公开(公告)号：US08773825B2

公开(公告)日：2014-07-08

申请号：US13550318

申请日：2012-07-16

申请人： Tooru Matsui ,  Masanori Hirofuji ,  Yoshifumi Kumashiro ,  Tatsuya Naruse ,  Hiroaki Segawa

发明人： Tooru Matsui ,  Masanori Hirofuji ,  Yoshifumi Kumashiro ,  Tatsuya Naruse ,  Hiroaki Segawa

IPC分类号： H02H9/00

CPC分类号： H02H9/046 ,  H01L27/0248 ,  H01L27/0266

摘要： An electrode pad is provided above a circuit block of a semiconductor integrated circuit device. A junction point A and a junction point B are provided on connection lines connecting electrode pads to an internal circuit and an electrostatic discharge (ESD) protection circuit. The junction point A and the junction point B are positioned at locations closer to the ESD protection circuit than to the electrode pads.

摘要翻译： 电极焊盘设置在半导体集成电路器件的电路块的上方。 在将电极焊盘连接到内部电路和静电放电（ESD）保护电路的连接线上设有接合点A和接合点B. 接合点A和接合点B位于靠近ESD保护电路的位置，而不是电极焊盘。

公开(公告)号：US07514794B2

公开(公告)日：2009-04-07

申请号：US11723064

申请日：2007-03-16

申请人： Tatsuya Naruse ,  Atsushi Yamamoto

发明人： Tatsuya Naruse ,  Atsushi Yamamoto

IPC分类号： H01L23/48

CPC分类号： H01L27/11807 ,  H01L23/5286 ,  H01L27/0207 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor integrated circuit of the present invention comprises: a standard cell group including a power supply wiring group or a ground wiring group, which is arranged at an interval based upon a design rule; a connection wiring that is provided in a same layer as the standard cell group for connecting between the power supply wirings or between the ground wirings; a strap wiring that crosses with the connection wiring three-dimensionally; and a connector body for interlayer-connecting the connection wiring and the strap wiring. The connector body has a shape different from that of the power supply wiring or the ground wiring.

摘要翻译： 本发明的半导体集成电路包括：基于设计规则以间隔配置的包括电源布线组或接地布线组的标准单元组; 连接布线，其设置在与标准单元组相同的层中，用于连接电源布线或接地布线; 三维地与连接配线交叉的带状布线; 以及用于将连接布线和带布线夹层连接的连接器主体。 连接器主体具有与电源线或接地线不同的形状。

公开(公告)号：US08669593B2

公开(公告)日：2014-03-11

申请号：US12963073

申请日：2010-12-08

申请人： Tatsuya Naruse

发明人： Tatsuya Naruse

IPC分类号： H01L27/118

CPC分类号： H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor integrated circuit according to the present invention includes an I/O cell, a first PAD connected to the I/O cell, first and second PADs, a package wire which is connected to the first PAD and allows connection between the first PAD and an outside of the semiconductor integrated circuit, and a second package wire which is connected to the second PAD and allows connection between the second PAD and an outside of the semiconductor integrated circuit. A connection point between the first PAD and the fist package wire is located in an area where the I/O cell is placed. A connection point between the second PAD and the second package wire is located outside an area where the I/O cell is placed.

摘要翻译： 根据本发明的半导体集成电路包括I / O单元，连接到I / O单元的第一PAD，第一和第二PAD，连接到第一PAD的封装线，并且允许第一PAD和 半导体集成电路的外部，以及连接到第二PAD并且允许第二PAD与半导体集成电路的外部之间的连接的第二封装线。 第一PAD和第一包装线之间的连接点位于放置I / O单元的区域中。 第二PAD和第二封装线之间的连接点位于放置I / O单元的区域的外部。

公开(公告)号：US20080042284A1

公开(公告)日：2008-02-21

申请号：US11723064

申请日：2007-03-16

申请人： Tatsuya Naruse ,  Atsushi Yamamoto

发明人： Tatsuya Naruse ,  Atsushi Yamamoto

IPC分类号： H01L23/48

CPC分类号： H01L27/11807 ,  H01L23/5286 ,  H01L27/0207 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor integrated circuit of the present invention comprises: a standard cell group including a power supply wiring group or a ground wiring group, which is arranged at an interval based upon a design rule; a connection wiring that is provided in a same layer as the standard cell group for connecting between the power supply wirings or between the ground wirings; a strap wiring that crosses with the connection wiring three-dimensionally; and a connector body for interlayer-connecting the connection wiring and the strap wiring. The connector body has a shape different from that of the power supply wiring or the ground wiring.

摘要翻译： 本发明的半导体集成电路包括：基于设计规则以间隔配置的包括电源配线组或接地配线组的标准电池组; 连接布线，其设置在与标准单元组相同的层中，用于连接电源布线或接地布线; 三维地与连接配线交叉的带状布线; 以及用于将连接布线和带布线夹层连接的连接器主体。 连接器主体具有与电源线或接地线不同的形状。

公开(公告)号：US06348542B1

公开(公告)日：2002-02-19

申请号：US09678735

申请日：2000-10-04

申请人： Tatsuya Naruse ,  Takao Hoshiba ,  Kazutoshi Terada ,  Takashi Yamashita ,  Yuichi Katoh

发明人： Tatsuya Naruse ,  Takao Hoshiba ,  Kazutoshi Terada ,  Takashi Yamashita ,  Yuichi Katoh

IPC分类号： C08L5104

CPC分类号： C08F285/00 ,  C08F220/14

摘要： This invention relates to multiphase structured polymer particles comprising at least two rubber component phases (I) formed by copolymerization of monomer mixtures comprising an acrylate ester and a polyfunctional monomer, a thermoplastic resin component phase (II) formed by copolymerization of a monomer mixture comprising a methacrylate ester and other monomers, and satisfying the following conditions (1)-(5). (1) The number average molecular weight of the thermoplastic resin component forming the outermost phase is 30,000 or less. (2) The weight ratio of phase (I)/phase (II) is 30/70-80/20. (3) Of the adjacent phases (1), a specific relation holds regarding the solubility in water of the monomer mixtures forming the nth and n+1th phases. (4) A specific relation holds between the refractive index of phase (I) and the refractive index of phase (II). (5) The average particle size is 150 nm or less. When the multiphase structured polymer particles according to this invention are used alone to form molded products, molded products having excellent transparency and elastic recovery properties can be obtained.

摘要翻译： 本发明涉及多相结构聚合物颗粒，其包含由包含丙烯酸酯和多官能单体的单体混合物的共聚形成的至少两个橡胶组分相（I），通过单体混合物共聚形成的热塑性树脂组分相（II） 甲基丙烯酸酯等单体，满足下列条件（1） - （5）。 （1）形成最外相的热塑性树脂成分的数均分子量为30,000以下。 （2）相（I）/相（II）的重量比为30 / 70-80 / 20。 （3）在相邻相（1）中，关于形成第n相和第n + 1相的单体混合物在水中的溶解度的特定关系。 （4）相（I）的折射率和相（II）的折射率之间的具体关系成立。 （5）平均粒径为150nm以下。 当本发明的多相结构化聚合物颗粒单独使用以形成模塑产品时，可以获得具有优异的透明性和弹性恢复性的模塑产品。