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    Multilayer printed circuit board
    2.
    发明授权
    Multilayer printed circuit board 失效
    多层印刷电路板

    公开(公告)号：US4673773A

    公开(公告)日：1987-06-16

    申请号：US705745

    申请日：1985-02-26

    申请人： Tsunetomo Nakano ,  Hiroshi Yasuno ,  Kazuaki Nishio

    发明人： Tsunetomo Nakano ,  Hiroshi Yasuno ,  Kazuaki Nishio

    IPC分类号： C08G69/32 ,  C08G69/00 ,  C08G69/26 ,  C08G69/48 ,  G03F7/038 ,  H05K1/00 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  H05K1/14

    CPC分类号： G03F7/0387 ,  C08G69/265 ,  H05K3/4676 ,  H05K2201/09563 ,  H05K3/0023 ,  H05K3/181

    摘要： In a multilayer printed circuit board comprising an insulating substrate and a plurality of circuit elements provided thereon in layers, each of which is composed of a circuit pattern and an insulating resin layer provided over the circuit pattern, the circuit patterns arranged adjacently to each other being portionwise connected electrically through via at least one hole, the improvement in which said insulating resin layer comprises a photoset resin of an aromatic polyamide having at least 10 molar % of a constitutional unit of the formula (Ia): ##STR1## wherein each of R.sup.1 and R.sup.2 independently is a hydrogen atom or a residue of a reactive organic compound, Ar.sup.1 is a divalent aromatic residue, and Ar.sup.2 is a divalent aromatic residue possessing a photosensitive group.

    摘要翻译： 在包括绝缘基板和设置在其上的多个电路元件的多层印刷电路板中，每个电路板由设置在电路图案上的电路图案和绝缘树脂层构成，彼此相邻布置的电路图案是 其中所述绝缘树脂层包括具有至少10摩尔％的式（Ia）的结构单元的芳族聚酰胺的光固化树脂：其中， R 1和R 2各自独立地为氢原子或反应性有机化合物的残基，Ar 1为二价芳香族残基，Ar 2为具有感光性基团的2价芳香族残基。

    Organic solvent-soluble photosensitive polyamide resin
    4.
    发明授权
    Organic solvent-soluble photosensitive polyamide resin 失效
    有机溶剂可溶性光敏聚酰胺树脂

    公开(公告)号：US4595745A

    公开(公告)日：1986-06-17

    申请号：US622859

    申请日：1984-06-21

    申请人： Tsunetomo Nakano ,  Hiroshi Yasuno ,  Kazuaki Nishio

    发明人： Tsunetomo Nakano ,  Hiroshi Yasuno ,  Kazuaki Nishio

    IPC分类号： C08G69/26 ,  C08G69/40 ,  G03F7/038

    CPC分类号： C08G69/26 ,  C08G69/40 ,  G03F7/0387

    摘要： An organic solvent-soluble photosensitive polyamide resin usable for producing photoset resin product having excellent heat resistance and electrical and mechanical properties, comprising a polycondensation product of an aromatic dicarboxylic acid component with an aromatic diamine component consisting of 10 to 100 molar % of a photosensitive diamine compound of the formula (I) and 10 to 90 molar % of a non-photosensitive diamine compound of the formula (II),H.sub.2 N--R.sub.1 --NH.sub.2 (I)H.sub.2 N--R.sub.2 --NH.sub.2 (II)wherein R.sub.1 represents an aromatic divalent residue having a photosensitive radical and R.sub.2 represents an armoatic divalent residue having no photosensitive radical.

    摘要翻译： 一种可用于生产具有优异的耐热性和电气和机械性能的光敏树脂产品的有机溶剂可溶性感光性聚酰胺树脂，其包含芳族二羧酸组分与芳族二胺组分的缩聚产物，所述芳族二胺组分由10至100摩尔％的光敏二胺 式（I）的化合物和10至90摩尔％的式（II）的非感光二胺化合物，H 2 N-R 1 -NH 2（I）H 2 N-R 2 -NH 2（II）其中R 1表示芳族二价残基 具有光敏基团，R 2表示不具有光敏基团的臂状二价残基。

    Process for producing an electrolytic capacitor
    5.
    发明授权
    Process for producing an electrolytic capacitor 失效
    电解电容器的制造方法

    公开(公告)号：US4764181A

    公开(公告)日：1988-08-16

    申请号：US821416

    申请日：1986-01-22

    申请人： Tsunetomo Nakano ,  Kohei Nakajima ,  Kazuaki Nishio ,  Toshio Maruyama ,  Hiroshi Shimada ,  Kiyoshi Sakamoto ,  Kumiko Narisawa

