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公开(公告)号：US07315766B2
公开(公告)日：2008-01-01
申请号：US10544140
申请日：2004-02-20
IPC分类号： G06F19/00
CPC分类号： H05K13/08 , Y10T29/53174 , Y10T29/53178
摘要： In component mounting for executing a component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operational program for executing the component holding and pickup operation is received in a head unit, and the component holding and pickup operation is executed on the basis of the recipe. In addition, a timing signal based on this execution is transmitted from the head unit to a component feed unit, a recipe for the component feed operation for executing the component feed operation is received in the component feed unit, and the component feed operation is completed on the basis of this recipe and the timing signal transmitted from the head unit.
摘要翻译： 在用于执行元件供给操作和元件保持和拾取操作的元件安装中，在头单元中接收作为用于执行元件保持和拾取操作的操作程序的元件保持和拾取操作的配方，并且元件保持和拾取操作 基于配方执行拾取操作。 此外，基于该执行的定时信号从头单元发送到分量供给单元，在分量供给单元中接收用于执行分量进给操作的分量进给操作的配方，并且分量进给操作完成 基于该配方和从头单元发送的定时信号。
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公开(公告)号：US20060179645A1
公开(公告)日：2006-08-17
申请号：US10544140
申请日：2004-02-20
IPC分类号： B23P19/00
CPC分类号： H05K13/08 , Y10T29/53174 , Y10T29/53178
摘要： In component mounting for executing component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operation program for executing the component holding and pickup operation is received in a head unit, and the component holding and pickup operation is executed on the basis of the recipe. In addition, a timing signal based on the execution is transmitted to a component feed unit, the recipe for the component feed operation for executing the component feed operation is received in the component feed unit, and the component feed operation is completed on the basis of the recipe and the timing signal transmitted from the head unit.
摘要翻译： 在用于执行部件供给操作和部件保持和拾取操作的部件安装中，在头单元中接收作为用于执行部件保持和拾取操作的操作程序的部件保持和拾取操作的配方，并且部件保持和拾取 基于配方执行操作。 此外，基于执行的定时信号被传送到分量进给单元，在分量进给单元中接收用于执行分量进给操作的分量进给操作的配方，并且基于 从头单元传送的食谱和定时信号。
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公开(公告)号：US07200922B2
公开(公告)日：2007-04-10
申请号：US11222153
申请日：2005-09-09
申请人： Akira Kabeshita , Naoto Mimura , Noriaki Yoshida , Yoshihiko Misawa , Takeyuki Kawase , Tetsutarou Hachimura , Toshiro Nishiwaki , Taira Ishii , Mitsuo Kawate , Hideaki Watanabe
发明人： Akira Kabeshita , Naoto Mimura , Noriaki Yoshida , Yoshihiko Misawa , Takeyuki Kawase , Tetsutarou Hachimura , Toshiro Nishiwaki , Taira Ishii , Mitsuo Kawate , Hideaki Watanabe
IPC分类号： B23P19/00
CPC分类号： H05K13/0061 , H05K13/085 , Y10T29/53178 , Y10T29/53191 , Y10T29/53396
摘要： A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.
摘要翻译： 提供能够彼此独立地执行用于两个板的部件保持，部件识别和部件放置的第一安装单元和第二安装单元。 独立地布置用于装载和卸载第一板的第一输送路径和用于装载和卸载第二板的第二输送路径。
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公开(公告)号：US20060200979A1
公开(公告)日：2006-09-14
申请号：US11433357
申请日：2006-05-15
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/041 , H05K13/0413 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T29/5137 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53261 , Y10T29/53265
摘要： Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.
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公开(公告)号：US07100278B2
公开(公告)日：2006-09-05
申请号：US10079494
申请日：2002-02-22
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
CPC分类号： H05K13/041 , H05K13/0812 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A component mounting apparatus have a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzle, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head section performs successive suction, recognition, posture adjustment, and mounting of the components.
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公开(公告)号：US06789310B1
公开(公告)日：2004-09-14
申请号：US09010490
申请日：1998-01-21
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
IPC分类号： B23P1900
CPC分类号： H05K13/0452 , H05K13/041 , H05K13/0413 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T29/5137 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53261 , Y10T29/53265
摘要： There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
摘要翻译： 提供了多个部件安装装置，用于通过安装头部分抽吸多个部件，并将部件依次安装在位于板定位部分的板上。 部件安装装置彼此平行地布置，并且设置板传送路径，使得其穿过部件安装装置。 即使当安装到板上的部件的数量增加时，部件被安装在分配到部件安装装置的部件供给台上，因此整个装置的尺寸不增加。 部件供给台被固定地安装成没有振动，并且安装头部执行多个部件的抽吸和安装。 因此，能够显着提高部件安装动作速度。
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公开(公告)号：US06735856B1
公开(公告)日：2004-05-18
申请号：US09435836
申请日：1999-11-08
IPC分类号： H05K330
CPC分类号： H05K13/0409 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/53013 , Y10T29/53091 , Y10T29/53178 , Y10T29/53191
摘要： The present invention includes a component placement apparatus that can obtain information on the presence/absence of hold members inexpensively and easily, and a component placement method carried out by the component placement apparatus. A replacement hold member detector for detecting the presence/absence of replacement hold members at a hold member change part is installed at a placement head. The presence/absence is detected by moving an XY-robot so as to scan the hold member change part equipped with the replacement hold member detector. At the same time, type information attached to the replacement hold members is rendered readable by the replacement hold member detector. One replacement hold member detector is enough according to the apparatus and method of the present invention. The presence/absence information of the hold members can be obtained inexpensively and easily.
