公开(公告)号：US06993836B2

公开(公告)日：2006-02-07

申请号：US10648187

申请日：2003-08-27

申请人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hideaki Komoda ,  Kunio Kishimoto

发明人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hideaki Komoda ,  Kunio Kishimoto

IPC分类号： H01K3/10

CPC分类号： H05K3/462 ,  H05K1/0268 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.

摘要翻译： 可以获得具有稳定的连接电阻的电路板。 多层电路板包括以下步骤：在不可压缩的基板上形成通孔，该基板在其任一侧经由接合层具有膜; 将导电膏填充到通孔中; 从基板去除膜; 将金属箔层叠到基板的任一侧并在压力下加热相同以使粘合层硬化，将金属箔粘合到基板上并将基板的侧面彼此电连接; 并通过加工金属箔形成电路图案。

公开(公告)号：US06700071B2

公开(公告)日：2004-03-02

申请号：US09928966

申请日：2001-08-14

申请人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hideaki Komoda ,  Kunio Kishimoto

发明人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hideaki Komoda ,  Kunio Kishimoto

IPC分类号： H05K103

CPC分类号： H05K3/462 ,  H05K1/0268 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.

摘要翻译： 可以获得具有稳定的连接电阻的电路板。 多层电路板包括以下步骤：在不可压缩的基板上形成通孔，该基板在其任一侧经由接合层具有膜; 将导电膏填充到通孔中; 从基板去除膜; 将金属箔层叠到基板的任一侧并在压力下加热相同以使粘合层硬化，将金属箔粘合到基板上并将基板的侧面彼此电连接; 并通过加工金属箔形成电路图案。

公开(公告)号：US06528733B2

公开(公告)日：2003-03-04

申请号：US09902800

申请日：2001-07-12

申请人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hideaki Komoda ,  Kunio Kishimoto

发明人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hideaki Komoda ,  Kunio Kishimoto

IPC分类号： H05K103

CPC分类号： H05K3/4614 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155

摘要： An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.

公开(公告)号：US07105277B2

公开(公告)日：2006-09-12

申请号：US10490482

申请日：2003-09-19

申请人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Hideaki Komoda ,  Toshikazu Kondo ,  Shinji Nakamura

发明人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Hideaki Komoda ,  Toshikazu Kondo ,  Shinji Nakamura

IPC分类号： G03F7/00 ,  G03F7/20

CPC分类号： H05K3/1225 ,  B41F15/36 ,  B41F35/003 ,  B41M1/12 ,  B41N1/24 ,  B41N1/248 ,  H05K3/0052 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/09063 ,  H05K2201/09709 ,  H05K2203/0191

摘要： The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.

摘要翻译： 本发明的目的在于提供一种印版，其能够防止粘贴在刮板的边缘上的高粘度浆料通过刮板方法被填充时被转移到印刷电路板的通孔上并留在印刷电路板的通孔上。 印版具有设置有形成在其上的刮板清洁部（7）的金属板（3），并固定在安装在板框架（1）上的掩模（2）的倾斜区域（5）的背面。 印刷电路板的通孔只有在通过刮板清洁部分（7）除去粘附到刮板的边缘的高粘度的浆料之后才能填充糊料，以防止糊料留在通孔上，从而 实现印刷电路板质量优良。

公开(公告)号：US07018672B2

公开(公告)日：2006-03-28

申请号：US10182632

申请日：2001-12-04

申请人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Yuichiro Sugita ,  Shinji Nakamura ,  Hideaki Komoda ,  Toshikazu Kondo

发明人： Toshiaki Takenaka ,  Toshihiro Nishii ,  Yuichiro Sugita ,  Shinji Nakamura ,  Hideaki Komoda ,  Toshikazu Kondo

IPC分类号： B05D5/12 ,  B05D3/12 ,  B41M1/12 ,  B41F9/10

CPC分类号： H05K3/4069 ,  H05K1/095 ,  H05K3/1233 ,  H05K3/247 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2203/1461 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.

公开(公告)号：US07754321B2

公开(公告)日：2010-07-13

申请号：US10660054

申请日：2003-09-11

申请人： Shigeru Yamane ,  Eiji Kawamoto ,  Hideaki Komoda ,  Takeshi Suzuki ,  Toshihiro Nishii ,  Shinji Nakamura

发明人： Shigeru Yamane ,  Eiji Kawamoto ,  Hideaki Komoda ,  Takeshi Suzuki ,  Toshihiro Nishii ,  Shinji Nakamura

IPC分类号： B32B27/04

CPC分类号： B32B5/14 ,  B32B15/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/0245 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49156 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249962 ,  Y10T428/249995 ,  Y10T428/2839 ,  Y10T442/2984 ,  Y10T442/607

摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

摘要翻译： 包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。 复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。 这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。 结果，提高了产率，可获得可靠的电路板。

公开(公告)号：US06833042B2

公开(公告)日：2004-12-21

申请号：US10149667

申请日：2002-10-09

申请人： Shigeru Yamane ,  Eiji Kawamoto ,  Hideaki Komoda ,  Takeshi Suzuki ,  Toshihiro Nishii ,  Shinji Nakamura

