公开(公告)号：US08895677B2

公开(公告)日：2014-11-25

申请号：US13364062

申请日：2012-02-01

申请人： Chung Kun Cho ,  Kalinina Fedosya ,  Kovalev Mikhail ,  Sang Mock Lee

发明人： Chung Kun Cho ,  Kalinina Fedosya ,  Kovalev Mikhail ,  Sang Mock Lee

IPC分类号： C08L77/00 ,  C08G69/32 ,  C08G69/26 ,  C09J177/10 ,  D01F6/80 ,  C08G69/28 ,  C08L77/10 ,  C08J5/18 ,  C08G69/42 ,  C09D177/10

CPC分类号： C08G69/32 ,  C08G69/265 ,  C08G69/28 ,  C08G69/42 ,  C08G81/00 ,  C08J5/18 ,  C08J2377/10 ,  C08L77/10 ,  C09D177/10 ,  C09J177/10 ,  D01F6/805

摘要： A polyamide block copolymer that includes a first segment including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second segment including a repeating unit represented by Chemical Formula 3. The variables R1 to R15, and n1 to n8 are defined herein.

摘要翻译： 一种聚酰胺嵌段共聚物，其包含包含由化学式1表示的重复单元的第一区段，由化学式2表示的重复单元或其组合; 和包含由化学式3表示的重复单元的第二区段。变量R1至R15和n1至n8在本文中定义。

公开(公告)号：US3261884A

公开(公告)日：1966-07-19

申请号：US24889963

申请日：1963-01-02

申请人： DU PONT

发明人： GORTON BERT S

IPC分类号： C08L77/00 ,  C09J161/06

CPC分类号： C09J177/10 ,  C08L61/06 ,  C08L77/00 ,  C09J161/06 ,  Y10T428/24033 ,  Y10T428/31623 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31725 ,  Y10T428/31765

摘要： A reactive composition comprises 65 to 99 parts by weight of a polyamide having the recurring group where R1 is an alkylene radical having 2 to 16 carbon atoms and R2 is hydrogen, an alkyl radical having 1 to 5 carbon atoms or a halogen, said polyamide having a molecular weight of 1000 to 35,000, and correspondingly 35 to 1 parts by weight of a novolac having a viscosity of 50-200,000 centipoises at 25 DEG C., not more than about 50% by weight of the phenolic constituent of said novolac being substituted with an alkyl group containing more than 3 carbon atoms. Specified polyamides are poly(hexamethylene isophthalamide), poly(hexamethylene 5 - t. - butylisophthalamide), poly(hexamethylene 5 - chloro - isophthalamide), poly(decamethylene isophthalamide) and poly(1:2-propylene isophthalamide). Specified novolacs are those made by reacting formaldehyde with phenol, m-cresol, resorcinol and/or naphthol. The compositions may be used as adhesives in the preparation of laminates.

公开(公告)号：US20030150557A1

公开(公告)日：2003-08-14

申请号：US10208422

申请日：2002-07-30

发明人： Recai Sezi ,  Andreas Walter

IPC分类号： B29C065/00

CPC分类号： C09J5/06 ,  C08G69/265 ,  C08G69/32 ,  C08L77/00 ,  C09J5/00 ,  C09J177/00 ,  C09J177/06 ,  C09J177/10 ,  C09J179/00 ,  C09J2477/00 ,  H01L24/29 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10S526/935 ,  Y10T156/10 ,  Y10T428/28 ,  Y10T428/31504 ,  Y10T428/31562 ,  Y10T428/31591 ,  Y10T428/31598 ,  Y10T428/31601 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31725 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

摘要翻译： 本发明描述了多羟基酰胺（PHA）用于粘合物品或材料，特别是诸如芯片和晶片的半导体工业中使用的部件的粘合剂的使用，粘合材料特别是芯片和/或晶片的方法 ，由该方法生产的芯片和/或晶片叠层以及包含式（I）的聚邻羟基酰胺的粘合剂组合物。

公开(公告)号：US3646154A

公开(公告)日：1972-02-29

申请号：US3646154D

申请日：1970-02-02

申请人： GRACE W R & CO

发明人： MARANS NELSON S ,  FRANK VICTOR S

IPC分类号： C08L77/00 ,  C09J123/08 ,  C09J127/06 ,  C08G41/04

CPC分类号： C09J123/08 ,  C08L23/0853 ,  C08L2666/14 ,  C08L2666/20 ,  C09J127/06 ,  C09J177/10 ,  C08L27/06 ,  C08L77/06 ,  C08L23/08

