Non-volatile semiconductor storage device and manufacturing method of the same
    2.
    发明申请
    Non-volatile semiconductor storage device and manufacturing method of the same 有权
    非挥发性半导体存储器件及其制造方法相同

    公开(公告)号:US20070170495A1

    公开(公告)日:2007-07-26

    申请号:US11639134

    申请日:2006-12-15

    IPC分类号: H01L29/792

    摘要: Performance of a non-volatile semiconductor storage device which performs electron writing by hot electrons and hole erasure by hot holes is improved. A non-volatile memory cell which performs a writing operation by electrons and an erasure operation by holes has a p-type well region, isolation regions, a source region, and a drain region provided on an Si substrate. A control gate electrode is formed via a gate insulating film between the source region and the drain region. In a left-side side wall of the control gate electrode, a bottom Si oxide film, an electric charge holding film, a top Si oxide film, and a memory gate electrode are formed. The electric charge holding film is formed from an Si nitride film stoichiometrically excessively containing silicon.

    摘要翻译: 通过热电子进行电子写入和通过热孔进行空穴擦除的非易失性半导体存储装置的性能得到改善。 通过电子执行写入操作和通过空穴的擦除操作的非易失性存储单元具有设置在Si衬底上的p型阱区域,隔离区域,源极区域和漏极区域。 通过栅极绝缘膜在源极区域和漏极区域之间形成控制栅电极。 在控制栅电极的左侧壁形成有底部的氧化硅膜,电荷保持膜,顶部氧化物膜和存储栅电极。 电荷保持膜由化学计量过度地含有硅的氮化硅膜形成。

    Non-volatile memory device with a silicon nitride charge holding film having an excess of silicon
    3.
    发明授权
    Non-volatile memory device with a silicon nitride charge holding film having an excess of silicon 有权
    具有氮化硅电荷保持膜的非易失性存储器件具有过量的硅

    公开(公告)号:US08125012B2

    公开(公告)日:2012-02-28

    申请号:US11639134

    申请日:2006-12-15

    IPC分类号: H01L21/336 H01L21/31

    摘要: Performance of a non-volatile semiconductor storage device which performs electron writing by hot electrons and hole erasure by hot holes is improved. A non-volatile memory cell which performs a writing operation by electrons and an erasure operation by holes has a p-type well region, isolation regions, a source region, and a drain region provided on an Si substrate. A control gate electrode is formed via a gate insulating film between the source region and the drain region. In a left-side side wall of the control gate electrode, a bottom Si oxide film, an electric charge holding film, a top Si oxide film, and a memory gate electrode are formed. The electric charge holding film is formed from an Si nitride film stoichiometrically excessively containing silicon.

    摘要翻译: 通过热电子进行电子写入和通过热孔进行空穴擦除的非易失性半导体存储装置的性能得到改善。 通过电子执行写入操作和通过空穴的擦除操作的非易失性存储单元具有设置在Si衬底上的p型阱区域,隔离区域,源极区域和漏极区域。 通过栅极绝缘膜在源极区域和漏极区域之间形成控制栅电极。 在控制栅电极的左侧壁形成有底部的氧化硅膜,电荷保持膜,顶部氧化物膜和存储栅电极。 电荷保持膜由化学计量过度地含有硅的氮化硅膜形成。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICES WITH CHARGE INJECTION CORNER
    4.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICES WITH CHARGE INJECTION CORNER 有权
    带电荷注射角的非线性半导体存储器件

    公开(公告)号:US20080290401A1

    公开(公告)日:2008-11-27

    申请号:US12124143

    申请日:2008-05-20

    IPC分类号: H01L29/792

    摘要: An erase method where a corner portion on which an electric field concentrates locally is provided on the memory gate electrode, and charges in the memory gate electrode are injected into a charge trap film in a gate dielectric with Fowler-Nordheim tunneling operation is used. Since current consumption at the time of erase can be reduced by the Fowler-Nordheim tunneling, a power supply circuit area of a memory module can be reduced. Since write disturb resistance can be improved, a memory array area can be reduced by adopting a simpler memory array configuration. Owing to both the effects, an area of the memory module can be largely reduced, so that manufacturing cost can be reduced. Further, since charge injection centers of write and erase coincide with each other, so that (program and erase) endurance is improved.

    摘要翻译: 在存储栅电极上设置有局部集中电场的角部的擦除方法,并且使用Fowler-Nordheim隧道操作将存储栅电极中的电荷注入栅极电介质中的电荷陷阱膜。 由于通过Fowler-Nordheim隧道可以减少擦除时的电流消耗,因此可以减少存储器模块的电源电路区域。 由于可以提高写入干扰电阻,所以可以通过采用更简单的存储器阵列配置来减少存储器阵列区域。 由于这两个效果,可以大大减少存储器模块的面积,从而可以降低制造成本。 此外,由于写入和擦除的电荷注入中心彼此一致,所以(编程和擦除)耐久性得到改善。

    Nonvolatile semiconductor memory devices with charge injection corner
    5.
    发明授权
    Nonvolatile semiconductor memory devices with charge injection corner 有权
    具有电荷注入角的非易失性半导体存储器件

    公开(公告)号:US07915666B2

    公开(公告)日:2011-03-29

    申请号:US12124143

    申请日:2008-05-20

    IPC分类号: H01L29/792

    摘要: An erase method where a corner portion on which an electric field concentrates locally is provided on the memory gate electrode, and charges in the memory gate electrode are injected into a charge trap film in a gate dielectric with Fowler-Nordheim tunneling operation is used. Since current consumption at the time of erase can be reduced by the Fowler-Nordheim tunneling, a power supply circuit area of a memory module can be reduced. Since write disturb resistance can be improved, a memory array area can be reduced by adopting a simpler memory array configuration. Owing to both the effects, an area of the memory module can be largely reduced, so that manufacturing cost can be reduced. Further, since charge injection centers of write and erase coincide with each other, so that (program and erase) endurance is improved.

