公开(公告)号：US20180228396A1

公开(公告)日：2018-08-16

申请号：US15951531

申请日：2018-04-12

Applicant: Toppan Printing Co., Ltd.

Inventor： Toshikazu OKUBO ,  Ryo WARIGAYA ,  Masahiro KOSUGI ,  Kazuyo MINOWA

IPC: A61B5/07 ,  G01N27/327 ,  A61B5/145 ,  G01N33/48

CPC classification number: A61B5/07 ,  A61B5/14 ,  A61B5/14532 ,  A61B5/14539 ,  A61B5/1473 ,  A61B5/6861 ,  G01N27/327 ,  G01N33/48

Abstract: The biosensor of the present invention includes two or more electrodes and a support supporting the two or more electrodes. One or more of the electrodes each include a substrate having a metal surface, and a protective layer covering at least part of the surface. The protective layer is a continuous film made of carbon and having a thickness of at least 1 μm.

公开(公告)号：US20150334828A1

公开(公告)日：2015-11-19

申请号：US14808275

申请日：2015-07-24

Applicant: TOPPAN PRINTING CO. LTD. ,  NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY

Inventor： Tetsuyuki TSUCHIDA ,  Toshikazu OKUBO ,  lkuo SHOHJI ,  Akihiro HIRATA

IPC: H05K1/09 ,  H05K3/24 ,  C22C13/02 ,  B23K1/00 ,  C25D7/00 ,  B23K35/26 ,  H05K3/10 ,  B23K1/19

CPC classification number: H05K1/09 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K35/262 ,  C22C13/02 ,  C25D7/00 ,  H01L2924/0002 ,  H05K3/10 ,  H05K3/244 ,  H05K2201/0341 ,  H05K2203/043 ,  H01L2924/00

Abstract: There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.

Abstract translation: 提供一种布线基板，其包括包含Cu或Cu合金的电极，形成在电极上的至少包含Pd的镀膜和通过加热结合到镀膜上的焊料，其熔点为 低于140℃，并且包括溶解在其中的Pd，焊料和电极之间不存在Pd浓缩层。

公开(公告)号：US20140332259A1

公开(公告)日：2014-11-13

申请号：US14444135

申请日：2014-07-28

Applicant: TOPPAN PRINTING CO., LTD. ,  NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY

Inventor： Tetsuyuki TSUCHIDA ,  Toshikazu OKUBO ,  Ikuo SHOHJI ,  Takahiro KANO

IPC: H05K1/09 ,  C23C18/36 ,  H05K3/24

CPC classification number: H05K1/09 ,  C23C18/1651 ,  C23C18/36 ,  C23C18/44 ,  C23C18/50 ,  H05K3/243 ,  H05K3/244 ,  H05K2201/032 ,  H05K2201/0776 ,  H05K2203/072

Abstract: A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.

Abstract translation: 布线基板包括包含Cu或Cu合金的电极和形成在电极上的化学镀镍层和形成在化学镀镍层上的化学镀金层的镀膜。 化学镀镍层通过Ni，P，Bi和S的共沉淀形成，无电镀镍层的P含量为5质量％以上且小于10质量％，含量 的Bi为1质量ppm〜1000质量ppm，S为1质量ppm〜2000质量ppm，S含量与Bi（S / Bi）含量的质量比为更多 比1.0。

公开(公告)号：US20160377573A1

公开(公告)日：2016-12-29

申请号：US15259734

申请日：2016-09-08

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Masahiro KOSUGI ,  Toshikazu OKUBO

IPC: G01N27/42

Abstract: An electrolytic copper plating solution analyzer comprises an analysis container for accommodating a part of an electrolytic copper plating solution containing additives including a promoter, an inhibitor and a leveler, a working electrode immersed in the electrolytic copper plating solution accommodated in the analysis container, a reference electrode immersed in the electrolytic copper plating solution and used as a reference when a potential of the working electrode is determined, a counter electrode immersed in the electrolytic copper plating solution, a rotation drive unit for rotating the working electrode at a given speed, a current generation unit passing an electric current with a given current density between the working electrode and the counter electrode, a potential measurement unit for measuring the potential between the working electrode and the reference electrode, and an analysis unit for analyzing the relationship between an elapsed time after the current passage and the potential.

Abstract translation: 一种电解铜电镀溶液分析仪，包括用于容纳包含助催化剂，抑制剂和整平剂的添加剂的电解铜电镀溶液的一部分的分析容器，浸在容纳在分析容器中的电解铜电镀溶液中的工作电极， 电极浸在电解镀铜溶液中，并且当确定工作电极的电位时用作参考，浸没在电解镀铜溶液中的对电极，以给定速度旋转工作电极的旋转驱动单元，电流 在工作电极和对电极之间通过具有给定电流密度的电流的发电单元，用于测量工作电极和参考电极之间的电位的电位测量单元和用于分析工作电极和参比电极之间的经过时间之间的关系之间的关系的分析单元 当前的段落和 潜力。