 3）n - ，其中-ph（R 1）n - ，-ph（R 2） ph（R3）n-分别表示R1取代的，R2取代的和R3取代的亚苯基或未取代的亚苯基; n是0-3的整数; R1，R2和R3各自独立地表示C1〜C3烷基 基团或C1-C3烷氧基; X表示O，S，CO，SO2或单键）。
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4.发明申请Epoxy Resin, Hardenable Resin Composition Containing the Same and Use Thereof 审中-公开环氧树脂，含有该树脂的可硬化树脂组合物及其用途公开(公告)号：US20080200636A1
公开(公告)日：2008-08-21
申请号：US11884174
申请日：2006-02-20
IPC分类号： C08G65/38
CPC分类号： C08G59/3218 , C08L63/00
摘要： It is an object of the present invention, with respect to a phenol aralkyl type epoxy resin, to suppress any crystal precipitation, improve the quality manageability and operation efficiency at composition production and enhance the properties, including heat resistance, thereof. It is also intended to provide a resin composition that even when stored in the form of a varnish for a prolonged period of time, is resistant to crystal precipitation, excelling in storage stability and operation efficiency, and that gives a hardening product of low dielectric constant and low dielectric tangent excelling in heat resistance, water resistance and flame retardance.There is provided an epoxy resin characterized by comprising a phenol aralkyl type epoxy resin in which a content (an area % measured by gel permeation chromatography) of a bifunctional compound is 20% or less, and provided a resin composition obtained therefrom.
摘要翻译： 本发明的目的是关于苯酚芳烷基型环氧树脂，以抑制任何晶体沉淀，提高组合物生产中的质量管理性和操作效率，并提高其耐热性的性能。 另外，为了提供一种树脂组合物，即使长时间地以清漆的形式存储，也能够耐结晶析出，保存稳定性和操作效率优异，并且能够得到低介电常数的硬化物 低介电切线耐热性，耐水性和阻燃性优异。 提供一种环氧树脂，其特征在于包含其中通过双官能化合物的含量（通过凝胶渗透色谱法测量的面积％）为20％以下的苯酚芳烷基型环氧树脂，并提供由其获得的树脂组合物。
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公开(公告)号：US20080021173A1
公开(公告)日：2008-01-24
申请号：US11629313
申请日：2005-06-24
CPC分类号： C08G59/08
摘要： The present invention relates to an epoxy resin whose cured product has a high heat resistance, and directed to provide an epoxy resin improved in adhesiveness and toughness in comparison with the conventional highly heat resistant epoxy resin. Specifically disclosed is an epoxy resin obtainable by glycidylation of a mixture of (a) a phenol compound condensate which is a condensate of phenols and glyoxal and contains not less than 80% (area % by a gel permeation chromatography) of a compound represented by the formula (1): (wherein R represents each independently a hydrogen atom, (C1-C15) hydrocarbon group or trifluoromethyl group); and (b) a phenol compound other than (a) or a phenol resin.
摘要翻译： 本发明涉及一种环氧树脂，其固化产物具有高耐热性，并且旨在提供一种与传统的高耐热性环氧树脂相比提高粘合性和韧性的环氧树脂。 具体公开了通过将（a）酚化合物缩合物（酚类和乙二醛的缩合物）的混合物的缩水甘油化而得到的环氧树脂，并且含有不少于80％（通过凝胶渗透色谱法的面积％）由 式（1）：（其中R表示各自独立地为氢原子，（C 1 -C 15 -C 15）烃基或三氟甲基）。 和（b）除（a）以外的酚化合物或酚醛树脂。
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6.发明申请公开(公告)号：US20060058469A1
公开(公告)日：2006-03-16
申请号：US10536206
申请日：2003-11-27
CPC分类号： B32B27/06 , B32B7/06 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/281 , B32B27/38 , B32B2260/046 , B32B2307/3065 , C08L63/00 , C08L77/00 , C08L77/06 , C08L2666/20
摘要： The invention relates to an epoxy resin composition containing (a) an epoxy resin and (b) a phenolic hydroxy group-containing polyamide resin having the structure represented by Formula (1), a method of curing the composition, a varnish, prepreg, or sheet using the composition, and an epoxy resin composition having the polyamide resin represented by Formula (1) as the active component. Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a flame resistance even though the cured compositions do not contain a halogen flame retardant, an antimony compound, or the like and are superior in heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like. (wherein, l and m are averages, satisfying the formula: m/(l+m)≧0.05; and l+m is a positive number of 2 to 200. Ar1 represents a bivalent aromatic group; Ar2 represents a phenolic hydroxyl group-containing bivalent aromatic group; and Ar3 represents: —NH-ph(R1)n-NH— or —NH-ph(R2)n-X-ph(R3)n-NH—, wherein, -ph(R1)n-, -ph(R2)n- and -ph(R3)n- represent respectively R1-substituted, R2-substituted and R3-substituted phenylene groups, or an unsubstituted phenylene group; n is an integer of 0 to 3; R1, R2 and R3 each independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, S, CO, SO2 or a single bond)