    摘要翻译: 在存储栅电极上设置有局部集中电场的角部的擦除方法,并且使用Fowler-Nordheim隧道操作将存储栅电极中的电荷注入栅极电介质中的电荷陷阱膜。 由于通过Fowler-Nordheim隧道可以减少擦除时的电流消耗,因此可以减少存储器模块的电源电路区域。 由于可以提高写入干扰电阻,所以可以通过采用更简单的存储器阵列配置来减少存储器阵列区域。 由于这两个效果,可以大大减少存储器模块的面积,从而可以降低制造成本。 此外,由于写入和擦除的电荷注入中心彼此一致,所以(编程和擦除)耐久性得到改善。

    Nonvolatile semiconductor device and method of manufacturing the same
    8.
    发明授权
    Nonvolatile semiconductor device and method of manufacturing the same 有权
    非易失性半导体器件及其制造方法

    公开(公告)号:US08796756B2

    公开(公告)日:2014-08-05

    申请号:US13755348

    申请日:2013-01-31

    IPC分类号: H01L29/792

    摘要: A charge storage layer interposed between a memory gate electrode and a semiconductor substrate is formed shorter than a gate length of the memory gate electrode or a length of insulating films so as to make the overlapping amount of the charge storage layer and a source region to be less than 40 nm. Therefore, in the write state, since the movement in the transverse direction of the electrons and the holes locally existing in the charge storage layer decreases, the variation of the threshold voltage when holding a high temperature can be reduced. In addition, the effective channel length is made to be 30 nm or less so as to reduce an apparent amount of holes so that coupling of the electrons with the holes in the charge storage layer decreases; therefore, the variation of the threshold voltage when holding at room temperature can be reduced.

    摘要翻译: 插入在存储栅电极和半导体衬底之间的电荷存储层形成为比存储栅电极的栅极长度或绝缘膜的长度短,以使电荷存储层和源极区域的重叠量成为 小于40nm。 因此,在写入状态下,由于在电荷存储层中局部存在的电子和空穴的横向的移动减少,因此可以降低保持高温时的阈值电压的变化。 此外,有效沟道长度为30nm以下,以减少空穴的表观量,使得电子与电荷存储层中的空穴的耦合减小; 因此,可以降低在室温下保持时的阈值电压的变化。

    Nonvolatile semiconductor memory device
    9.
    发明授权
    Nonvolatile semiconductor memory device 有权
    非易失性半导体存储器件

    公开(公告)号:US07847331B2

    公开(公告)日:2010-12-07

    申请号:US11030900

    申请日:2005-01-10

    IPC分类号: H01L29/792

    摘要: In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.

    摘要翻译: 在存储单元包括ONO膜的情况下,其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极,其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域,通过将BTBT产生的空穴注入氮化硅膜,同时向源极区域施加正电位,向存储栅极施加负电位,向选择栅极施加正电位,进行擦除操作,以及 使电流从漏极区域流向源极区域,从而改善非易失性半导体存储器件的特性。

    Non-volatile semiconductor device and method of fabricating embedded non-volatile semiconductor memory device with sidewall gate
    10.
    发明授权
    Non-volatile semiconductor device and method of fabricating embedded non-volatile semiconductor memory device with sidewall gate 有权
    非易失性半导体器件和制造具有侧壁栅极的嵌入式非易失性半导体存储器件的方法

    公开(公告)号:US07667259B2

    公开(公告)日:2010-02-23

    申请号:US11452256

    申请日:2006-06-14

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a non-volatile semiconductor memory device is provided which overcomes a problem of penetration of implanted ions due to the difference of an optimal gate height in simultaneous formation of a self-align split gate type memory cell utilizing a side wall structure and a scaled MOS transistor. A select gate electrode to form a side wall in a memory area is formed to be higher than that of the gate electrode in a logic area so that the height of the side wall gate electrode of the self-align split gate memory cell is greater than that of the gate electrode in the logic area. Height reduction for the gate electrode is performed in the logic area before gate electrode formation.

    摘要翻译: 提供了一种制造非易失性半导体存储器件的方法,其克服了由于利用侧壁结构同时形成自对准分裂栅型存储单元而产生的最佳栅极高度的差异而引入的注入离子的问题,以及 一个缩放的MOS晶体管。 形成在存储区域中形成侧壁的选择栅电极比逻辑区域中的栅电极高,使得自对准分离栅极存储单元的侧壁栅电极的高度大于 在逻辑区域的栅电极。 栅极电极的高度降低在栅电极形成之前的逻辑区域中进行。