Powder magnetic core and the method of manufacturing the same
    1.
    发明授权
    Powder magnetic core and the method of manufacturing the same 有权
    粉末磁芯及其制造方法

    公开(公告)号:US08974608B2

    公开(公告)日:2015-03-10

    申请号:US12081490

    申请日:2008-04-16

    摘要: A powder magnetic core with improved high frequency magnetic characteristics and reduced eddy current loss is manufactured by a manufacturing method including the steps of (a) providing coated soft magnetic particles which are particles composed of soft magnetic material which each have been coated with an insulating coating, and insulator particles; (b) forming a magnetic layer by press molding the coated soft magnetic particles in a mold assembly; (c) forming an insulator layer on the magnetic layer by press molding the insulator particles in the mold assembly; and (d) repeating the steps (b) and (c) to fabricate a laminate of alternating magnetic layers and insulator layers and provide the powder magnetic core.

    摘要翻译: 通过制造方法制造具有改善的高频磁特性和降低的涡流损耗的粉末磁芯,其包括以下步骤:(a)提供涂覆的软磁性颗粒,其是由软磁性材料构成的颗粒,每个软磁性颗粒均涂覆有绝缘涂层 ,和绝缘体颗粒; (b)通过在模具组件中压制成型所涂覆的软磁性颗粒来形成磁性层; (c)通过在所述模具组件中压模所述绝缘体颗粒在所述磁性层上形成绝缘体层; 和(d)重复步骤(b)和(c)以制造交替磁层和绝缘体层的叠层,并提供粉末磁芯。

    Powder magnetic core and the method of manufacturing the same
    3.
    发明申请
    Powder magnetic core and the method of manufacturing the same 有权
    粉末磁芯及其制造方法

    公开(公告)号:US20080258102A1

    公开(公告)日:2008-10-23

    申请号:US12081490

    申请日:2008-04-16

    IPC分类号: H01F1/08

    摘要: A powder magnetic core with improved high frequency magnetic characteristics and reduced eddy current loss is manufactured by a manufacturing method including the steps of (a) providing coated soft magnetic particles which are particles composed of soft magnetic material which each have been coated with an insulating coating, and insulator particles; (b) forming a magnetic layer by press molding the coated soft magnetic particles in a mold assembly; (c) forming an insulator layer on the magnetic layer by press molding the insulator particles in the mold assembly; and (d) repeating the steps (b) and (c) to fabricate a laminate of alternating magnetic layers and insulator layers and provide the powder magnetic core.

    摘要翻译: 通过制造方法制造具有改善的高频磁特性和降低的涡流损耗的粉末磁芯,其包括以下步骤:(a)提供涂覆的软磁性颗粒,其是由软磁性材料构成的颗粒,每个软磁性颗粒均涂覆有绝缘涂层 ,和绝缘体颗粒; (b)通过在模具组件中压制成型所涂覆的软磁性颗粒来形成磁性层; (c)通过在所述模具组件中压模所述绝缘体颗粒在所述磁性层上形成绝缘体层; 和(d)重复步骤(b)和(c)以制造交替磁层和绝缘体层的叠层,并提供粉末磁芯。

    Method of forming an insulative film
    4.
    发明授权
    Method of forming an insulative film 有权
    形成绝缘膜的方法

    公开(公告)号:US07504330B2

    公开(公告)日:2009-03-17

    申请号:US11882791

    申请日:2007-08-06

    IPC分类号: H01L21/00

    摘要: A method of forming an insulative film includes a step of vacuum laminating an insulative organic material on a substrate that has a peripheral ring electrode formed in a peripheral region of the substrate and a device element(s) formed inside the peripheral region, and has a surface configuration including raised parts. A first dummy pattern is formed in a region between the peripheral ring electrode and the device element on the substrate.

    摘要翻译: 形成绝缘膜的方法包括以下步骤:将绝缘有机材料真空层压在具有形成在基板的周边区域中的外围环形电极的基板上,以及在周边区域内形成的元件元件, 表面配置包括凸起部分。 在外围环电极和衬底上的器件元件之间的区域中形成第一虚设图案。

    Method of forming an insulative film
    6.
    发明申请
    Method of forming an insulative film 有权
    形成绝缘膜的方法

    公开(公告)号:US20080045038A1

    公开(公告)日:2008-02-21

    申请号:US11882791

    申请日:2007-08-06

    IPC分类号: H01L21/31

    摘要: A method of forming an insulative film includes a step of vacuum laminating an insulative organic material on a substrate that has a peripheral ring electrode formed in a peripheral region of the substrate and a device element(s) formed inside the peripheral region, and has a surface configuration including raised parts. A first dummy pattern is formed in a region between the peripheral ring electrode and the device element on the substrate.

    摘要翻译: 形成绝缘膜的方法包括以下步骤:将绝缘有机材料真空层压在具有形成在基板的周边区域中的外围环形电极的基板上,以及在周边区域内形成的元件元件, 表面配置包括凸起部分。 在外围环电极和衬底上的器件元件之间的区域中形成第一虚设图案。

    Image pickup device and method for manufacturing the image pickup device
    8.
    发明授权
    Image pickup device and method for manufacturing the image pickup device 有权
    用于制造图像拾取装置的图像拾取装置和方法

    公开(公告)号:US08792044B2

    公开(公告)日:2014-07-29

    申请号:US13503826

    申请日:2010-10-26

    IPC分类号: H04N5/225

    摘要: Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.

    摘要翻译: 公开了一种图像拾取装置,通过该方式,切割晶片透镜时的切割电阻降低,生产效率高,并且获得了优异的光学特性。 图像拾取装置具有第一透镜块,第二透镜块,间隔件和传感器单元。 第一透镜块的侧表面部分,第二透镜块的侧表面部分和间隔件的侧表面部分形成在同一平面上。 覆盖第一透镜块和第二透镜块的透镜盖设置在由第一透镜块,第二透镜块和间隔件的相应侧表面部分以及传感器单元的侧表面部分形成的台阶中。

    Electronic device and method for manufacturing thereof
    9.
    发明授权
    Electronic device and method for manufacturing thereof 有权
    电子装置及其制造方法

    公开(公告)号:US08410561B2

    公开(公告)日:2013-04-02

    申请号:US12975065

    申请日:2010-12-21

    IPC分类号: H01L31/00

    摘要: An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.

    摘要翻译: 公开了一种电子设备,包括基板,构成在基板上形成的功能元件的功能结构,以及形成其中设置有功能结构的空腔部分的盖结构。 在电子设备中,盖结构包括层间绝缘膜和布线层的叠层结构,层叠结构以包围空腔部分的方式形成在基板上,盖结构具有上侧盖部分 从上方覆盖空腔部分,上侧盖部分形成有设置在功能结构上方的布线层的一部分。