发明人： Shigeru Yamane ,  Eiji Kawamoto ,  Hideaki Komoda ,  Takeshi Suzuki ,  Toshihiro Nishii ,  Shinji Nakamura

IPC分类号： B29C6500

CPC分类号： B32B5/14 ,  B32B15/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/0245 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49156 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249962 ,  Y10T428/249995 ,  Y10T428/2839 ,  Y10T442/2984 ,  Y10T442/607

摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

摘要翻译： 包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。 复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。 这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。 结果，提高了产率，可获得可靠的电路板。

公开(公告)号：US20050249933A1

公开(公告)日：2005-11-10

申请号：US10660054

申请日：2003-09-11

申请人： Shigeru Yamane ,  Eiji Kawamoto ,  Hideaki Komoda ,  Takeshi Suzuki ,  Toshihiro Nishii ,  Shinji Nakamura

发明人： Shigeru Yamane ,  Eiji Kawamoto ,  Hideaki Komoda ,  Takeshi Suzuki ,  Toshihiro Nishii ,  Shinji Nakamura

IPC分类号： H05K1/09 ,  B32B5/00 ,  B32B5/14 ,  B32B15/08 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  D04H1/00

CPC分类号： B32B5/14 ,  B32B15/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/0245 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49156 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249962 ,  Y10T428/249995 ,  Y10T428/2839 ,  Y10T442/2984 ,  Y10T442/607

摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

摘要翻译： 包覆板的制造方法包括：将剥离膜粘贴到预浸片; 在包括脱模膜的预浸片中形成非通孔或通孔; 用导电膏填充孔; 剥离电影; 并将金属箔加热并加压到预浸片上。 复合板具有在预浸片的一个面或两面上形成的光滑面，使得导电膏被抑制在预浸片与剥离膜之间的界面中扩散。 这种结构可以避免电路之间的短路，并防止绝缘可靠性降低。 结果，提高了产率，可获得可靠的电路板。

公开(公告)号：US06820331B2

公开(公告)日：2004-11-23

申请号：US09736499

申请日：2000-12-15

申请人： Kunio Kishimoto ,  Toshihiro Nishii ,  Toshiaki Takenaka ,  Shinji Nakamura ,  Akihiro Miura

发明人： Kunio Kishimoto ,  Toshihiro Nishii ,  Toshiaki Takenaka ,  Shinji Nakamura ,  Akihiro Miura

IPC分类号： H01K310

CPC分类号： H05K3/4069 ,  H05K3/0032 ,  H05K3/0055 ,  H05K3/0088 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/0257 ,  H05K2203/0285 ,  H05K2203/0786 ,  H05K2203/081 ,  H05K2203/1461 ,  Y10S134/902 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T428/13

摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.

摘要翻译： 通过去除受影响的材料和形成孔时产生的异物，可以获得清洁的高质量电路板。 电路基板的制造方法包括：（a）通过将作为掩模的膜材料粘合到基板材料上来制备薄膜基板材料，（b）通过向其施加激光而在薄膜基板材料上形成孔 ，（c）通过超声波清洗，不从膜材剥离薄膜材料，从薄膜基板材料上选择性除去粘附在薄膜基板材料上的不必要的材料。 当形成孔时产生诸如异物等不必要的材料，并且不需要的材料粘附到基板材料上。 在去除这种不必要的材料之后，使用膜材料作为掩模将导电材料设置在孔中，并且膜材料随后从基板材料中去除。

公开(公告)号：US07143772B2

公开(公告)日：2006-12-05

申请号：US10733283

申请日：2003-12-12

申请人： Kunio Kishimoto ,  Toshihiro Nishii ,  Toshiaki Takenaka ,  Shinji Nakamura ,  Akihiro Miura

发明人： Kunio Kishimoto ,  Toshihiro Nishii ,  Toshiaki Takenaka ,  Shinji Nakamura ,  Akihiro Miura

IPC分类号： B08B3/12

CPC分类号： H05K3/4069 ,  H05K3/0032 ,  H05K3/0055 ,  H05K3/0088 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/0257 ,  H05K2203/0285 ,  H05K2203/0786 ,  H05K2203/081 ,  H05K2203/1461 ,  Y10S134/902 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T428/13

摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.

摘要翻译： 通过去除受影响的材料和形成孔时产生的异物，可以获得清洁的高质量电路板。 电路基板的制造方法包括：（a）通过将作为掩模的膜材料粘合到基板材料上来制备薄膜基板材料，（b）通过向其施加激光而在薄膜基板材料上形成孔 ，（c）通过超声波清洗，不从膜材剥离薄膜材料，从薄膜基板材料上选择性除去粘附在薄膜基板材料上的不必要的材料。 当形成孔时产生诸如异物等不必要的材料，并且不需要的材料粘附到基板材料上。 在去除这种不必要的材料之后，使用膜材料作为掩模将导电材料设置在孔中，并且膜材料随后从基板材料中去除。