公开(公告)号：US08931168B2

公开(公告)日：2015-01-13

申请号：US13430038

申请日：2012-03-26

申请人： Toshiaki Hibino ,  Takema Adachi

发明人： Toshiaki Hibino ,  Takema Adachi

IPC分类号： H01K3/30 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/0038 ,  H05K3/3478 ,  H05K3/422 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2203/041 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for manufacturing a printed wiring board includes preparing a core substrate having a first surface and a second surface on the opposite side of the first surface, forming on the first-surface side of the substrate a first opening portion tapering from the first toward second surface, forming on the second-surface side of the substrate a second opening portion tapering from the second toward first surface, forming a third opening portion such that a penetrating hole formed of the first opening portion, the second opening portion and the third opening portion connecting the first and second opening portions is formed in the substrate, forming a first conductor on the first surface of the substrate, forming a second conductor on the second surface of the substrate, and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first and second conductors is formed.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，具备：在所述第一面的相反一侧具有第一面和第二面的芯基板，在所述基板的所述第一表面侧形成从所述第一面到第二表面逐渐变细的第一开口部 在所述基板的所述第二表面侧上形成从所述第二朝向第一表面渐缩的第二开口部，形成第三开口部，使得由所述第一开口部，所述第二开口部和所述第三开口部形成的贯通孔 连接第一和第二开口部分形成在基板中，在基板的第一表面上形成第一导体，在基板的第二表面上形成第二导体，并在导电孔中填充导电材料， 形成连接第一和第二导体的孔导体。

公开(公告)号：US09420708B2

公开(公告)日：2016-08-16

申请号：US13427231

申请日：2012-03-22

申请人： Toshiaki Hibino ,  Takema Adachi

发明人： Toshiaki Hibino ,  Takema Adachi

IPC分类号： H01K3/10 ,  H05K3/46 ,  H05K3/44 ,  H01L23/498 ,  H01L21/48

CPC分类号： H05K3/4608 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/445 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49124

摘要： A method for manufacturing a printed wiring board includes preparing a core substrate having a metal layer having a first penetrating hole and insulation layers formed on the metal layer such that the metal layer is interposed between the insulation layers, forming in the core substrate a second penetrating hole having a first opening portion aligned with the first penetrating hole on a first-surface side of the core substrate and a second opening portion aligned with the first penetrating hole on a second-surface side of the core substrate, forming a first conductor on a first surface of the core substrate, forming a second conductor on a second surface of the core substrate on the opposite side of the first surface of the core substrate, and filling a conductive material in the second penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed.

摘要翻译： 一种制造印刷电路板的方法，包括制备具有第一穿透孔的金属层和形成在金属层上的绝缘层的芯基板，使得金属层插入在绝缘层之间，在芯基板中形成第二穿透 在芯基板的第一表面侧具有与第一贯通孔对准的第一开口部和与芯基板的第二表面侧的第一贯通孔对准的第二开口部， 在芯基板的第一表面上，在芯基板的第一表面的相对侧上的芯基板的第二表面上形成第二导体，并且在第二贯穿孔中填充导电材料，使得连接 形成第一导体和第二导体。

公开(公告)号：US20120246925A1

公开(公告)日：2012-10-04

申请号：US13430038

申请日：2012-03-26

申请人： Toshiaki Hibino ,  Takema Adachi

发明人： Toshiaki Hibino ,  Takema Adachi

IPC分类号： H05K3/46 ,  C25D5/02 ,  H05K3/36

CPC分类号： H05K3/0038 ,  H05K3/3478 ,  H05K3/422 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2203/041 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for manufacturing a printed wiring board includes preparing a core substrate having a first surface and a second surface on the opposite side of the first surface, forming on the first-surface side of the substrate a first opening portion tapering from the first toward second surface, forming on the second-surface side of the substrate a second opening portion tapering from the second toward first surface, forming a third opening portion such that a penetrating hole formed of the first opening portion, the second opening portion and the third opening portion connecting the first and second opening portions is formed in the substrate, forming a first conductor on the first surface of the substrate, forming a second conductor on the second surface of the substrate, and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first and second conductors is formed.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，具备：在所述第一面的相反一侧具有第一面和第二面的芯基板，在所述基板的所述第一表面侧形成从所述第一面到第二表面逐渐变细的第一开口部 在所述基板的所述第二表面侧上形成从所述第二朝向第一表面渐缩的第二开口部，形成第三开口部，使得由所述第一开口部，所述第二开口部和所述第三开口部形成的贯通孔 连接第一和第二开口部分形成在基板中，在基板的第一表面上形成第一导体，在基板的第二表面上形成第二导体，并在导电孔中填充导电材料， 形成连接第一和第二导体的孔导体。