摘要:
A problem is to provide a transparent conductive laminate body that has a low surface resistivity and an organic thin film device using the laminate body, and the problem is solved by a transparent conductive laminate body having a transparent substrate having laminated directly on at least one surface thereof in this order a conductive metal pattern layer and a conductive organic layer having a conductive organic polymer compound, a material for forming the conductive metal pattern layer being at least one metal selected from gold, silver, copper and platinum, or an alloy having the metal, and an organic thin film device using the same.
摘要:
A transparent conductive film which exhibits excellent gas barrier performance and electrical conductivity, and exhibits low sheet resistivity and high electrical conductivity, even after having been placed in moist and high-temperature conditions. The conductive film is in the form of a zinc oxide-based electrically conductive stacked structure, and the film includes a substrate and, formed on at least one surface of the substrate, (A) a gas barrier layer and (B) a transparent conductive layer formed of a zinc oxide-based conductive material, wherein the gas barrier layer is formed of a material containing at least oxygen atoms, carbon atoms, and silicon atoms, and includes a region in which the oxygen atom concentration gradually decreases and the carbon atom concentration gradually increases from the surface in the depth direction of the layer.
摘要:
Provided is a pressure-sensitive adhesive for an optically functional film which can carry out adhesion with a good durability in adhesion of an optically functional film such as adhesion of a polarizing plate, particularly a polarizing plate integrated with a viewing angle expanding film and the like with a liquid crystal cell, adhesion of a polarizing plate with a retardation film, adhesion of a retardation film with a retardation film and adhesion of a retardation film with a liquid crystal cell and which has the characteristics that a liquid crystal display obtained therefrom is less liable to cause light leakage even under the environment of high temperature and high humidity and that static electricity is less liable to be produced when peeling off a release film from a pressure-sensitive adhesive layer.The pressure-sensitive adhesive for applying an optically functional film comprises a pressure-sensitive adhesive resin and an antistatic agent, wherein a storage elastic modulus (G′) at 23° C. is 0.3 MPa or more, and a charged voltage on the surface of a layer comprising the above pressure-sensitive adhesive which is measured 5 seconds later since peeling off a release film brought into contact with the above pressure-sensitive adhesive layer under the environment of 23° C. and a relative humidity of 50% is 1.0 kV or less.
摘要:
A semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. Semiconductor wafer protection structures and methods, and laminated protective sheet for use therein are provided and enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.
摘要:
Provided are a pressure-sensitive adhesive for applying an optically functional film by which adhesion can be carried out with good durability in adhesion of a polarizing plate, particularly a polarizing plate integrated with a viewing angle expanding film with a liquid crystal cell, adhesion of a polarizing plate with a retardation film, adhesion of a retardation film with a retardation film and adhesion of a retardation film with a liquid crystal cell and which endows a liquid crystal display with even brightness without bringing about bubbles in a pressure-sensitive adhesive layer and an uneven luminance even after the passage of time, an optically functional film and a production process for the same.The above pressure-sensitive adhesive for applying an optically functional film comprises a pressure-sensitive adhesive resin and fine particles having an average particle diameter of 0.1 to 20 μm, wherein a storage elastic modulus (G′) at 23° C. is 0.3 to 15 MPa, and a haze value is 5% or more.
摘要:
A semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. Semiconductor wafer protection structures and methods, and laminated protective sheet for use therein are provided and enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.
摘要:
Provided is a pressure-sensitive adhesive for an optically functional film which can carry out adhesion with a good durability in adhesion of an optically functional film such as adhesion of a polarizing plate, particularly a polarizing plate integrated with a viewing angle expanding film and the like with a liquid crystal cell, adhesion of a polarizing plate with a retardation film, adhesion of a retardation film with a retardation film and adhesion of a retardation film with a liquid crystal cell and which has the characteristics that a liquid crystal display obtained therefrom is less liable to cause light leakage even under the environment of high temperature and high humidity and that static electricity is less liable to be produced when peeling off a release film from a pressure-sensitive adhesive layer.The pressure-sensitive adhesive for applying an optically functional film comprises a pressure-sensitive adhesive resin and an antistatic agent, wherein a storage elastic modulus (G′) at 23° C. is 0.3 MPa or more, and a charged voltage on the surface of a layer comprising the above pressure-sensitive adhesive which is measured 5 seconds later since peeling off a release film brought into contact with the above pressure-sensitive adhesive layer under the environment of 23° C. and a relative humidity of 50% is 1.0 kV or less.
摘要:
There are disclosed a pressure-sensitive adhesive for polarizing plates which is formed by irradiating a pressure-sensitive adhesive material with an active energy beam, the material containing an acrylic copolymer (A) and an acrylic copolymer bearing an active energy beam-polymerizable group on a side chain (B), and which has a storage elastic modulus (G′) at 23 ° C. in the range of 0.3 to 10 MPa: a polarizing plate which is having a pressure-sensitive adhesive, and which comprises a layer composed of the above pressure-sensitive adhesive; and a process for the production of the polarizing plate having a pressure-sensitive adhesive, which comprises sticking a polarizing plate on a pressure-sensitive adhesive material layer formed on a releasing layer of a releasing sheet, and thereafter irradiating the polarizing plate with an active energy-beam from the releasing sheet side. The pressure-sensitive adhesive for polarizing plates is characterized in that it can favorably sticking a polarizing plate to a liquid crystal cell and that a resultant liquid crystal display unit is less liable to cause light leakage even in an environment of high temperature and high humidity.
摘要:
Disclosed herein is a pressure sensitive adhesive sheet for fixing a semiconductor wafer during semiconductor wafer processing in vacuum, comprising a substrate and, superimposed on one side or both sides thereof, a layer of ultraviolet curable pressure sensitive adhesive composition comprising an ultraviolet curable copolymer having ultraviolet polymerizable groups as side chains and a phosphorous photopolymerization initiator. The pressure sensitive adhesive sheet for semiconductor wafer processing, even in the processing of a semiconductor wafer in vacuum, is free from generating gases from the pressure sensitive adhesive sheet, thereby avoiding wafer deformation attributed to evaporated gas components and adhesive transfer caused thereby.
摘要:
A suction apparatus for an engine is provided with an intake path which has an opening portion at one end, and the other end of which is connected to an intake pulsation generation source. A resonator is connected to a downstream portion of said intake path through a connecting pipe, for eliminating a (0.5+n)th-order (where n is an integer equal to or larger than 0) resonant wave in the intake path which is induced by a compression wave generated from said intake pulsation generation source toward the upstream side.