-
公开(公告)号:US20100245028A1
公开(公告)日:2010-09-30
申请号:US12739980
申请日:2008-11-06
申请人: Tomoyuki Washizaki , Toshiyuki Iwao , Takashi Kitamura , Takashi Watanabe , Naohiro Mikamoto , Masahito Fuchigami , Kazutoshi Matsumura
发明人: Tomoyuki Washizaki , Toshiyuki Iwao , Takashi Kitamura , Takashi Watanabe , Naohiro Mikamoto , Masahito Fuchigami , Kazutoshi Matsumura
CPC分类号: H01H69/022 , H01H85/0039 , H01H85/046 , H01H85/08 , Y10T29/49107
摘要: A circuit protecting element includes insulating substrate (11), a pair of surface electrodes (12) provided to both ends of a top face of insulating substrate (11), element (13) bridging the pair of surface electrodes (12) and electrically connected to the pair of surface electrodes (12), base layer (14) formed between element (13) and insulating substrate (11), and insulating layer (15) covering element (13). Base layer (14) is formed of a mixture of diatom earth and silicone resin. The structure discussed above allows stabilizing the blowout characteristics of the circuit protecting element.
摘要翻译: 电路保护元件包括绝缘基板(11),设置在绝缘基板(11)的顶面的两端的一对表面电极(12),桥接该对表面电极(12)的元件(13),并电连接 到一对表面电极(12),形成在元件(13)和绝缘基板(11)之间的基底层(14)和绝缘层(15)覆盖元件(13)。 基层(14)由硅藻土和硅树脂的混合物形成。 上述结构允许稳定电路保护元件的井喷特性。
-
公开(公告)号:US09035740B2
公开(公告)日:2015-05-19
申请号:US12739980
申请日:2008-11-06
申请人: Tomoyuki Washizaki , Toshiyuki Iwao , Takashi Kitamura , Takashi Watanabe , Naohiro Mikamoto , Masahito Fuchigami , Kazutoshi Matsumura
发明人: Tomoyuki Washizaki , Toshiyuki Iwao , Takashi Kitamura , Takashi Watanabe , Naohiro Mikamoto , Masahito Fuchigami , Kazutoshi Matsumura
IPC分类号: H01H85/04 , H01H69/02 , H01H85/046 , H01H85/08 , H01H85/00
CPC分类号: H01H69/022 , H01H85/0039 , H01H85/046 , H01H85/08 , Y10T29/49107
摘要: A circuit protecting element includes insulating substrate (11), a pair of surface electrodes (12) provided to both ends of a top face of insulating substrate (11), element (13) bridging the pair of surface electrodes (12) and electrically connected to the pair of surface electrodes (12), base layer (14) formed between element (13) and insulating substrate (11), and insulating layer (15) covering element (13). Base layer (14) is formed of a mixture of diatom earth and silicone resin. The structure discussed above allows stabilizing the blowout characteristics of the circuit protecting element.
摘要翻译: 电路保护元件包括绝缘基板(11),设置在绝缘基板(11)的顶面的两端的一对表面电极(12),桥接该对表面电极(12)的元件(13),并电连接 到一对表面电极(12),形成在元件(13)和绝缘基板(11)之间的基底层(14)以及绝缘层(15)覆盖元件(13)。 基层(14)由硅藻土和硅树脂的混合物形成。 上述结构允许稳定电路保护元件的井喷特性。
-
公开(公告)号:US08368502B2
公开(公告)日:2013-02-05
申请号:US12159476
申请日:2007-03-14
申请人: Tomoyuki Washizaki , Toshiyuki Iwao , Kenji Senda , Takashi Watanabe , Kazutoshi Matsumura , Seiji Tsuda
发明人: Tomoyuki Washizaki , Toshiyuki Iwao , Kenji Senda , Takashi Watanabe , Kazutoshi Matsumura , Seiji Tsuda
CPC分类号: H01H85/0418 , H01H85/1755 , H01H2085/0414 , Y10T29/49107
摘要: A surface mount current fuse of the present invention includes a first base which has a recess and is smaller in width at the other end than at one end in the longitudinal direction, and a second base which has the same shape as the first base. The first base and the second base are combined to form a box-shaped body by joining the lower surface of the second base to the upper surface of the upper surface of the first base in such a manner that one end of the first base and the other end of the second base are in contact with each other. The recess of the first base and the recess of the second base form a space portion in which to dispose an element portion. The borderline between the first base and the second base passes through the center point on a side surface of the body. As a result, the surface mount current fuse has high production efficiency.