摘要： THIS INVENTION RTELATES TO A HOT MELT ADHESIVE RESIN COMPOSITION WHICH CAN BE SET BY HEAT FAND PRESSURE TO BOND TO SOLID SURFACES. THE ADHESIVE COMPOSTION CONSISTS ESSENTIALLY OF ETHYLENE-CONTAINING POLAR COPOLYMER OR TERPOLYMER IN COMBINATION WITH 10-60% BY WEIGHT OF THE COMPOSITION OF A POLYAMIDE WHICH IS THE REACTION PRODUCT OF AN ALKYLENE OR ARYLENE POLYAMINE OF THE FORMULA:

H2N-(R-NH)X-R''-NH2

WHEREIN R AND R'' ARE ALKYLENE, ARYLALKYLENE AND ARYLENE AND X IS 0 TO 3, AND ALKYLENE DICARBOXYLIC ACID OR ITS ESTES. THE ADHESIVE CAN BE USED TO BOND METAL, CERAMIC, LEATHER, PAPER, WOOD, PLASTIC AND OTHER SURFACES.

公开(公告)号：US3261882A

公开(公告)日：1966-07-19

申请号：US24889263

申请日：1963-01-02

申请人： DU PONT

发明人： GORTON BERT S

IPC分类号： C08L77/00 ,  C09J163/00

CPC分类号： C09J177/10 ,  C08L63/00 ,  C08L77/00 ,  C09J163/00 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31681 ,  Y10T428/31779

摘要： A composition comprises 65 to 95 parts by weight of a polyamide having the recurring group where R1 is a C2-C16 alkylene radical and R2 is hydrogen, a C1-C2 alkyl radical or a halogen, said polyamide having a molecular weight of 1,000 to 35,000, and correspondingly 35 to 5 parts by weight of a polyepoxide having at least two epoxy groups per molecule. Specified polyamides are those derived from alkylene diamines having 2 to 16 carbon atoms e.g. hexamethylene, tetramethylene, decamethylene, undecamethylene, dodecamethylene, hexadecamethylene and ethylene diamine and isophthalic, 5-1-butyl isophthalic, 5-chloro-isophthalic, methyl isophthalic, propyl isophthalic, isopropyl isophthalic, hexyl isophthalic or 5-fluoro-isophthalic acid. Specified polyepoxides are the reaction products of polyhydric alcohols or phenols e.g. glycols, glycerol, trimethylol propane, bis-phenol-A and polyphenols with epihalohydrins. The two polymers may be blended together in a polyamide solvent e.g. dimethylacetamide or dimethyl formamide or the dry powders may be mixed together optionally in the presence of a solvent for the polyepoxide e.g. acetone, methyl ethyl ketone, toluene, trichlorethylene or perchloroethylene. The resins react on the application of heat.

公开(公告)号：US20120296037A1

公开(公告)日：2012-11-22

申请号：US13364062

申请日：2012-02-01

申请人： Chung Kun CHO ,  Kalinina FEDOSYA ,  Kovalev MIKHAIL ,  Sang Mock LEE

发明人： Chung Kun CHO ,  Kalinina FEDOSYA ,  Kovalev MIKHAIL ,  Sang Mock LEE

IPC分类号： C08G81/00 ,  C09J177/00 ,  C09D177/00

CPC分类号： C08G69/32 ,  C08G69/265 ,  C08G69/28 ,  C08G69/42 ,  C08G81/00 ,  C08J5/18 ,  C08J2377/10 ,  C08L77/10 ,  C09D177/10 ,  C09J177/10 ,  D01F6/805

摘要： A polyamide block copolymer that includes a first segment including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second segment including a repeating unit represented by Chemical Formula 3. The variables R1 to R15, and n1 to n8 are defined herein.

