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19 条记录 (耗时 0.023 秒)

    Polyurethane adhesive, method for use in bonding, and use of mixture
    5.
    发明授权
    Polyurethane adhesive, method for use in bonding, and use of mixture 失效
    聚氨酯胶粘剂，粘合方法和混合物的使用

    公开(公告)号：US06353078B1

    公开(公告)日：2002-03-05

    申请号：US09463793

    申请日：2000-01-27

    申请人： Shigeru Murata ,  Masahiko Yasuda ,  Tetsuya Nakajima

    发明人： Shigeru Murata ,  Masahiko Yasuda ,  Tetsuya Nakajima

    IPC分类号： C08G1842

    CPC分类号： C09J175/06 ,  C08G18/4216 ,  C08L2666/36 ,  C09J167/02 ,  Y10S528/905

    摘要： The present invention provides an adhesive comprising a polyester polyol or polyurethane polyol possessing structural units represented by the following general formula (I) within its molecular structure, and an organic polyisocyanate in which the isocyanate groups may be protected: wherein R1 and R2 are the same or different and each represents lower alkyl. The adhesive of the present invention exhibits an excellent initial adhesion strength; and provides adhered objects that exhibit an excellent permanent adhesion strength, hot water resistance, flexibility, flexibility at a low temperature, and fatigue resistance, and is useful in adhering plastic, metal, and the like. In addition, the present invention provides a method of mixing the aforementioned components and using the mixture for adhesion, and a use of the mixture of the aforementioned components.

    摘要翻译： 本发明提供一种粘合剂，其包含在其分子结构中具有由以下通式（I）表示的结构单元的聚酯多元醇或聚氨酯多元醇，其中异氰酸酯基可被保护的有机多异氰酸酯：其中R1和R2相同 或不同，并且各自表示低级烷基。 本发明的粘合剂表现出优异的初始粘合强度; 并且提供具有优异的永久粘合强度，耐热水性，柔软性，低温柔韧性和耐疲劳性的粘合物，并且可用于粘附塑料，金属等。 此外，本发明提供了混合上述组分并使用该混合物进行粘合的方法，以及上述组分的混合物的用途。

    Semiconductor integrated circuit with protection circuit against electrostatic breakdown and layout design method therefor
    7.
    发明授权
    Semiconductor integrated circuit with protection circuit against electrostatic breakdown and layout design method therefor 失效
    具有防静电保护电路的半导体集成电路及其布局设计方法

    公开(公告)号：US5672895A

    公开(公告)日：1997-09-30

    申请号：US575030

    申请日：1995-12-19

    申请人： Takashi Iida ,  Satoru Sumi ,  Hiroshi Shimizu ,  Akinori Tahara ,  Isao Amano ,  Tetsuya Nakajima

    发明人： Takashi Iida ,  Satoru Sumi ,  Hiroshi Shimizu ,  Akinori Tahara ,  Isao Amano ,  Tetsuya Nakajima

    IPC分类号： H01L21/82 ,  H01L21/822 ,  H01L27/02 ,  H01L27/04 ,  H01L27/118 ,  H01L27/01 ,  H01L23/62 ,  H01L27/12 ,  H01L31/0392

    CPC分类号： H01L27/0255 ,  H01L27/11803 ,  H01L2924/0002

    摘要： Diodes rows are arranged at interval L in the same direction as that of arrangement of cell rows. Each of the diodes rows has a row of pn junctions each formed on a substrate and arranged along a track vertical to interconnection tracks. The interconnection between cells automatically connect the gates of MOS transistors to the diodes without the need for considering which gate should be connected to the diode. The length of wiring between the gate of MOS transistor and a diode is less than an upper limit value for preventing electrostatic breakdown at a gate oxide in a process of fabricating the semiconductor integrated circuit. Each of the pn junctions may be formed under necessary input signal lines, necessary ground line, the bottom of the drain of MOS transistor or under the power supply line outside of macrocell.

    摘要翻译： 二极管行以与单元行的排列方向相同的方向以间隔L布置。 每个二极管行具有一排pn结，每一个pn结形成在衬底上并且沿垂直于互连轨道的轨道布置。 单元之间的互连将MOS晶体管的栅极自动连接到二极管，而不需要考虑哪个栅极应连接到二极管。 在制造半导体集成电路的过程中，MOS晶体管的栅极和二极管之间的布线长度小于防止栅极氧化物的静电击穿的上限值。 每个pn结可以形成在必要的输入信号线，必要的接地线，MOS晶体管的漏极的底部或者在宏单元之外的电源线下。

    Connecting structure for connecting conductors in an electronic apparatus
    8.
    发明授权
    Connecting structure for connecting conductors in an electronic apparatus 失效
    电子设备连接导体的连接结构

    公开(公告)号：US4975544A

    公开(公告)日：1990-12-04

    申请号：US323757

    申请日：1989-03-15

    申请人： Nobuyuki Tanaka ,  Taichi Saitoh ,  Akio Kiso ,  Hideo Tokuda ,  Tetsuya Nakajima ,  Minoru Takagi

