摘要:
A method of forming a mask pattern comprises the following steps. A second cell library is prepared by making process proximity effect correction with respect to cell patterns stored in a first cell library. The second cell library stores corrected cell patterns. A first corrected cell pattern and a second corrected cell pattern of the corrected cell patterns are placed so that an edge of the first corrected cell pattern and an edge of the second corrected cell pattern contact or come close to or overlap each other. A boundary pattern at the boundary neighborhood between the first corrected cell pattern and the second corrected cell pattern is extracted. Process proximity effect correction is made with respect to the boundary pattern.
摘要:
A pattern correcting method for correcting a design pattern to form a desired pattern on a wafer is disclosed, which comprises defining an allowable dimensional change quantity of each of design patterns, defining a pattern correction condition for the each design pattern based on the allowable dimensional change quantity defined for the each design pattern, and correcting the each design pattern based on the pattern correction condition defined for the each design pattern.
摘要:
A method for designing a semiconductor integrated circuit is provided which comprises compacting a design layout of a semiconductor integrated circuit on the basis of a given design rule to obtain a compacted pattern, predicting a pattern to be formed at a surface area of a wafer for forming the semiconductor integrated circuit on the basis of the compacted pattern, obtaining an evaluated value by comparing the predicted pattern with the compacted pattern, deciding whether the evaluated value satisfies a predetermined condition, and modifying the design rule when the evaluated value is decided as not satisfying the predetermined condition.
摘要:
A correction target pattern having a size not more than a threshold value is extracted from first design data containing a pattern of a semiconductor integrated circuit. The first characteristic of the semiconductor integrated circuit is calculated on the basis of the first design data. Second design data is generated by correcting the correction target pattern contained in the first design data. The second characteristic of the semiconductor integrated circuit is calculated on the basis of the second design data. It is checked whether the characteristic difference between the first characteristic and the second characteristic falls within a tolerance. It is decided to use the second design data to manufacture the semiconductor integrated circuit when the characteristic difference falls within the tolerance.
摘要:
A pattern data correction method is disclosed, which comprises preparing an integrated circuit pattern, setting a tolerance to the pattern that is allowable error range when the pattern is transferred on a substrate, creating a target pattern within the tolerance, and making correction for the target pattern to make a first correction pattern under a predetermined condition.
摘要:
A pattern correcting method for correcting a design pattern to form a desired pattern on a wafer is disclosed, which comprises defining an allowable dimensional change quantity of each of design patterns, defining a pattern correction condition for the each design pattern based on the allowable dimensional change quantity defined for the each design pattern, and correcting the each design pattern based on the pattern correction condition defined for the each design pattern.
摘要:
Disclosed is a method of setting a process parameter for use in manufacturing a semiconductor integrated circuit, comprising correcting a first pattern by using process parameter information to obtain a second pattern, the first pattern being one which corresponds to a design layout of the semiconductor integrated circuit, predicting a third pattern by using the process parameter information, the third pattern being one which corresponds to the second pattern and which is to be formed on a semiconductor wafer in an etching process, obtaining an evaluation value by comparing the third pattern with the first pattern, determining whether the evaluation value satisfies a preset condition, and changing the process parameter information when the evaluation value is found not to satisfy the preset condition.
摘要:
Disclosed is a method of manufacturing a photo mask comprising preparing mask data for a mask pattern to be formed on a mask substrate, calculating edge moving sensitivity with respect to each of patterns included in the mask pattern using the mask data, the edge moving sensitivity corresponding to a difference between a proper exposure dose and an exposure dose to be set when a pattern edge varies, determining a monitor portion of the mask pattern, based on the calculated edge moving sensitivity, actually forming the mask pattern on the mask substrate, acquiring a dimension of a pattern included in that portion of the mask pattern formed on the mask substrate which corresponds to the monitor portion, determining evaluation value for the mask pattern formed on the mask substrate, based on the acquired dimension, and determining whether the evaluation value satisfies predetermined conditions.
摘要:
A computer implemented method for correcting a mask pattern includes: predicting a displacement of a device pattern by using a mask pattern to form the device pattern and a variation of a process condition; determinating an optical proximity correction value so that the displacement falls within a displacement tolerance of the device pattern; and correcting the mask pattern using the optical proximity correction value.
摘要:
A mask data generating apparatus comprising: a division module configured to extract a line segment and dividing the extracted line segment into a suitable length; a correction value calculation module configured to calculate correction value calculating points from each divided edge; a first calculated center point calculation module configured to set first calculated center points and a shape of a pattern; a first rectangular region preparation module configured to prepare first simulation regions and a plurality of first rectangular regions which overlap with each other; a second calculated center point calculation module configured to acquire second rectangular regions, and calculating second calculated center points based on the second rectangular regions; a second simulation region preparation module configured to acquire second simulation regions; a process simulation execution module configured to calculate a correction value; and a correction pattern preparation module configured to prepare the correction pattern.