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1.发明授权Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit 有权用于集成电路中线长度调整的引线接合方法和装置公开(公告)号：US07637414B2
公开(公告)日：2009-12-29
申请号：US12171903
申请日：2008-07-11
IPC分类号： B23K31/00
CPC分类号： H01L24/49 , H01L23/66 , H01L24/48 , H01L2223/6644 , H01L2224/4809 , H01L2224/48091 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49179 , Y10T29/49194 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
摘要翻译： 一种集成电路是以从集成电路封装到集成电路封装的射频性能一致的方式引线接合的。 测量集成电路内的结合距离，每个对应于要形成的引线键合。 根据键距，基线长度和基线回路高度，计算假想线接合曲线下的面积。 导线沿着给定的一个焊接距离结合以形成给定的一个引线键合。 提供给定引线键合的引线键合分布，其具有基本上等于所计算的面积的区域。
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2.发明授权公开(公告)号：US07086148B2
公开(公告)日：2006-08-08
申请号：US10787010
申请日：2004-02-25
IPC分类号： H05K3/00
CPC分类号： H01L24/49 , H01L23/66 , H01L24/48 , H01L2223/6644 , H01L2224/4809 , H01L2224/48091 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49179 , Y10T29/49194 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
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3.发明申请Methods and Apparatus for Wire Bonding with Wire Length Adjustment in an Integrated Circuit 有权用于集成电路中电线长度调整的电线接合方法和装置公开(公告)号：US20080283578A1
公开(公告)日：2008-11-20
申请号：US12171903
申请日：2008-07-11
IPC分类号： B23K13/08
CPC分类号： H01L24/49 , H01L23/66 , H01L24/48 , H01L2223/6644 , H01L2224/4809 , H01L2224/48091 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49179 , Y10T29/49194 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
摘要翻译： 一种集成电路是以从集成电路封装到集成电路封装的射频性能一致的方式引线接合的。 测量集成电路内的结合距离，每个对应于要形成的引线键合。 根据键距，基线长度和基线回路高度，计算假想线接合曲线下的面积。 导线沿着给定的一个焊接距离结合以形成给定的一个引线键合。 提供给定引线键合的引线键合分布，其具有基本上等于所计算的面积的区域。
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4.发明授权Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit 有权用于集成电路中线长度调整的引线接合方法和装置公开(公告)号：US07443042B2
公开(公告)日：2008-10-28
申请号：US11385245
申请日：2006-03-21
CPC分类号： H01L24/49 , H01L23/66 , H01L24/48 , H01L2223/6644 , H01L2224/4809 , H01L2224/48091 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49179 , Y10T29/49194 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
摘要翻译： 一种集成电路是以从集成电路封装到集成电路封装的射频性能一致的方式引线接合的。 测量集成电路内的结合距离，每个对应于要形成的引线键合。 根据键距，基线长度和基线回路高度，计算假想线接合曲线下的面积。 导线沿着给定的一个焊接距离结合以形成给定的一个引线键合。 提供给定引线键合的引线键合分布，其具有基本上等于所计算的面积的区域。
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公开(公告)号：US06313999B1
公开(公告)日：2001-11-06
申请号：US09329420
申请日：1999-06-10
IPC分类号： H01R1232
CPC分类号： H01R43/0263 , H01R12/7076 , H01R43/0256 , H05K1/111 , H05K3/3436 , H05K3/4015 , H05K2201/094 , H05K2201/09745 , H05K2201/10734 , H05K2203/048 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179
摘要： An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an elongate member attached to the cup-shaped member. The cup-shaped member is attached between the BGA device and the substrate at two or more different positions so that the solder balls of the BGA device become aligned over the terminals of the substrate by operation of gravity.
摘要翻译： 一种在衬底上对准球栅阵列（BGA）器件的装置。 该装置优选地包括用于拔罐和保持BGA装置的焊球的杯状构件，以及附接到杯形构件的细长构件。 杯状部件在两个或多个不同位置处附接在BGA器件和衬底之间，使得BGA器件的焊球通过重力操作而在衬底的端子上对齐。
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公开(公告)号：US6140886A
公开(公告)日：2000-10-31
申请号：US257014
申请日：1999-02-25
CPC分类号： H01P5/10
摘要： A transmission line balun transformer for providing a single ended output signal from a pair of differential input signals includes two transmission line signal couplers. The couplers are individually designed to be relatively loosely coupled devices, i.e. having a coupling factor greater than 3 dB, but are coupled together with proper phase relationships so as to achieve a relatively tighter composite coupling characteristic in the order of 3 dB, thereby resulting in an increase in bandwidth.
摘要翻译： 用于从一对差分输入信号提供单端输出信号的传输线平衡不平衡变压器包括两个传输线信号耦合器。 耦合器被单独设计成相对松散耦合的装置，即具有大于3dB的耦合因子，但是以适当的相位关系耦合在一起，以便实现3dB的相对更紧密的复合耦合特性，从而导致 带宽增加。
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公开(公告)号：US06329877B1
公开(公告)日：2001-12-11
申请号：US09344756
申请日：1999-06-25
IPC分类号： H03F368
CPC分类号： H03F3/604 , H03F1/0288
摘要： There is disclosed a power amplifier includes an in-phase power splitter generating two split signals from an input signal, and two amplifiers capable of operating in different modes. The split signals are provided as respective inputs to the two amplifiers which are coupled through transmission lines such that as the first amplifier approaches the maximum power it can produce, the output from the second amplifier begins to contribute to the power amplifier output and supplements and modifies the power provided by the first amplifier thereby extending the range of input power over which the power amplifier delivers output power.
摘要翻译： 公开了一种功率放大器，包括从输入信号产生两个分离信号的同相功率分配器和能够以不同模式操作的两个放大器。 分离信号被提供为两个放大器的相应输入，两个放大器通过传输线耦合，使得当第一放大器接近其可以产生的最大功率时，来自第二放大器的输出开始有助于功率放大器输出并补充和修改 由第一放大器提供的功率从而延长功率放大器输出功率的输入功率的范围。
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