摘要翻译： 一种聚酰胺嵌段共聚物，其包含包含由化学式1表示的重复单元的第一区段，由化学式2表示的重复单元或其组合; 和包含由化学式3表示的重复单元的第二区段。变量R1至R15和n1至n8在本文中定义。

公开(公告)号：US20120288725A1

公开(公告)日：2012-11-15

申请号：US13575614

申请日：2011-03-10

申请人： Ryutaro Tanaka ,  Makoto Uchida ,  Shigeru Moteki ,  Yasumasa Akatsuka

发明人： Ryutaro Tanaka ,  Makoto Uchida ,  Shigeru Moteki ,  Yasumasa Akatsuka

IPC分类号： C09J177/00 ,  B32B15/08

CPC分类号： B32B15/01 ,  C08G69/265 ,  C08G69/32 ,  C08K3/013 ,  C08K3/28 ,  C08K3/38 ,  C08L63/00 ,  C08L77/10 ,  C08L2666/22 ,  C09D177/06 ,  C09D177/10 ,  C09J163/00 ,  C09J177/06 ,  C09J177/10 ,  H01L2924/0002 ,  Y10T428/31681 ,  H01L2924/00

摘要： Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005≦n/(m+n)

摘要翻译： 公开了一种耐热粘合剂，其包括：具有由下式（1）表示的结构的酚羟基的芳族聚酰胺树脂（A）（式中，m和n各自表示平均值，满足关系式：0.005 ＆nlE; n /（m + n）<1，m + n是大于0但等于或小于200的整数，Ar 1表示二价芳族基团，Ar 2表示具有酚羟基的二价芳基 ，Ar 3表示二价芳香族基团），环氧树脂（B），固化催化剂（C），无机填料（D），以及作为任意成分的成分（A）以外的环氧树脂固化剂， 其中组分（D）的含量相对于组分（A）至（C）和环氧树脂固化剂的总量相对于100质量份为任意成分为30〜950质量份。 当电路等和散热板彼此粘合时，粘合剂的固化层不仅具有高耐热性和高粘合性，而且具有高导热性，并且还具有高导热性 绝佳的保温性能。 此外，固化的粘合剂是阻燃剂，因此粘合剂作为高功能半导体周边材料是非常有用的。

公开(公告)号：US3550806A

公开(公告)日：1970-12-29

申请号：US3550806D

申请日：1966-05-25

申请人： GEN MILLS INC

发明人： PEERMAN DWIGHT E ,  VERTNIK LEONARD R ,  ROGIER EDGAR R

IPC分类号： B65D8/22 ,  C08G69/34 ,  C08L77/10 ,  C08L79/00 ,  C09J5/10 ,  C09J177/10 ,  F16K27/06 ,  B65D7/34 ,  C09J5/00

CPC分类号： F16K27/067 ,  C08G69/34 ,  C08L77/10 ,  C08L79/00 ,  C09J5/10 ,  C09J177/10 ,  C09J2477/00 ,  C09J2479/00 ,  Y10T428/24256 ,  Y10T428/31696

公开(公告)号：US07517553B2

公开(公告)日：2009-04-14

申请号：US10573303

申请日：2004-05-11

申请人： Makoto Uchida ,  Toyofumi Asano

发明人： Makoto Uchida ,  Toyofumi Asano

IPC分类号： B05D1/38

CPC分类号： H05K3/386 ,  C09J177/10 ,  Y10T428/2852 ,  Y10T428/31721

摘要： The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.

摘要翻译： 本发明提供一种粘合剂组合物，其具有优异的聚酰亚胺膜粘合强度，而不降低机械性能并且可用于电材料领域。 本发明的粘合剂助剂组合物含有含酚羟基的聚酰胺和作为必要成分的溶剂。 含酚羟基的聚酰胺优选具有由式（1）表示的链段：（其中R1表示二价芳族基团，n表示取代基的平均数，为1〜4的正数）。 本发明的粘合剂组合物适合用于粘合聚酰亚胺薄膜。

公开(公告)号：US20070026227A1

公开(公告)日：2007-02-01

申请号：US10573303

申请日：2004-05-11

申请人： Makoto Uchida ,  Toyofumi Asano

发明人： Makoto Uchida ,  Toyofumi Asano

IPC分类号： B32B7/12 ,  B32B27/00

CPC分类号： H05K3/386 ,  C09J177/10 ,  Y10T428/2852 ,  Y10T428/31721

摘要： The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.

摘要翻译： 本发明提供一种粘合剂组合物，其具有优异的聚酰亚胺膜粘合强度，而不降低机械性能并且可用于电材料领域。 本发明的粘合剂助剂组合物含有含酚羟基的聚酰胺和作为必要成分的溶剂。 含酚羟基的聚酰胺优选具有由式（1）表示的链段：（其中R 1表示二价芳族基团，n表示取代基的平均数，为正数1 到4）。 本发明的粘合剂组合物适合用于粘合聚酰亚胺薄膜。