TRANSPARENT CONDUCTIVE LAMINATE BODY AND ORGANIC THIN FILM DEVICE
    1.
    发明申请
    TRANSPARENT CONDUCTIVE LAMINATE BODY AND ORGANIC THIN FILM DEVICE 审中-公开
    透明导电层压体和有机薄膜装置

    公开(公告)号:US20130320322A1

    公开(公告)日:2013-12-05

    申请号:US13978262

    申请日:2011-11-28

    IPC分类号: H01L51/44 H01L51/52

    摘要: A problem is to provide a transparent conductive laminate body that has a low surface resistivity and an organic thin film device using the laminate body, and the problem is solved by a transparent conductive laminate body having a transparent substrate having laminated directly on at least one surface thereof in this order a conductive metal pattern layer and a conductive organic layer having a conductive organic polymer compound, a material for forming the conductive metal pattern layer being at least one metal selected from gold, silver, copper and platinum, or an alloy having the metal, and an organic thin film device using the same.

    摘要翻译: 一个问题是提供一种具有低表面电阻率的透明导电叠层体和使用层压体的有机薄膜器件,并且问题是通过一种透明导电层压体来解决,该透明导电层压体具有直接层压在至少一个表面上的透明基底 依次具有导电性金属图案层和具有导电性有机高分子化合物的导电性有机层,形成导电性金属图案层的材料为选自金,银,铜和铂中的至少一种金属,或者具有 金属和使用其的有机薄膜器件。

    TRANSPARENT CONDUCTIVE FILM, PROCESS FOR PRODUCING SAME, AND ELECTRONIC DEVICE EMPLOYING TRANSPARENT CONDUCTIVE FILM
    2.
    发明申请
    TRANSPARENT CONDUCTIVE FILM, PROCESS FOR PRODUCING SAME, AND ELECTRONIC DEVICE EMPLOYING TRANSPARENT CONDUCTIVE FILM 审中-公开
    透明导电膜,其制造方法和使用透明导电膜的电子器件

    公开(公告)号:US20120301710A1

    公开(公告)日:2012-11-29

    申请号:US13577020

    申请日:2011-01-26

    IPC分类号: B32B9/04 C23C14/48 B32B5/00

    摘要: A transparent conductive film which exhibits excellent gas barrier performance and electrical conductivity, and exhibits low sheet resistivity and high electrical conductivity, even after having been placed in moist and high-temperature conditions. The conductive film is in the form of a zinc oxide-based electrically conductive stacked structure, and the film includes a substrate and, formed on at least one surface of the substrate, (A) a gas barrier layer and (B) a transparent conductive layer formed of a zinc oxide-based conductive material, wherein the gas barrier layer is formed of a material containing at least oxygen atoms, carbon atoms, and silicon atoms, and includes a region in which the oxygen atom concentration gradually decreases and the carbon atom concentration gradually increases from the surface in the depth direction of the layer.

    摘要翻译: 具有优异的阻气性和导电性的透明导电膜,即使在潮湿和高温条件下放置,也具有低的电阻率和高导电性。 导电膜为氧化锌系导电性叠层结构体,膜为基材,在基材的至少一面形成有(A)阻气层,(B)透明导电性 由氧化锌类导电材料形成的层,其中阻气层由至少含有氧原子,碳原子和硅原子的材料形成,并且包括氧原子浓度逐渐降低的区域和碳原子 浓度从层的深度方向的表面逐渐增加。

    Pressure-sensitive adhesive for applying optically functional film, optically functional film and production process for the same
    3.
    发明授权
    Pressure-sensitive adhesive for applying optically functional film, optically functional film and production process for the same 有权
    用于施加光学功能膜的压敏粘合剂,光学功能膜及其制备方法

