摘要:
The present invention relates to a positive working photosensitive composition having an improved sensitivity due to the use of a sensitizer and having an excellent incandescent light safety. This composition comprises at least 1 molar % of a structural unit derived from at least one of monomers having the following general formulae: ##STR1## wherein: R.sub.1 represents a hydrogen atom, an alkyl group or a substituted alkyl group,R.sub.2 represents a divalent alkylene group or a substituted divalent alkylene group,R.sub.3, R.sub.4 and R.sub.5 may be the same as or different from each other and each represents an alkyl group, a substituted alkyl group, an aryl group or a substituted aryl group,R.sub.6 and R.sub.7 may be the same as or different from each other and each represents a hydrogen atom, an alkyl group, a substituted alkyl group, an aryl group or a substituted aryl group,Ar.sub.1 represents a single bond or Ar.sub.2, andAr.sub.2 represents a divalent arylene group or a substituted divalent arylene group.
摘要:
The photosensitive composition suitable as a posi-posi photosensitive composition for photosensitive lithographic printing plates is composed of a high molecular compound shown by following general formula I or II and an o-naphthoquinonediazide compound; ##STR1## wherein R.sub.1 is a hydrogen atom, an alkyl group having 1 to 8 carbon atoms and R.sub.2 and R.sub.3 each is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.When the photosensitive composition is used as a photosensitive layer of a photosensitive lithographic printing plate and the plate is developed by rubbing with a sponge containing a developer, the photosensitive composition at the exposed areas is completely removed leaving no patches of the composition.
摘要:
A positive photosensitive composition comprises a compound capable of generating a specified sulfonic acid upon irradiation with one of an actinic ray and radiation and (B) a resin capable of decomposing under the action of an acid to increase the solubility in an alkali developer.
摘要:
A positive type photoresist composition suitable for light in the wavelength region of 170 nm to 220 nm, high in sensitivity, excellent in adhesion and giving a good resist pattern profile, which comprises a resin having an ester group represented by the following general formula [I] in its molecule and a compound generating an acid by irradiation of an active light ray or radiation: wherein R1 represents a hydrogen atom, an alkyl group or a cycloalkyl group; and R2 and R3, which may be the same or different, each represents a hydrogen atom, an alkyl group, a cycloalkyl group or -A-R4, and R2 and R3 may combine together to form a ring, wherein R4 represents a hydrogen atom, an alkyl group or a cycloalkyl group, R4 and R2 or R3 may combine together to form a ring, and A represents an oxygen atom or a sulfur atom.
摘要:
An ink composition is provided that includes a cationically polymerizable compound (a), a compound (b) that generates an acid when exposed to radiation, a colorant (c), and a salt of a weak acid having a pKa of 4 to 8 (d). There is also provided an inkjet recording method that includes a step of discharging the ink composition onto a recording medium, and a step of irradiating the discharged ink composition with radiation so as to cure the ink composition.
摘要:
An ink composition is provided that includes (a) a polymerizable compound, (b) a polymerization initiator, (c) a coloring agent, and (d) a fragrance. There is also provided an inkjet recording method that includes a step of discharging the ink composition onto a recording medium, and a step of irradiating the discharged ink composition with radiation so as to cure the ink composition.
摘要:
A positive photoresist composition comprises: an acid-decomposable resin containing a specified repeating unit; an acid-generator; and a specified dissolution-inhibiting compound.
摘要:
A positive photosensitive composition comprises a compound capable of generating a specified sulfonic acid upon irradiation with one of an actinic ray and radiation and (B) a resin capable of decomposing under the action of an acid to increase the solubility in an alkali developer.
摘要:
A negative-working resist composition for electron beams or X-rays comprising (A) a compound generating an acid and/or radical species by the irradiation of electron beams or X-rays, (B) a resin which is insoluble in water and soluble in an alkali aqueous solution, (C) a crosslinking agent causing crosslinking with the resin of component (B) by the action of an acid, and (D) a compound having at least one unsaturated bond capable of being polymerized by an acid and/or a radical, and a negative-working resist composition for electron beams or X-rays comprising (A) a compound generating an acid and/or radical species by the irradiation of electron beams or X-rays, (B′) a resin having at least one unsaturated bond polymerizable by an acid and/or an alkali, which is insoluble in water but soluble in an alkali aqueous solution, and (C) a crosslinking agent causing crosslinking with the resin (B′) by the action of an acid are disclosed.
摘要:
A positive photoresist composition comprises the combination of (a) Resin A obtained from an alkali-soluble resin containing phenolic hydroxyl groups by replacing from 10 to 80% of the phenolic hydroxyl groups each with a group represented by formula (I) and (b) Resin B obtained from an alkali-soluble resin containing phenolic hydroxyl groups by replacing from 10 to 80% of the phenolic hydroxyl groups each with a group represented by formula (II) or (III) or a nonpolymeric dissolution inhibitive compound which has at least one kind of group selected from tertiary alkyl ester groups and tertiary alkyl carbonate groups; wherein R1, W, n, and R4 are as defined in the specification.