    发明人： Tsunetomo Nakano ,  Kohei Nakajima ,  Kazuaki Nishio ,  Toshio Maruyama ,  Hiroshi Shimada ,  Kiyoshi Sakamoto ,  Kumiko Narisawa

    IPC分类号： H01G9/02 ,  H01G9/00

    CPC分类号： H01G9/02 ,  Y10T29/417

    摘要： An electrolytic capacitor having very thin spacer layers is produced by a process in which at least two of the surfaces of an anode valve action metal foil and a cathode metal foil are coated with a photosensitive polymer resin solution; the resultant photosensitive polymer resin solution layers are solidified; the solidified photosensitive polymer resin coatings are masked with a negative or positive masking film having a desired pattern and irradiated with an actinic radiation to partly harden the photosensitive polymer resin coatings in accordance with the masking pattern; after removing the masking film, the irradiated photosensitive polymer resin coatings are developed with a developing liquid to provide spacer layers consisting of hardened portions of the photosensitive polymer resin coatings; the anode and cathode metal foils having the spacer layers are superposed on each other in such a manner that at least one spacer layer is located between the superposed anode and cathode metal foils and at least one other spacer layer is located on at least one of the outside surfaces of the superposed anode and cathode metal foils, to provide a laminate; the laminate is wound into a capacitor element; and then the capacitor element is impregnated with an electrolyte.

    摘要翻译： 通过这样的方法制造具有非常薄的间隔层的电解电容器，其中阳极阀作用金属箔和阴极金属箔的至少两个表面涂覆有光敏聚合物树脂溶液; 所得到的光敏聚合物树脂溶液层固化; 将固化的光敏聚合物树脂涂层用具有所需图案的阴性或阳性掩蔽膜掩蔽，并用光化辐射照射以根据掩蔽图案部分地硬化光敏聚合物树脂涂层; 在去除掩模膜之后，用显影液显影照射的光敏聚合物树脂涂层，以提供由光敏聚合物树脂涂层的硬化部分组成的间隔层; 具有间隔层的阳极和阴极金属箔以这样的方式彼此重叠，使得至少一个间隔层位于叠置的阳极和阴极金属箔之间，并且至少一个其它隔离层位于至少一个 叠置的阳极和阴极金属箔的外表面，以提供层压体; 将层压体卷绕成电容器元件; 然后用电解质浸渍电容器元件。

    Organic solvent-soluble photosensitive polyimide resin
    6.
    发明授权
    Organic solvent-soluble photosensitive polyimide resin 失效
    有机溶剂可溶性光敏聚酰亚胺树脂

    公开(公告)号：US4558117A

    公开(公告)日：1985-12-10

    申请号：US615309

    申请日：1984-05-30

    申请人： Tsunetomo Nakano ,  Hiroshi Yasuno ,  Kazuaki Nishio

    发明人： Tsunetomo Nakano ,  Hiroshi Yasuno ,  Kazuaki Nishio

    IPC分类号： G03F7/004 ,  C08G73/10 ,  G03C1/73 ,  G03F7/038 ,  C08G73/12

    CPC分类号： C08G73/1042 ,  C08G73/1025 ,  C08G73/1071 ,  G03F7/0387

    摘要： An organic solvent-soluble photosensitive polyimide resin having excellent heat resistance and electrical and mechanical properties, comprising a copolycondensation product of a biphenyltetracarboxylic acid component with an aromatic diamine component consisting of 40 to 90 molar % of a diamine compound of the formula (I) and 10 to 60 molar % of a diaminodiphenylether compound of the formula (II), ##STR1## wherein X=--CO--O-- or --CH.sub.2 --O--, R.sub.1 and R.sub.2 =an organic residue having an ethylenically unsaturated radical, and R.sub.3 =H or --NHCOR.sub.2.

