摘要:
A liquid crystal display plastic cell structure free of deviation in position of electrode patterns comprising:a cell substrate comprising a polarizing plate and an electrode pattern provided on the surface of the polarizing plate, said polarizing plate being produced by laminating a monoaxially stretched film on both surfaces of a polarizer in such a manner that the absorption axis of the polarizer is in parallel with the stretching axis of the monoaxially oriented films:a cell substrate comprising a polarizing plate and an electrode pattern provided on the surface of the polarizing plate, said polarizing plate being produced by laminating a monoaxially stretched film on both surfaces of a polarizer in such a manner that the absorption axis of the polarizer is at right angles to the stretching axis of the monoaxially stretched films; anda liquid crystal sealed between the cell substrates, wherein the stretching axes of the monoaxially stretched films are in parallel with each other.
摘要:
A polarizing plate is disclosed, comprising a polarizing film and a protective layer bonded through an adhesive layer to at least one surface of the polarizing film, wherein the protective layer is a polyester film in which the minimum or maximum refractive index in a direction in parallel with the plane of the film is nearly equal to that in the direction of the film thickness and the retardation is at least 10 .mu.m. On this polarizing plate, colored interference fringes are not formed at all even if it is looked at from any direction. Thus, the polarizing plate is suitable for use in the circumstance that it is exposed to the air, or in a display wherein a liquid crystal is used.
摘要:
A developer bearing member includes a base body, a surface layer, and a plurality of concave portions provided on the surface layer, wherein a resistance value of the surface layer is 102 Ω·cm to 108 Ω·cm, the number of the concave portions per unit area is 2250/mm2 to 12254/mm2, a major diameter of an opening of the concave portion is 8 μm to 20 μm, a depth of the concave portion is 2 μm to 5 μm, a dimensional tolerance of the major diameter is 0.5 μm or less, and a dimensional tolerance of the depth is 0.5 μm or less.
摘要翻译:显影剂承载部件包括基体,表面层和设置在表面层上的多个凹部,其中表面层的电阻值为102&OHgr·cm〜108&OHgr·cm, 每单位面积的凹部为2250 / mm 2〜12254 / mm 2,凹部的开口的大径为8μm〜20μm,凹部的深度为2μm〜5μm,主体的尺寸公差 直径为0.5μm以下,深度的尺寸公差为0.5μm以下。
摘要:
There is provided a stainless steel sheet material, used for a semiconductor manufacturing device, to which it difficult for fine dust to be attached and from the surface of which the attaching dust can be easily washed away. Also, there is provided a method of manufacturing the stainless steel sheet material. A stainless steel sheet material characterized in that: the number of pinholes, the area of each pinhole exceeding 0.25 mm2, in the area of 10 cm2 on the surface of a skinpass-rolled stainless steel sheet material is not more than 10; and the average surface roughness Ra on the center line in the direction perpendicular to the rolling direction is not more than 0.15 &mgr;m. A method of manufacturing a stainless steel sheet material comprising the steps of: annealing a stainless steel cold-rolled sheet in a heat-treatment furnace having no support rollers in a temperature region exceeding 600° C. in a reducing atmosphere; and conducting skinpass rolling on the annealed stainless steel sheet material with a water soluble lubricant so that the average surface roughness Ra on the center line in the direction perpendicular to the rolling direction is not more than 0.15 &mgr;m.
摘要:
A flexible wiring board including a gold pad having dynamic Vickers hardness of not less than 50 or having a ratio of amount of nickel in a surface of the gold pad (atomic weight %) to thickness of gold (&mgr;m) of not more than 5 or having both the dynamic Vickers hardness of not less than 50 and the ratio of amount of nickel in the surface of the gold pad (atomic weight %) to thickness of gold (&mgr;m) of not more than 5, to provide a flexible wiring board that can substantially ensure the connection reliability when the board is connected with a semiconductor device by wiring bonding.
摘要:
Whether a field is an output field or input/output field is judged from an acquired field attribute. If the field attribute is an input/output field, the field character string of an output field which exists closest to the input/output field is selected as the control name candidate of the field. If the field attribute is an output field, the field character string of the field is selected as the control name candidate of the field. In this way, names related to the field can be assigned as control names on a GUI screen.
摘要:
After a flexible printed circuit is left under an atmosphere of a water vapor pressure of not lower than 30 mmHg so as to absorb moisture, a voltage is applied between two wiring portions to thereby measure an insulation resistance value between the wiring portions during the voltage application. The quantity &Dgr;log(R) of the change of the insulation resistance value at regular intervals is obtained. An examination is made as to whether the maximum of the quantity &Dgr;log(R) of the change of the insulation resistance value is not larger than a predetermined reference value or not. From this examination, a judgment is made as to whether the flexible printed circuit is good or not.
摘要:
The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm2 with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm2, not more than 1.5×10−5/° C., a hygroscopic expansion coefficient of not more than 1.2×10−5/%RH, a water vapor permeability of not more than 15 g/m2/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280° C. and a conductor circuit integrated into a laminate with an adhesive layer provided interposed therebetween.
摘要:
A composite sheet comprises a first resin film; and a second resin film laminated on the first resin film; wherein two ellipses of coefficient of linear expansion are created on polar coordinates in corresponding parts of the first and second resin films by a predetermined method and the two ellipse are overlapped so as to match in the center point and coordinate axes X and Y, and the maximum value of a linear expansion coefficient difference between the two resin films is equal to or less than a predetermined value.
摘要:
A product with a compound membrane which comprises a molded substrate, a metal membrane having an average thickness equal to or less than the maximum surface roughness of the molded substrate on the molded substrate and a dielectric membrane having a thickness of 100 .ANG. or more on the metal membrane.