摘要:
A method for inspecting a component includes exciting a number of transducers forming an array to produce an ultrasonic transmission beam (beam) focused into the component. The array and the component are separated by a standoff. A number of echo signals are generated using the transducers, and the echo signals are processed in a number of channels. The processing includes both dynamical focus and providing a dynamic aperture on receive, both of which compensate for refraction of the beam at the component/standoff interface. A single-turn inspection method includes: (a) positioning the array facing the component, (b) exciting the transducers, (c) generating a number of echo signals, (d) changing the relative angular orientation of the array and the component around an axis and repeating steps (b) and (c), and (e) processing the echo signals to form at least one processed echo signal.
摘要:
An ultrasound probe and an ultrasound imaging system include a plurality of transducer elements arranged in an array. The plurality of transducer elements are organized to form a transmit aperture and a receive aperture. The ultrasound probe and ultrasound imaging system include a plurality of summing nodes. The ultrasound probe and ultrasound imaging system include a set of receive switches associated with each of the transducer elements in the receive aperture. Each set of receive switches is configured to selectively connect the associated transducer element to any one of the plurality of summing nodes.
摘要:
An ultrasound transducer probe is disclosed comprising: an array of ultrasound transducer elements, each ultrasound transducer element associated with a corresponding unit transducer cell for providing transmit and receive functions, each unit transducer cell including a cell transmit/receive switch connected to a low voltage switch matrix via a low voltage transmit path; and a plurality of microelectronic cross-point switches for switching an externally generated analog transmit signal to one or more of the low voltage transmit paths.
摘要:
A reconfigurable linear array of sensors (e.g., optical, thermal, pressure, ultrasonic). The reconfigurability allows the size and spacing of the sensor elements to be a function of the distance from the beam center. This feature improves performance for imaging systems having a limited channel count. The improved performance, for applications in which multiple transmit focal zones are employed, arises from the ability to adjust the aperture for a particular depth.
摘要:
An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
摘要:
An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
摘要:
A remotely located ultrasound beamformer is serviced from a central service facility via a network in a manner that compensates for defective beamformer channels in an ultrasound imaging system at the remote location. The central service facility produces beamformer control software (i.e., beamforming parameters) that is optimized for the existing functional channels. The optimized beamformer control software is generated based on diagnostic feedback received from the remotely located system via the network, and is downloaded to the remote system via the same network.
摘要:
A temperature management system and a method of monitoring temperature in an ultrasound imaging system is provided. The system includes an ultrasound probe. The ultrasound probe includes at least one ultrasound transducer and a plurality of application specific integrated circuits. Further, the system includes at least one temperature sensing device disposed on at least one of the plurality of application specific integrated circuits. The temperature sensing devices are disposed in such a way that the sensing devices are in thermal contact with at least one heat producing region of the ultrasound probe.
摘要:
Systems and methods are presented for increasing the frame rate of real-time 3D ultrasound imaging. In one embodiment, the frame rate for generating a pseudo-shaded 2D projection image may be increased by controlling the image reconstruction process. Rather than beamforming, scan converting, and interpolating a 3D voxelized data set of an entire scanned volume, only samples required for generating the 2D projection image may be reconstructed. The element data measured from each transducer array element may be combined to directly reconstruct those 3D image samples required by the volume rendering algorithm to generate the 2D projection image.
摘要:
An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.