公开(公告)号：US20170287681A1

公开(公告)日：2017-10-05

申请号：US15469612

申请日：2017-03-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiromi NITADORI ,  Satoru KOIKE

IPC: H01J37/32 ,  H01L21/67

Abstract: A substrate processing apparatus includes: a substrate holder to vertically load a plurality of substrates in multiple stages with an interval therebetween and including a plurality of partition plates vertically partitioning a region where the plurality of substrates are loaded; a process chamber to receive the substrate holder therein; protrusions protruding inward toward the outer circumferential surfaces of the partition plates from an inner circumferential wall surface within the process chamber, which faces the outer circumferential surfaces of the partition plates, to form clearances between inner circumferential surfaces formed on the protruding tip ends of the protrusions and the outer circumferential surfaces of the partition plates; and a gas supply part to supply inert gas into the clearances, which are formed between the inner circumferential surfaces of the protrusions and the outer circumferential surfaces of the partition plates, to form positive-pressure sections subjected to a pressure higher than ambient pressure.

公开(公告)号：US20230253230A1

公开(公告)日：2023-08-10

申请号：US18159306

申请日：2023-01-25

Applicant: Tokyo Electron Limited

Inventor： Masato KADOBE ,  Hiromi NITADORI ,  Kaoru SATO ,  Kiyohiko GOKON

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67781 ,  H01L21/67742 ,  H01L21/67017 ,  H01L21/6719

Abstract: A substrate processing apparatus includes a loading and unloading unit having a first side surface through which a container accommodating a substrate is loaded and unloaded, and a second side surface opposite to the first side surface, a substrate transport unit extending along a first horizontal direction perpendicular to the second side surface, and a plurality of batch processing units adjacent to one another along a longitudinal direction of the substrate transport unit. Each of the plurality of batch processing units includes a processing container configured to accommodate and process a plurality of substrates, a gas supply unit configured to supply a gas into the processing container, and an exhaust unit configured to exhaust the gas inside the processing container. A first maintenance area, used for attending to a maintenance of the plurality of batch processing units, is provided above the exhaust unit.

公开(公告)号：US20230253221A1

公开(公告)日：2023-08-10

申请号：US18159295

申请日：2023-01-25

Applicant: Tokyo Electron Limited

Inventor： Masato KADOBE ,  Hiromi NITADORI ,  Kaoru SATO ,  Kiyohiko GOKON

IPC: H01L21/67

CPC classification number: H01L21/67201

Abstract: A substrate processing apparatus includes a loading and unloading unit having a first side surface through which a container accommodating a substrate is loaded and unloaded, and a second side surface opposite to the first side surface, a substrate transport unit extending along a first direction perpendicular to the second side surface, and a plurality of batch processing units adjacent to one another along a longitudinal direction of the substrate transport unit. Each of the plurality of batch processing units includes a processing container configured to accommodate and process a plurality of substrates, a gas supply unit configured to supply a gas into the processing container, and an exhaust unit configured to exhaust the gas inside the processing container. The gas supply unit and the exhaust unit are provided on one side of the processing container.

公开(公告)号：US20240116709A1

公开(公告)日：2024-04-11

申请号：US18483050

申请日：2023-10-09

Applicant: Tokyo Electron Limited

Inventor： Masato KADOBE ,  Hiromi NITADORI ,  Takahiro ABE ,  Junichi SATO

IPC: B65G1/10 ,  B65G49/06

CPC classification number: B65G1/10 ,  B65G49/061 ,  B65G49/062 ,  B65G2201/0297

Abstract: A substrate processing apparatus includes: a loading/unloading part having a first side surface into or from which a container accommodating a substrate is loaded or unloaded and a second side surface opposite to the first side surface; a substrate transfer part extending in a first direction orthogonal to the second side surface; and a plurality of batch processors adjacent to each other in a length direction of the substrate transfer part. The loading/unloading part includes: a first transfer device and a second transfer device configured to transfer the container; a first area accessible to the first transfer device and having a plurality of first storage shelves configured to store the container, a second area accessible to the second transfer device and having a plurality of second storage shelves configured to store the container; and a movable shelf configured to be movable between the first area and the second area.

公开(公告)号：US20220307627A1

公开(公告)日：2022-09-29

申请号：US17700894

申请日：2022-03-22

Applicant: Tokyo Electron Limited

Inventor： Masato KADOBE ,  Hiromi NITADORI

IPC: F16L9/19 ,  F04B37/14 ,  F04B41/06 ,  F04B39/12

Abstract: A piping structure includes a plurality of pipes that connects a plurality of process modules disposed adjacent to each other at a first room and a plurality of vacuum pumps disposed at a second room below the first room to be corresponding to the plurality of process modules, respectively. The plurality of pipes are divided into a plurality of blocks in a height direction, and the plurality of pipes used for blocks in an identical height have an identical shape.

公开(公告)号：US20200227293A1

公开(公告)日：2020-07-16

申请号：US16737512

申请日：2020-01-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masato KADOBE ,  Shinya NASUKAWA ,  Hiromi NITADORI ,  Kazuyuki KIKUCHI ,  Hirofumi KANEKO

IPC: H01L21/67 ,  H01L21/677 ,  F27D3/00 ,  F27D5/00 ,  F27D7/06 ,  F27D9/00

Abstract: A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container.

公开(公告)号：US20180087156A1

公开(公告)日：2018-03-29

申请号：US15715557

申请日：2017-09-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kohei FUKUSHIMA ,  Hiromi NITADORI

IPC: C23C16/455 ,  C23C16/458

CPC classification number: C23C16/45578 ,  C23C16/45587 ,  C23C16/4583 ,  C23C16/4584

Abstract: A gas introduction mechanism includes a manifold disposed in a process vessel and having an injector support part extending vertically along an inner wall surface of the process vessel and having an insertion hole, and a gas introduction part having a gas flow passage which protrudes outward from the injector support part and which communicates with the insertion hole and an outside of the process vessel so that a gas can flow through the insertion hole and the outside of the process vessel, an injector inserted and fitted into the insertion hole to be supported by the insertion hole, and extending linearly entirely within the injector along the inner wall surface and has an opening communicating with the gas flow passage at a position inserted into the insertion hole, and a rotation mechanism connected to a lower end portion of the injector to rotate the injector.

公开(公告)号：US20180076021A1

公开(公告)日：2018-03-15

申请号：US15699010

申请日：2017-09-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kohei FUKUSHIMA ,  Hiromi NITADORI

IPC: H01L21/02 ,  C23C16/455

CPC classification number: H01L21/02126 ,  C23C16/4412 ,  C23C16/45546 ,  C23C16/45578 ,  C23C16/45589 ,  H01L21/0228 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/6719

Abstract: A substrate processing apparatus includes an inner tube installed to accommodate a plurality of substrates and having a first opening, an outer tube configured to surround the inner tube, a movable wall installed inside the inner tube or between the inner tube and the outer tube, configured to be movable, and having a second opening, a gas supply part configured to supply a process gas to the substrates and an exhaust part installed outside the movable wall and configured to exhaust the process gas supplied to the substrates.