    公开(公告)号:US07892394B2

    公开(公告)日:2011-02-22

    申请号:US11778214

    申请日:2007-07-16

    摘要: Provided is a pressure-sensitive adhesive for an optically functional film which can carry out adhesion with a good durability in adhesion of an optically functional film such as adhesion of a polarizing plate, particularly a polarizing plate integrated with a viewing angle expanding film and the like with a liquid crystal cell, adhesion of a polarizing plate with a retardation film, adhesion of a retardation film with a retardation film and adhesion of a retardation film with a liquid crystal cell and which has the characteristics that a liquid crystal display obtained therefrom is less liable to cause light leakage even under the environment of high temperature and high humidity and that static electricity is less liable to be produced when peeling off a release film from a pressure-sensitive adhesive layer.The pressure-sensitive adhesive for applying an optically functional film comprises a pressure-sensitive adhesive resin and an antistatic agent, wherein a storage elastic modulus (G′) at 23° C. is 0.3 MPa or more, and a charged voltage on the surface of a layer comprising the above pressure-sensitive adhesive which is measured 5 seconds later since peeling off a release film brought into contact with the above pressure-sensitive adhesive layer under the environment of 23° C. and a relative humidity of 50% is 1.0 kV or less.

    摘要翻译: 提供一种用于光学功能膜的粘合剂,其可以在光学功能膜的粘附性方面具有良好的耐久性,例如粘合偏振片,特别是与视角扩展膜一体化的偏振片等 具有液晶单元,偏振板与延迟膜的粘合,相位差膜与延迟膜的粘合性以及相位差膜与液晶单元的粘附性,具有由其获得的液晶显示器的特性较小 即使在高温高湿的环境下也容易引起漏光,并且当从压敏粘合剂层剥离剥离膜时静电不易产生。 用于施加光学功能膜的压敏粘合剂包括压敏粘合剂树脂和抗静电剂,其中23℃下的储能弹性模量(G')为0.3MPa以上,表面上的充电电压 包含上述压敏粘合剂的层,其在23℃,相对湿度为50%的环境下剥离与上述压敏粘合剂层接触的剥离膜5秒钟后测量为1.0 kV以下。

    Semiconductor wafer protection structure and laminated protective sheet for use therein
    4.
    发明授权
    Semiconductor wafer protection structure and laminated protective sheet for use therein 有权
    半导体晶片保护结构和其中使用的层压保护片

    公开(公告)号:US07361971B2

    公开(公告)日:2008-04-22

    申请号:US10525996

    申请日:2003-08-21

    IPC分类号: H01L23/544 H01L23/06

    摘要: A semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. Semiconductor wafer protection structures and methods, and laminated protective sheet for use therein are provided and enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.

    摘要翻译: 一种半导体晶片保护结构,其包括覆盖在所述半导体晶片的电路表面上的半导体晶片和保护片,其中所述保护片的直径大于所述半导体晶片的外径。 提供了半导体晶片保护结构和方法以及用于其中的层叠保护片,并且能够防止在将晶片研磨成超薄厚度并被输送时在研磨和运输期间损坏晶片。 还提供了一种处理半导体晶片的方法,从而在粘合片的施加和切割期间可以减少对晶片的损伤。

    PRESSURE-SENSITIVE ADHESIVE FOR APPLYING OPTICALLY FUNCTIONAL FILM, OPTICALLY FUNCTIONAL FILM AND PRODUCTION PROCESS FOR THE SAME
    5.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE FOR APPLYING OPTICALLY FUNCTIONAL FILM, OPTICALLY FUNCTIONAL FILM AND PRODUCTION PROCESS FOR THE SAME 有权
    用于应用光学功能膜的压敏粘合剂,光学功能膜及其制备方法

    公开(公告)号:US20070267133A1

    公开(公告)日:2007-11-22

    申请号:US11746830

    申请日:2007-05-10

    IPC分类号: B32B37/00

    摘要: Provided are a pressure-sensitive adhesive for applying an optically functional film by which adhesion can be carried out with good durability in adhesion of a polarizing plate, particularly a polarizing plate integrated with a viewing angle expanding film with a liquid crystal cell, adhesion of a polarizing plate with a retardation film, adhesion of a retardation film with a retardation film and adhesion of a retardation film with a liquid crystal cell and which endows a liquid crystal display with even brightness without bringing about bubbles in a pressure-sensitive adhesive layer and an uneven luminance even after the passage of time, an optically functional film and a production process for the same.The above pressure-sensitive adhesive for applying an optically functional film comprises a pressure-sensitive adhesive resin and fine particles having an average particle diameter of 0.1 to 20 μm, wherein a storage elastic modulus (G′) at 23° C. is 0.3 to 15 MPa, and a haze value is 5% or more.

