公开(公告)号：US20220199479A1

公开(公告)日：2022-06-23

申请号：US17125487

申请日：2020-12-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L23/31 ,  H01L23/29

Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.

公开(公告)号：US20240178184A1

公开(公告)日：2024-05-30

申请号：US18433047

申请日：2024-02-05

Applicant: Texas Instruments Incorporated

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L25/04 ,  G01S17/08 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/042 ,  G01S17/08 ,  H01L25/0753 ,  H01L33/62

Abstract: A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound.

公开(公告)号：US20230253277A1

公开(公告)日：2023-08-10

申请号：US18299293

申请日：2023-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK ,  Steven Alfred KUMMERL ,  Wai LEE

IPC: H01L23/31 ,  H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/14

CPC classification number: H01L23/31 ,  H01L25/0655 ,  H01L21/565 ,  H01L23/564 ,  H01L23/293 ,  H01L23/142

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US20220173256A1

公开(公告)日：2022-06-02

申请号：US17109980

申请日：2020-12-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18

Abstract: In some examples, an optical sensor package comprises a semiconductor die; an opaque mold compound covering the semiconductor die and having a cavity; and an optical sensor on the semiconductor die and exposed to the cavity. The optical sensor package includes a glass member inside the cavity. The glass member abuts the sensor and a wall of the cavity. The glass member is exposed to an exterior environment of the optical sensor package. The glass member has a thickness approximately equivalent to a depth of the cavity.

公开(公告)号：US20240038609A1

公开(公告)日：2024-02-01

申请号：US18484321

申请日：2023-10-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/16 ,  H01L23/315 ,  H01L21/56 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32245 ,  H01L23/495

Abstract: In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.

公开(公告)号：US20220181223A1

公开(公告)日：2022-06-09

申请号：US17116936

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.

公开(公告)号：US20220155109A1

公开(公告)日：2022-05-19

申请号：US16950981

申请日：2020-11-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Christopher Daniel MANACK ,  Leslie Edward STARK

IPC: G01D11/24 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a ring encircling the sensor. The sensor and an inner surface of the ring are exposed to an exterior environment of the sensor package. The sensor package includes a mold compound covering the semiconductor die and abutting an outer surface of the ring.

公开(公告)号：US20230030266A1

公开(公告)日：2023-02-02

申请号：US17937194

申请日：2022-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L23/31 ,  H01L23/29

Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.

公开(公告)号：US20220189912A1

公开(公告)日：2022-06-16

申请号：US17121198

申请日：2020-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L25/04 ,  H01L33/62 ,  G01S17/08 ,  H01L25/075

Abstract: A method of manufacturing a sensor device includes obtaining a semiconductor die structure comprising a transmitter and a receiver. Then, a first sacrificial stud is affixed to the transmitter and a second sacrificial stud is affixed to the receiver. The semiconductor die is affixed to a lead frame, and pads on the semiconductor die structure are wirebonded to the lead frame. The lead frame, the semiconductor die structure, and the wirebonds are encapsulated in a molding compound, while the tops of the first and second sacrificial studs are left exposed. The first and second sacrificial studs prevent the molding compound from encapsulating the transmitter and the receiver, and are removed to expose the transmitter in a first cavity and the receiver in a second cavity. In some examples, the semiconductor die structure includes a first semiconductor die comprising the transmitter and a second semiconductor die comprising the receiver.

公开(公告)号：US20220181224A1

公开(公告)日：2022-06-09

申请号：US17116963

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK ,  Steven Alfred KUMMERL ,  Wai LEE

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/14 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.