摘要翻译： 本发明包括能够廉价且容易地获得关于保持构件的存在/不存在的信息的部件配置装置以及由部件安置装置执行的部件安置方法。 用于检测在保持构件改变部分处的更换保持构件的存在/不存在的更换保持构件检测器安装在放置头部。 通过移动XY机器人来检测存在/不存在，以扫描配备有更换保持构件检测器的保持构件改变部分。 同时，由更换保持构件检测器使附加到更换保持构件的类型信息变得可读。 根据本发明的装置和方法，一个替换保持构件检测器就足够了。 可以廉价且容易地获得保持构件的存在/不存在信息。
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公开(公告)号：US06584683B2
公开(公告)日：2003-07-01
申请号：US09769515
申请日：2001-01-26
申请人： Noriaki Yoshida , Yoshihiro Mimura , Shozo Fukuda , Kanji Hata
发明人： Noriaki Yoshida , Yoshihiro Mimura , Shozo Fukuda , Kanji Hata
IPC分类号： H05K330
CPC分类号： H05K13/0413 , H05K13/0813 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178 , Y10T29/53191
摘要： In an electronic component mounting method and apparatus, an electronic component is taken out from an electronic component feed position, a posture of the component is detected, and the component is mounted on a board based on a detected result. The method includes acquiring image data with a camera of the component from the feed position, processing acquired image data with a plurality of algorithms for detecting postures of components, and detecting a posture of the component.
摘要翻译： 在电子部件安装方法和装置中，从电子部件供给位置取出电子部件，检测出部件的姿势，根据检测结果将部件安装在基板上。 该方法包括从进给位置利用组件的照相机获取图像数据，用用于检测部件姿势的多种算法处理获取的图像数据，以及检测部件的姿势。
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公开(公告)号：US6094808A
公开(公告)日：2000-08-01
申请号：US192400
申请日：1998-11-16
申请人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
发明人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
CPC分类号： H05K13/0452 , H05K13/0408 , Y10T29/4913 , Y10T29/49144 , Y10T29/53022 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261
摘要： An electronic component mounting apparatus for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. The air pressure switching timings are switched according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. An electronic component mounting apparatus includes a suction nozzle for sucking an electronic component and placing it onto a board, a device for moving up and down the suction nozzle for suction and mounting of the electronic component, an air pressure switching unit for switching air pressure to the suction nozzle at an electronic component suction position and an electronic component mounting position, and a switching drive unit for performing switching control of the air pressure switching unit independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.
摘要翻译： 一种用于吸附电子部件并将其放置在具有吸嘴的板上的电子部件安装装置，包括当用吸嘴吸取部件时切换吸嘴的空气压力切换定时的步骤，以及当吸入部件 安装在板上。 空气压力切换定时根据吸嘴的上下运动速度进行切换，并且独立地用于当吸附有吸入部件的部件和吸附部件安装在基板上时。 一种电子部件安装装置，包括：吸引电子部件并将其放置在基板上的吸嘴，将吸引和吸附电子部件的吸嘴上下移动的装置，将气压切换为 电子部件吸引位置处的吸嘴和电子部件安装位置，以及开关驱动单元，其用于当部件被吸嘴吸引时，分别独立地执行空气压力切换单元的切换控制，并且当吸入部件为 安装在板上。
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10.发明授权公开(公告)号：US07513036B2
公开(公告)日：2009-04-07
申请号：US10596218
申请日：2005-08-31
IPC分类号： H05K3/30
CPC分类号： B23K3/087 , B23K37/047 , H01L2224/75502 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53187
摘要： A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S1), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S3), measuring load after the step of moving down the head (S5), and determining whether the measured contact load has reached the target contact load (S9). The steps of moving down the head (S3) and measuring the load (S5) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.
摘要翻译： 一种控制用于将电子部件安装在基板上的装置中的接触负载的方法，其中头部以高速降低以减慢起始位置，其中电子部件不接触基板的风险（S1）;以及 从那里头部以低速降低，直到检测到预定的目标接触负载。 低速降低头部的处理包括以下步骤：使头部向下移动预定距离（S3），测量头部向下移动步骤后的负载（S5），以及确定所测量的接触负载是否已达到目标接触 负载（S9）。 重复下降头部（S3）和测量负载（S5）的步骤，直到测量的负载达到目标接触负载。 实际负载被精确地控制为接近非常小的目标接触负载的设定水平。 因此，使用低介电常数材料的电子部件安装而不会有损坏的危险。
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