摘要翻译： 本发明涉及包含（a）环氧树脂和（b）具有由式（1）表示的结构的含酚羟基的聚酰胺树脂的环氧树脂组合物，该组合物的固化方法，清漆，预浸料或 和具有由式（1）表示的聚酰胺树脂作为活性组合物的环氧树脂组合物
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公开(公告)号：US20120288725A1
公开(公告)日：2012-11-15
申请号：US13575614
申请日：2011-03-10
IPC分类号： C09J177/00 , B32B15/08
CPC分类号： B32B15/01 , C08G69/265 , C08G69/32 , C08K3/013 , C08K3/28 , C08K3/38 , C08L63/00 , C08L77/10 , C08L2666/22 , C09D177/06 , C09D177/10 , C09J163/00 , C09J177/06 , C09J177/10 , H01L2924/0002 , Y10T428/31681 , H01L2924/00
摘要： Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005≦n/(m+n)
摘要翻译： 公开了一种耐热粘合剂，其包括：具有由下式（1）表示的结构的酚羟基的芳族聚酰胺树脂（A）（式中，m和n各自表示平均值，满足关系式：0.005 ＆nlE; n /（m + n）<1，m + n是大于0但等于或小于200的整数，Ar 1表示二价芳族基团，Ar 2表示具有酚羟基的二价芳基 ，Ar 3表示二价芳香族基团），环氧树脂（B），固化催化剂（C），无机填料（D），以及作为任意成分的成分（A）以外的环氧树脂固化剂， 其中组分（D）的含量相对于组分（A）至（C）和环氧树脂固化剂的总量相对于100质量份为任意成分为30〜950质量份。 当电路等和散热板彼此粘合时，粘合剂的固化层不仅具有高耐热性和高粘合性，而且具有高导热性，并且还具有高导热性 绝佳的保温性能。 此外，固化的粘合剂是阻燃剂，因此粘合剂作为高功能半导体周边材料是非常有用的。
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8.发明授权公开(公告)号：US07521100B2
公开(公告)日：2009-04-21
申请号：US10552183
申请日：2004-04-06
申请人： Masahiro Imaizumi , Toyofumi Asano , Naoyuki Ochi , Masahiro Hirano , Sumio Ichimura , Masaru Kudo , Katsuhiko Oshimi , Masataka Nakanishi , Yasumasa Akatsuka , Eiichi Nishihara , Masayuki Itai
发明人： Masahiro Imaizumi , Toyofumi Asano , Naoyuki Ochi , Masahiro Hirano , Sumio Ichimura , Masaru Kudo , Katsuhiko Oshimi , Masataka Nakanishi , Yasumasa Akatsuka , Eiichi Nishihara , Masayuki Itai
IPC分类号： C09K3/10 , G02F1/1339 , C08L63/02 , C08G59/04
CPC分类号： C08L63/00 , C08G59/04 , G02F1/1339 , Y10T428/10 , Y10T428/1059 , Y10T428/1073
摘要： The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 μm.
摘要翻译： 本发明涉及一种液晶污染性极差的液晶密封剂，对基材的涂布性和粘接性，使用寿命长，使用寿命长，粘结强度高的特点。 本发明的液晶密封剂的特征在于：（a）由通式（1）表示的环氧树脂：其中a表示2〜4的整数，n表示0〜3（平均值），R表示 如果n为0，（a）由通式（1）表示的环氧树脂为双酚S-基，则表示2〜6个碳原子的二价烃基; A表示多价芳基; G表示缩水甘油基， 型），（b）热固化剂，（c）和平均粒径不大于3μm的填料。
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9.发明申请EPOXY RESIN, EPOXY RESIN COMPOSITION, AND PREPREG AND LAMINATED PLATE USING THE EPOXY RESIN COMPOSITION 审中-公开环氧树脂，环氧树脂组合物，以及使用环氧树脂组合物的预制板和层压板公开(公告)号：US20090054587A1
公开(公告)日：2009-02-26
申请号：US11908526
申请日：2006-03-14
CPC分类号： C08G59/245 , C09D163/00 , Y10T428/31511
摘要： An object of the present invention is to provide an epoxy resin exhibiting superior heat resistance, dielectric properties, water resistance, and workability, a resin composition containing the epoxy resin, and a prepreg and a laminated plate. The epoxy resin of the invention is expressed by the following formula. (In the formula, R represents a hydrocarbon group having a carbon number of 1 to 4. m Represents an integer of 1 to 4 and when m is 2 to 4, R's may be the same or different. n Represents a positive number of 1 to 6 on average.) The epoxy resin composition of the invention contains the epoxy resin of the invention and a curing agent.
摘要翻译： 本发明的目的是提供一种表现出优异的耐热性，介电性能，耐水性和可加工性的环氧树脂，含有环氧树脂的树脂组合物，以及预浸料和层压板。 本发明的环氧树脂由下式表示。 （式中，R表示碳原子数为1〜4的烃基。m表示1〜4的整数，m为2〜4时，R可以相同或不同，n表示正数1 平均为6）。本发明的环氧树脂组合物含有本发明的环氧树脂和固化剂。
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公开(公告)号：US20070161100A1
公开(公告)日：2007-07-12
申请号：US10597799
申请日：2005-02-08
IPC分类号： B09C1/10
摘要： Disclosed is a photosensitive resin composition comprising a resin (A) soluble in an aqueous alkaline solution, a crosslinking agent (B), a photopolymerization initiator (C) and a curing agent (D) wherein the curing agent (D) is an epoxy compound obtained by glycidylating a compound containing not less than 80% of a tetraphenylethane derivative represented by the following formula (1). In the formula, R1 to R8 independently represents a hydrogen atom, a C1-C4 alkyl group or a halogen atom.
摘要翻译： 公开了包含可溶于碱性水溶液的树脂（A），交联剂（B），光聚合引发剂（C）和固化剂（D））的感光性树脂组合物，其中固化剂（D）为环氧化合物 通过使含有不少于80％由下式（1）表示的四苯乙烷衍生物的化合物缩水甘油化得到。 在该式中，R 1至R 8独立地表示氢原子，C 1 -C 4 - C 4 - 烷基 基团或卤素原子。
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