摘要翻译: 本发明的表面贴装电流保险丝包括:第一基座,其具有凹部,并且在另一端处的宽度比在纵向方向上的一端宽度小;以及第二基座,其具有与第一基座相同的形状。 第一基座和第二基座通过将第二基座的下表面与第一基座的上表面的上表面接合而以第一基座和第二基座的一端的方式结合形成盒状体 第二基座的另一端彼此接触。 第一基座的凹部和第二基座的凹部形成用于设置元件部分的空间部分。 第一基座和第二基座之间的边界穿过主体侧表面上的中心点。 因此,表面贴装电流保险丝具有高生产效率。
-
公开(公告)号:US20090015365A1
公开(公告)日:2009-01-15
申请号:US12159476
申请日:2007-03-14
申请人: Tomoyuki Washizaki , Toshiyuki Iwao , Kenji Senda , Takashi Watanabe , Kazutoshi Matsumura , Seiji Tsuda
发明人: Tomoyuki Washizaki , Toshiyuki Iwao , Kenji Senda , Takashi Watanabe , Kazutoshi Matsumura , Seiji Tsuda
IPC分类号: H01H85/20
CPC分类号: H01H85/0418 , H01H85/1755 , H01H2085/0414 , Y10T29/49107
摘要: A surface mount current fuse of the present invention includes a first base which has a recess and is smaller in width at the other end than at one end in the longitudinal direction, and a second base which has the same shape as the first base. The first base and the second base are combined to form a box-shaped body by joining the lower surface of the second base to the upper surface of the upper surface of the first base in such a manner that one end of the first base and the other end of the second base are in contact with each other. The recess of the first base and the recess of the second base form a space portion in which to dispose an element portion. The borderline between the first base and the second base passes through the center point on a side surface of the body. As a result, the surface mount current fuse has high production efficiency.
摘要翻译: 本发明的表面贴装电流保险丝包括:第一基座,其具有凹部,并且在另一端处的宽度比在纵向方向上的一端宽度小;以及第二基座,其具有与第一基座相同的形状。 第一基座和第二基座通过将第二基座的下表面与第一基座的上表面的上表面接合而以第一基座和第二基座的一端的方式结合形成盒状体 第二基座的另一端彼此接触。 第一基座的凹部和第二基座的凹部形成用于设置元件部分的空间部分。 第一基座和第二基座之间的边界穿过主体侧表面上的中心点。 因此,表面贴装电流保险丝具有高生产效率。
-
公开(公告)号:US07884698B2
公开(公告)日:2011-02-08
申请号:US10554699
申请日:2004-04-30
申请人: Hideki Tanaka , Tomoyuki Washizaki , Kiyoshi Ikeuchi , Toshiyuki Iwao , Yasuki Nagatomo , Kesato Iiboshi , Jiro Ota , Yasuhiro Izumi
发明人: Hideki Tanaka , Tomoyuki Washizaki , Kiyoshi Ikeuchi , Toshiyuki Iwao , Yasuki Nagatomo , Kesato Iiboshi , Jiro Ota , Yasuhiro Izumi
CPC分类号: H01C17/281 , H01C1/032 , H01C1/14 , Y10T29/49107
摘要: An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.
