摘要:
A MCP semiconductor device with an “anti-shake” function includes a driver chip and a logic chip. The logic chip includes a correction signal processing unit which obtains a value for vibration of apparatus based on a vibration detection signal to generate a correction signal and a control signal output unit having a plurality of types of signal output sections which output a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The logic chip further includes a driver output terminal which outputs the vibration control signal to the driver chip, an external output terminal which outputs the control signal to an external circuit other than the driver chip, and also an output switch unit which connects one of the plurality of signal output sections with the driver output terminal or the external output terminal.
摘要:
A MCP semiconductor device with an “anti-shake” function includes a driver chip and a logic chip. The logic chip includes a correction signal processing unit which obtains a value for vibration of apparatus based on a vibration detection signal to generate a correction signal and a control signal output unit having a plurality of types of signal output sections which output a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The logic chip further includes a driver output terminal which outputs the vibration control signal to the driver chip, an external output terminal which outputs the control signal to an external circuit other than the driver chip, and also an output switch unit which connects one of the plurality of signal output sections with the driver output terminal or the external output terminal.
摘要:
An image stabilization control circuit controls an optical element driving element configured to move an optical element provided in an imaging apparatus based on an output signal of a vibration detection element provided in the imaging apparatus. The image stabilization control circuit includes an analog-digital conversion circuit configured to receive an analog signal from a position detection element that detects the position of the optical element and convert the input analog signal into a digital signal, and a servo circuit configured to generate a correction signal for correcting the position of the optical element based on an output signal of the analog-digital conversion circuit and output the generated correction signal to the optical element driving element. The servo circuit includes a digital filter circuit and a register. The digital filter circuit performs filter processing based on a filter coefficient stored in the register.
摘要:
A data recording device for recording data on an optical disc by irradiating a laser pulse on the optical disc while controlling rotation of the optical disc at a constant angular velocity. The device includes a laser condition varying unit that changes a peak value of the laser pulse in accordance with a value relating to a linear velocity of the optical disc at a position at which the laser pulse is irradiated.
摘要:
A program processing device comprises a CPU for carrying out predetermined processing according to a program; an internal memory storing the program and data generated by the CPU by carrying out the program, and a data acquiring circuit connected to an external program processing device, for acquiring the program from the external program processing device to write into the internal memory, wherein the CPU, the internal memory, a debug processing circuit, and the data acquiring circuit are integrally mounted on the same semiconductor substrate.
摘要:
A semiconductor device with an “anti-shake” function includes a logic chip having a digital circuit which obtains a value indicating the amount of vibration of device such as an imaging apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal. The logic chip includes a correction signal processing unit which generates the correction signal, and a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The control signal output unit includes a plurality of types of signal output sections and outputs a vibration control signal corresponding to a driving unit from one signal output section selected from among the plurality of types of signal output sections.
摘要:
An optical shake correction unit corrects an optical axis in response to an output signal of an vibration detecting element. An electronic shake correction unit adaptively varies an effective region in image signals of an image pickup region formed by image pickup devices. A control unit performs control such that either the optical shake correction unit or the electronic shake correction unit is enabled by switching between a first image pickup mode and a second image pickup mode.
摘要:
An efficient logic chip operating power supply having digital circuits in a multi-chip package is provided. A multi-chip package semiconductor device fabricated in common with a driver chip having analog circuits and a logic chip having digital circuits, a logic chip power supply circuit is provided in which a driver chip creates a logic chip power supply dedicated for the logic chip. The logic chip has internal logic circuitry operating by receiving a power supply from the logic chip power supply circuit via power input terminals.
摘要:
In a semiconductor module including multiple semiconductor devices, a signal that flows through a bonding wire connected to one semiconductor device is prevented from acting as noise which affects another semiconductor device, thereby improving the operation reliability of the semiconductor module. A second semiconductor device provided alongside a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire such as a gold wire or the like. The bonding wire is provided across the side E2 which differs from the side E1 that faces the side face F1 of the first semiconductor device. Furthermore, the current output electrode is provided along the side E2.
摘要:
In a vibration correction control circuit mounted on an image pickup apparatus including an image pickup unit, provided with lenses, image pickup devices and vibration detecting element, and a driver element for adjusting the position of the image pickup unit, the equalizer generates a drive signal used to move the image pickup unit in a direction along which to reduce the vibration applied to the image pickup unit, based on the output signal of the vibration detecting element. A verifying-signal input circuit supplies a dummy vibration-component signal to the equalizer.