    发明人： Nobuyuki Tanaka ,  Taichi Saitoh ,  Akio Kiso ,  Hideo Tokuda ,  Tetsuya Nakajima ,  Minoru Takagi

    IPC分类号： H01L23/482

    CPC分类号： H01L23/4824 ,  H01L2924/0002

    摘要： A connecting structure for connecting conductors used for wiring in a semiconductor device comprises a first conductor provided on a part of the semiconductor device for passing the flow of electrons, an insulator provided on the first conductor and formed with a contact hole, and a second conductor provided on the insulator for passing the flow of electrons, in which the second conductor is provided so as to sandwich the insulator together with a part of the first conductor. The first and second conductors are contacted to each other across the insulator at the contact hole so that the electrons flow through the contact hole. The contact hole extends in a general direction of a flow of electrons passing therethrough and has a stepped shape in which a width measured perpendicularly to the general direction of the flow of electrons increases stepwise towards the general direction of the flow of electrons.

    Data transfer device and data transfer system
    9.
    发明授权
    Data transfer device and data transfer system 有权
    数据传输设备和数据传输系统

    公开(公告)号：US08831040B2

    公开(公告)日：2014-09-09

    申请号：US13021550

    申请日：2011-02-04

    申请人： Tetsuya Nakajima ,  Masatoshi Shibasaki ,  Yukihisa Tamura

    发明人： Tetsuya Nakajima ,  Masatoshi Shibasaki ,  Yukihisa Tamura

    IPC分类号： H04J3/06 ,  H04L1/00

    CPC分类号： H04L1/0072

    摘要： A transfer device according to an embodiment transfers blocks generated by dividing a frame into pieces of data and adding a synchronization header each of the pieces of data. The blocks comprise a first, second and third blocks in this order. The transfer device is configured to acquire a first synchronization header in the first block, a second synchronization header in the second block and a third synchronization header in the third block, judge, in a case where a value of the second synchronization header is incorrect, as to whether or not the value of the second synchronization header can be estimated based on the first and the third synchronization headers so that the second block is consistent with the first and third blocks, and correct the second synchronization header into the estimated value.

    摘要翻译： 根据实施例的传送设备将通过将帧划分成多条数据并将每条数据添加同步标题来产生的块传送。 这些块以此顺序包括第一，第二和第三块。 传送装置被配置为获取第一块中的第一同步头，第二块中的第二同步头和第三块中的第三同步头，在第二同步头的值不正确的情况下， 关于是否可以基于第一和第三同步头来估计第二同步头的值，使得第二块与第一和第三块一致，并将第二同步头校正为估计值。

    Resin Tube for Guide Wire, Method for Manufacturing Resin Tube for Guide Wire, and Guide Wire
    10.
    发明申请
    Resin Tube for Guide Wire, Method for Manufacturing Resin Tube for Guide Wire, and Guide Wire 审中-公开
    导丝用树脂管，导丝用树脂管及导丝的制造方法

    公开(公告)号：US20140103273A1

    公开(公告)日：2014-04-17

    申请号：US14124603

    申请日：2012-05-07

    申请人： Tetsuya Nakajima ,  Hideki Kikuchi

    发明人： Tetsuya Nakajima ,  Hideki Kikuchi

    IPC分类号： H02G1/00 ,  B29C47/00

    CPC分类号： H02G1/00 ,  A61M25/09 ,  A61M2025/0062 ,  A61M2025/09108 ,  A61M2025/09133 ,  B29C48/03

    摘要： Provided are a resin tube for a guide wire, a method for manufacturing a resin tube for a guide wire, and a guide wire, configured such that the resin tube makes point contact in the axial direction with an object of contact at working site, thereby reducing frictional resistance and yielding excellent sliding properties, while also being prevented from kinking and collapsing, and having excellent buckling resistance. The resin tube for a guide wire is characterized in that the outer shape of a cross-section perpendicular to the axial direction is polygonal, elliptic, or irregular, that the resin tube is twisted in a helical shape about a deep inner-core hole as the axis of twisting, the deep inner-core hole extending in the axial direction and allowing a core wire to be inserted therein, and that the resin tube is provided with a trunk section having an undulation on the outer surface caused by the twisted eccentric wall thickness.

    摘要翻译： 本发明提供一种导丝用树脂管，导丝用树脂管的制造方法和引导线，其构造成使得树脂管在工作现场与轴向接触的目的物接触，从而 降低摩擦阻力并产生优异的滑动性能，同时防止扭结和塌陷，并且具有优异的抗弯曲性。 用于导丝的树脂管的特征在于，垂直于轴向的横截面的外形是多边形，椭圆形或不规则的，使得树脂管围绕深的内芯孔扭转成螺旋形状，如 扭转轴，深内芯孔沿轴向延伸并允许芯线插入其中，并且树脂管设置有由扭转的偏心壁引起的外表面起伏的主干部分 厚度。