摘要翻译: 提供了一种电子部件,其中:设置冲击吸收层,以至少覆盖由陶瓷和玻璃的绝缘混合物制成的基部的两个端部的至少角部; 形成导电膜以覆盖这些冲击吸收层的表面和基底的表面; 覆盖冲击吸收层表面的该导电膜的部分形成电极; 并且在导电膜的另一部分中设置电阻调节槽,而不是用作电极的部分。
-
公开(公告)号:US20060255897A1
公开(公告)日:2006-11-16
申请号:US10554699
申请日:2004-04-30
申请人: Hideki Tanaka , Tomoyuki Washizaki , Kiyoshi Ikeuchi , Toshiyuki Iwao , Yasuki Nagatomo , Kesato Iiboshi , Jiro Ota , Yasuhiro Izumi
发明人: Hideki Tanaka , Tomoyuki Washizaki , Kiyoshi Ikeuchi , Toshiyuki Iwao , Yasuki Nagatomo , Kesato Iiboshi , Jiro Ota , Yasuhiro Izumi
IPC分类号: H01F27/02
CPC分类号: H01C17/281 , H01C1/032 , H01C1/14 , Y10T29/49107
摘要: An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.
摘要翻译: 提供了一种电子部件,其中:设置冲击吸收层,以至少覆盖由陶瓷和玻璃的绝缘混合物制成的基部的两个端部的至少角部; 形成导电膜以覆盖这些冲击吸收层的表面和基底的表面; 覆盖冲击吸收层表面的该导电膜的部分形成电极; 并且在导电膜的另一部分中设置电阻调节槽,而不是用作电极的部分。
-
公开(公告)号:US5829468A
公开(公告)日:1998-11-03
申请号:US436374
申请日:1995-05-22
申请人: Hachihei Watanabe , Masatoshi Enoki , Katsuaki Nakamura , Tatsuo Matsukuma , Tsuguya Okubo , Akira Yubisui , Takayoshi Yanagida , Hiromi Katahira , Toshiyuki Iwao , Yuji Matsuo
发明人: Hachihei Watanabe , Masatoshi Enoki , Katsuaki Nakamura , Tatsuo Matsukuma , Tsuguya Okubo , Akira Yubisui , Takayoshi Yanagida , Hiromi Katahira , Toshiyuki Iwao , Yuji Matsuo
CPC分类号: B21C37/292 , E03C1/0404 , E03C2001/0414 , Y10T137/0441 , Y10T137/6123 , Y10T137/9464
摘要: A valve device using pipe materials in which a fluid control mechanism is arranged and which comprises a valve device body (11) made of a metallic pipe material and having a tubular flange (21) integrally formed on the outer surface of the body so as to protrude therefrom, and a tubular member (12) for forming a flow passage, which is fitted and connected at the base end thereof to the top end of the tubular flange (21). The tubular flange (21) is formed so that the area of the opening at the base end thereof communicating with the flow passage within the valve device body is greater than the area of the opening at the top end of the tubular flange. The inner peripheral portion (21a) of the base end of the tubular flange (21) is formed with a smoothly curved surface, and the flow passage is formed along such a curved surface.
摘要翻译: PCT No.PCT / JP94 / 01393 Sec。 371日期:1995年5月22日 102(e)日期1995年5月22日PCT 1994年8月24日PCT公布。 第WO95 / 09951号公报 日期:1995年04月13日一种使用配置有流体控制机构的管道材料的阀装置,其包括由金属管材制成的阀装置本体(11),并且具有一体形成在壳体的外表面上的管状凸缘(21) 所述主体从其突出,以及用于形成流动通道的管状构件(12),其在其基端处装配并连接到所述管状凸缘(21)的顶端。 管状凸缘(21)形成为使其与阀体内的流路连通的基端部的开口面积大于管状凸缘顶端的开口面积。 管状凸缘(21)的基端部的内周部(21a)形成有平滑的曲面,沿着这样的曲面形成流路。
-
公开(公告)号:US06593844B1
公开(公告)日:2003-07-15
申请号:US09868028
申请日:2001-06-13
IPC分类号: H01C710
CPC分类号: H01C17/006 , H01C1/1406 , H01C7/021 , H01C7/028
摘要: A chip PTC thermistor comprising a conductive polymer having PTC properties, a first outer electrode, a second outer electrode, one or more inner electrodes sandwiched between the conductive polymer, a first electrode electrically directly coupled with the first outer electrode, and a second electrode. The odd-numbered inner electrode among the one-or-more inner electrodes is directly coupled with the second electrode, while the even-numbered inner electrode, with the first electrode. When total number of the inner electrodes is an odd number the second outer electrode makes direct electrical contact with the first electrode, when it is an even number the second outer electrode makes direct electrical contact with the second electrode. Defining a distance from the odd-numbered inner electrode to the first electrode, or from the even-numbered inner electrode to the second electrode, as “a”, while a distance between the adjacent inner electrodes, or a distance between the inner electrode placed the most adjacent to the first outer electrode, or the second outer electrode, and the first outer electrode, or the second outer electrode, as “t”; the PTC thermistors are constituted so that a ratio a/t is within 3-6. The chip PTC thermistors in accordance with the present invention effectively prevent an overcurrent in large current circuits.