    摘要翻译： 一种具有优异的耐热性和机电性能的有机溶剂可溶性光敏聚酰亚胺树脂，其包含联苯四羧酸组分与由40-90摩尔％的式（I）二胺化合物组成的芳族二胺组分的共缩聚产物和 10至60摩尔％的式（II）的二氨基二苯醚化合物，其中X = -CO-O-或-CH 2 -O-，R 1和R 2 =有机残基 具有烯键式不饱和基团，且R 3 = H或-NHCOR 2。

    Photosetting polymer composition
    7.
    发明授权
    Photosetting polymer composition 失效
    光固化聚合物组成

    公开(公告)号：US4855215A

    公开(公告)日：1989-08-08

    申请号：US108787

    申请日：1987-10-15

    申请人： Tsunetomo Nakano ,  Toshikazu Hayashi ,  Toshinori Tsukada

    发明人： Tsunetomo Nakano ,  Toshikazu Hayashi ,  Toshinori Tsukada

    IPC分类号： C08F2/48 ,  C08F2/50 ,  C08F8/48 ,  C08F290/00 ,  C08F290/12 ,  C08F299/00 ,  G03F7/027 ,  G03F7/038

    CPC分类号： C08F290/12 ,  C08F2/50

    摘要： A photosetting polymer composition comprises:a base polymer comprising a denatured copolymer which is produced by reacting a copolymer of maleic anhydride and an unsaturated hydrocarbon compound with a specific aminocarboxylic acid, an alcohol or a cellosolve derivative, and a glycidyl (meth)acrylate compound under specific conditions;5-500 weight parts of a photopolymerizable monomer per 100 weight parts of the base polymer; and1-50 weight parts of a photopolymerization initiator per 100 weight parts of the base polymer.

    摘要翻译： 光固化聚合物组合物包括：包含变性共聚物的基础聚合物，其通过使马来酸酐和不饱和烃化合物的共聚物与特定的氨基羧酸，醇或溶纤剂衍生物和（甲基）丙烯酸缩水甘油酯化合物反应制备， 具体条件; 每100重量份基础聚合物5-500重量份的光聚合单体; 和每100重量份基础聚合物为1-50重量份的光聚合引发剂。

    Photocurable acrylic phosphate esters of epoxidized polybutadiene
    9.
    发明授权
    Photocurable acrylic phosphate esters of epoxidized polybutadiene 失效
    环氧化聚丁二烯的光固化丙烯酸酯

    公开(公告)号：US4250007A

    公开(公告)日：1981-02-10

    申请号：US020496

    申请日：1979-03-14

    申请人： Hiroshi Yasuno ,  Toshimune Yoshinaga ,  Tsunetomo Nakano

    发明人： Hiroshi Yasuno ,  Toshimune Yoshinaga ,  Tsunetomo Nakano

    IPC分类号： C08F2/00 ,  C08C19/40 ,  C08F2/48 ,  C08F2/50 ,  C08F8/14 ,  C08F279/02 ,  C08F290/00 ,  C08F299/00 ,  C08F299/02 ,  C08G59/00 ,  C08G59/34 ,  C08L47/00 ,  C09D4/06 ,  C09D147/00 ,  C09D171/00 ,  C08F230/02 ,  C08J3/28

    CPC分类号： C08G59/027 ,  C08C19/40 ,  C08F279/02 ,  C08F299/026 ,  C09D4/06 ,  Y10S525/922

    摘要： A photosetting composition useful as a coating varnish comprising a modified, epoxidized butadiene polymer, at least one photopolymerizable monomer and a photosensitizer, the modified, epoxidized butadiene polymer comprising (1) an epoxidized butadiene polymer backbone group, (2) 5 to 50 aromatic or cyclocyclic polybasic carboxylic ester side chain groups per 100 butadiene units, each having at least one acryloyl or methacryloyl terminal group and a linking group formed by a reaction between a carboxylic acid radical in the polybasic carboxylic ester and an epoxy radical in the epoxidized butadiene polymer and, optionally, (3) 0 to 50 phosphoric ester additional side chain groups per 100 butadiene units, each having a linking group formed by a reaction between a hydroxyl radical attached to a P atom in the phosphoric ester and an epoxy radical in the epoxidized butadiene polymer.

    摘要翻译： 用作涂料清漆的光固化组合物，其包含改性的环氧化的丁二烯聚合物，至少一种可光聚合的单体和光敏剂，所述改性的环氧化的丁二烯聚合物包含（1）环氧化的丁二烯聚合物主链基团，（2）5至50个芳族或 环状多元羧酸酯侧链基团，每100个丁二烯单元各自具有至少一个丙烯酰基或甲基丙烯酰基端基和通过多元羧酸酯中的羧酸基与环氧化丁二烯聚合物中的环氧基之间的反应形成的连接基团，以及 ，任选地，（3）0至50个磷酸酯每100个丁二烯单元的另外的侧链基团，每个具有通过连接在磷酸酯中的P原子上的羟基与环氧化丁二烯中的环氧基之间的反应形成的连接基团 聚合物。