公开(公告)号：US20140071411A1

公开(公告)日：2014-03-13

申请号：US14022434

申请日：2013-09-10

Applicant: Tokyo Electron Limited

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshinori IKEDA ,  Koki YOSHIMURA ,  Yoshiki OKAMOTO ,  Masahiro FUKUDA

IPC: G03F7/30

CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

公开(公告)号：US20160202609A1

公开(公告)日：2016-07-14

申请号：US15051780

申请日：2016-02-24

Applicant: Tokyo Electron Limited

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshinori IKEDA ,  Koki YOSHIMURA ,  Yoshiki OKAMOTO ,  Masahiro FUKUDA

IPC: G03F7/16

CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

公开(公告)号：US20210039221A1

公开(公告)日：2021-02-11

申请号：US16977935

申请日：2019-02-26

Applicant: Tokyo Electron Limited

Inventor： Nozomu KANETAKE ,  Akihiro KUBO ,  Teruhiko KODAMA ,  Taro YAMAMOTO ,  Yasushi TAKIGUCHI ,  Yoshiki OKAMOTO ,  Hayato HOSAKA

IPC: B24B7/22 ,  H01L21/67 ,  B24B19/02 ,  B24B41/047

Abstract: A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.

公开(公告)号：US20180151343A1

公开(公告)日：2018-05-31

申请号：US15824274

申请日：2017-11-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshiki OKAMOTO ,  Hayato HOSAKA ,  Teruhiko KODAMA ,  Akihiro KUBO ,  Ryuto OZASA ,  Yuji ARIUCHI ,  Shinsuke KIMURA

IPC: H01L21/02 ,  H01L21/687 ,  H01L21/67 ,  G03F7/20

CPC classification number: H01L21/02016 ,  G03F7/70691 ,  H01L21/0209 ,  H01L21/67046 ,  H01L21/67219 ,  H01L21/67225 ,  H01L21/67288 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/6875 ,  H01L21/68764 ,  H01L21/68792

Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.