ULTRASOUND PROBE AND ULTRASOUND IMAGING SYSTEM
    2.
    发明申请
    ULTRASOUND PROBE AND ULTRASOUND IMAGING SYSTEM 有权
    超声探头和超声成像系统

    公开(公告)号:US20110295119A1

    公开(公告)日:2011-12-01

    申请号:US12786950

    申请日:2010-05-25

    IPC分类号: A61B8/14 A61B8/00

    摘要: An ultrasound probe and an ultrasound imaging system include a plurality of transducer elements arranged in an array. The plurality of transducer elements are organized to form a transmit aperture and a receive aperture. The ultrasound probe and ultrasound imaging system include a plurality of summing nodes. The ultrasound probe and ultrasound imaging system include a set of receive switches associated with each of the transducer elements in the receive aperture. Each set of receive switches is configured to selectively connect the associated transducer element to any one of the plurality of summing nodes.

    摘要翻译: 超声波探头和超声成像系统包括以阵列布置的多个换能器元件。 多个换能器元件被组织以形成发射孔和接收孔。 超声探头和超声成像系统包括多个求和节点。 超声探头和超声成像系统包括与接收孔中的每个换能器元件相关联的一组接收开关。 每组接收开关被配置为选择性地将相关联的换能器元件连接到多个求和节点中的任何一个。

    Reconfigurable Ultrasound Array with Low Noise CW Processing
    3.
    发明申请
    Reconfigurable Ultrasound Array with Low Noise CW Processing 审中-公开
    具有低噪声CW处理的可重构超声阵列

    公开(公告)号:US20110028845A1

    公开(公告)日:2011-02-03

    申请号:US12534099

    申请日:2009-07-31

    IPC分类号: A61B8/14

    摘要: An ultrasound transducer probe is disclosed comprising: an array of ultrasound transducer elements, each ultrasound transducer element associated with a corresponding unit transducer cell for providing transmit and receive functions, each unit transducer cell including a cell transmit/receive switch connected to a low voltage switch matrix via a low voltage transmit path; and a plurality of microelectronic cross-point switches for switching an externally generated analog transmit signal to one or more of the low voltage transmit paths.

    摘要翻译: 公开了一种超声换能器探头,其包括:超声波换能器元件阵列,每个超声换能器元件与相应的单元换能器单元相关联,用于提供发射和接收功能,每个单位换能器单元包括连接到低压开关的单元发射/接收开关 矩阵通过低电压发射路径; 以及用于将外部产生的模拟发射信号切换到一个或多个低电压发射路径的多个微电子交叉点开关。

    Ultrasound Imaging System
    5.
    发明申请
    Ultrasound Imaging System 有权
    超声成像系统

    公开(公告)号:US20080183078A1

    公开(公告)日:2008-07-31

    申请号:US11669235

    申请日:2007-01-31

    IPC分类号: A61B8/00

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。

    Method and apparatus for servicing remote ultrasound beamformer from central service facility
    7.
    发明授权
    Method and apparatus for servicing remote ultrasound beamformer from central service facility 有权
    从中央服务设施维修远程超声波波束形成器的方法和装置

    公开(公告)号:US06565510B1

    公开(公告)日:2003-05-20

    申请号:US09532316

    申请日:2000-03-22

    申请人: Bruno Hans Haider

    发明人: Bruno Hans Haider

    IPC分类号: A61B800

    摘要: A remotely located ultrasound beamformer is serviced from a central service facility via a network in a manner that compensates for defective beamformer channels in an ultrasound imaging system at the remote location. The central service facility produces beamformer control software (i.e., beamforming parameters) that is optimized for the existing functional channels. The optimized beamformer control software is generated based on diagnostic feedback received from the remotely located system via the network, and is downloaded to the remote system via the same network.

    摘要翻译: 远程定位的超声波波束成形器从中央服务设施经由网络以在远程位置处的超声成像系统中补偿有缺陷的波束成形器信道的方式来服务。 中央服务设施产生针对现有功能通道优化的波束成形器控制软件(即波束成形参数)。 优化的波束形成器控制软件基于通过网络从位于远程的系统接收的诊断反馈生成,并通过相同的网络下载到远程系统。

    Ultrasound imaging system and method for temperature management
    8.
    发明授权
    Ultrasound imaging system and method for temperature management 有权
    超声成像系统及温度管理方法

    公开(公告)号:US08764662B2

    公开(公告)日:2014-07-01

    申请号:US13537109

    申请日:2012-06-29

    IPC分类号: A61B8/00 A61B8/14 G01K1/00

    CPC分类号: A61B8/58 A61B8/546

    摘要: A temperature management system and a method of monitoring temperature in an ultrasound imaging system is provided. The system includes an ultrasound probe. The ultrasound probe includes at least one ultrasound transducer and a plurality of application specific integrated circuits. Further, the system includes at least one temperature sensing device disposed on at least one of the plurality of application specific integrated circuits. The temperature sensing devices are disposed in such a way that the sensing devices are in thermal contact with at least one heat producing region of the ultrasound probe.

    摘要翻译: 提供了一种超声成像系统中的温度管理系统和温度监视方法。 该系统包括超声波探头。 超声探头包括至少一个超声换能器和多个专用集成电路。 此外,该系统包括设置在多个专用集成电路中的至少一个的至少一个温度感测装置。 温度感测装置以这样的方式设置,使得感测装置与超声波探头的至少一个发热区域热接触。

    Ultrasound imaging with ray casting and software-based image reconstruction
    9.
    发明授权
    Ultrasound imaging with ray casting and software-based image reconstruction 有权
    超声成像与射线投射和基于软件的图像重建

    公开(公告)号:US08582865B2

    公开(公告)日:2013-11-12

    申请号:US12769497

    申请日:2010-04-28

    IPC分类号: G06K9/00

    摘要: Systems and methods are presented for increasing the frame rate of real-time 3D ultrasound imaging. In one embodiment, the frame rate for generating a pseudo-shaded 2D projection image may be increased by controlling the image reconstruction process. Rather than beamforming, scan converting, and interpolating a 3D voxelized data set of an entire scanned volume, only samples required for generating the 2D projection image may be reconstructed. The element data measured from each transducer array element may be combined to directly reconstruct those 3D image samples required by the volume rendering algorithm to generate the 2D projection image.

    摘要翻译: 提出了提高实时3D超声成像帧速率的系统和方法。 在一个实施例中,可以通过控制图像重建处理来增加用于产生伪着色的2D投影图像的帧速率。 扫描转换和内插整个扫描体积的3D体素数据集而不是波形成形,而不是重建生成2D投影图像所需的样本。 可以将从每个换能器阵列元件测量的元素数据组合以直接重建由体绘制算法所需的3D图像样本,以生成2D投影图像。

    Ultrasound imaging system
    10.
    发明授权
    Ultrasound imaging system 有权
    超声成像系统

    公开(公告)号:US07687976B2

    公开(公告)日:2010-03-30

    申请号:US11669235

    申请日:2007-01-31

    IPC分类号: H01L41/09 G01N24/00 A61B8/14

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。