摘要翻译: 一种片状PTC热敏电阻,包括具有PTC性质的导电聚合物,第一外部电极,第二外部电极,夹在导电聚合物之间的一个或多个内部电极,与第一外部电极直接耦合的第一电极和第二电极。 一个或多个内部电极中的奇数内部电极与第二电极直接耦合,而偶数内部电极与第一电极直接耦合。 当内部电极的总数为奇数时,第二外部电极与第一电极直接电接触,当第二外部电极为偶数时,第二外部电极与第二电极直接电接触。 将从奇数编号的内部电极到第一电极或从偶数的内部电极到第二电极的距离定义为“a”,而相邻的内部电极之间的距离或放置的内部电极之间的距离 与第一外电极或第二外电极最相邻,第一外电极或第二外电极为“t”; PTC热敏电阻构成为a / t比在3-6以内。 根据本发明的芯片PTC热敏电阻有效地防止了大电流电路中的过电流。
-
公开(公告)号:US07183892B2
公开(公告)日:2007-02-27
申请号:US10893277
申请日:2004-07-19
申请人: Junji Kojima , Kohichi Morimoto , Takashi Ikeda , Toshiyuki Iwao
发明人: Junji Kojima , Kohichi Morimoto , Takashi Ikeda , Toshiyuki Iwao
IPC分类号: H01C7/10
CPC分类号: H01C17/006 , H01C1/1406 , H01C7/02 , H01C7/027 , Y10T29/49082 , Y10T29/49083 , Y10T29/49085 , Y10T29/49099
摘要: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
摘要翻译: 芯片PTC热敏电阻器可以在将焊接部件安装在印刷电路板上并且可以用于流动焊接工艺中以及其制造方法之后容易地检查焊接部分。 本发明的片式PTC热敏电阻器包括:具有PTC特性的立方形导电聚合物的第一表面上的第一主电极和第一子电极,与第二主电极相对的第二表面上的第二主电极和第二子电极 导电聚合物的第一表面。 在第一子电极和第二子电极之间以及第一子电极和第二主电极之间分别与第一侧电极和第二侧电极电连接。
-
公开(公告)号:US06782604B2
公开(公告)日:2004-08-31
申请号:US09462439
申请日:2000-02-16
申请人: Junji Kojima , Kohichi Morimoto , Takashi Ikeda , Toshiyuki Iwao
发明人: Junji Kojima , Kohichi Morimoto , Takashi Ikeda , Toshiyuki Iwao
IPC分类号: H01C702
CPC分类号: H01C17/006 , H01C1/1406 , H01C7/02 , H01C7/027 , Y10T29/49082 , Y10T29/49083 , Y10T29/49085 , Y10T29/49099
摘要: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
摘要翻译: 芯片PTC热敏电阻器可以在将焊接部件安装在印刷电路板上并且可以用于流动焊接工艺中以及其制造方法之后容易地检查焊接部分。 本发明的片式PTC热敏电阻器包括:具有PTC特性的立方形导电聚合物的第一表面上的第一主电极和第一子电极,与第二主电极相对的第二表面上的第二主电极和第二子电极 导电聚合物的第一表面。 在第一子电极和第二子电极之间以及第一子电极和第二主电极之间分别与第一侧电极和第二侧电极电连接。
-
-
-
-
-
-
-
-
-