    摘要翻译: 提供了一种用于施加光学功能膜的压敏粘合剂,通过该粘合剂可以在偏振片,特别是与具有液晶单元的视角扩展膜一体化的偏振片的粘附性方面具有良好的耐久性进行粘合,粘合剂 具有延迟膜的偏振片,延迟膜与相位差膜的粘附性以及相位差膜与液晶单元的粘附性,并且使得液晶显示器具有均匀的亮度,而不会在压敏粘合剂层中产生气泡,并且 即使经过时间后的不均匀亮度,光学功能膜及其制造方法也是如此。 上述用于施加光学功能膜的压敏粘合剂包括压敏粘合剂树脂和平均粒径为0.1至20μm的细颗粒,其中23℃下的储能弹性模量(G')为0.3至 15MPa,雾度值为5%以上。

    Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer
    6.
    发明申请
    Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer 有权
    半导体晶片的保护结构,半导体晶片的保护方法,其中使用的多层保护片,以及​​半导体晶片的处理方法

    公开(公告)号:US20060043532A1

    公开(公告)日:2006-03-02

    申请号:US10525996

    申请日:2003-08-21

    IPC分类号: H01L29/06

    摘要: A semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. Semiconductor wafer protection structures and methods, and laminated protective sheet for use therein are provided and enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.

    摘要翻译: 一种半导体晶片保护结构,其包括覆盖在所述半导体晶片的电路表面上的半导体晶片和保护片,其中所述保护片的直径大于所述半导体晶片的外径。 提供了半导体晶片保护结构和方法以及用于其中的层叠保护片,并且能够防止在将晶片研磨成超薄厚度并被输送时在研磨和运输期间损坏晶片。 还提供了一种处理半导体晶片的方法,从而在粘合片的施加和切割期间可以减少对晶片的损伤。

    PRESSURE-SENSITIVE ADHESIVE FOR APPLYING OPTICALLY FUNCTIONAL FILM, OPTICALLY FUNCTIONAL FILM AND PRODUCTION PROCESS FOR THE SAME
    7.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE FOR APPLYING OPTICALLY FUNCTIONAL FILM, OPTICALLY FUNCTIONAL FILM AND PRODUCTION PROCESS FOR THE SAME 有权
    用于应用光学功能膜的压敏粘合剂,光学功能膜及其制备方法

    公开(公告)号:US20080023132A1

    公开(公告)日:2008-01-31

    申请号:US11778214

    申请日:2007-07-16

    IPC分类号: B29C65/14 C08F120/06 C09J5/00

    摘要: Provided is a pressure-sensitive adhesive for an optically functional film which can carry out adhesion with a good durability in adhesion of an optically functional film such as adhesion of a polarizing plate, particularly a polarizing plate integrated with a viewing angle expanding film and the like with a liquid crystal cell, adhesion of a polarizing plate with a retardation film, adhesion of a retardation film with a retardation film and adhesion of a retardation film with a liquid crystal cell and which has the characteristics that a liquid crystal display obtained therefrom is less liable to cause light leakage even under the environment of high temperature and high humidity and that static electricity is less liable to be produced when peeling off a release film from a pressure-sensitive adhesive layer.The pressure-sensitive adhesive for applying an optically functional film comprises a pressure-sensitive adhesive resin and an antistatic agent, wherein a storage elastic modulus (G′) at 23° C. is 0.3 MPa or more, and a charged voltage on the surface of a layer comprising the above pressure-sensitive adhesive which is measured 5 seconds later since peeling off a release film brought into contact with the above pressure-sensitive adhesive layer under the environment of 23° C. and a relative humidity of 50% is 1.0 kV or less.

    摘要翻译: 提供一种用于光学功能膜的粘合剂,其可以在光学功能膜的粘附性方面具有良好的耐久性,例如粘合偏振片,特别是与视角扩展膜一体化的偏振片等 具有液晶单元,偏振板与延迟膜的粘合,相位差膜与延迟膜的粘合性以及相位差膜与液晶单元的粘附性,具有由其获得的液晶显示器的特性较小 即使在高温高湿的环境下也容易引起漏光,并且当从压敏粘合剂层剥离剥离膜时静电不易产生。 用于施加光学功能膜的压敏粘合剂包括压敏粘合剂树脂和抗静电剂,其中23℃下的储能弹性模量(G')为0.3MPa以上,表面上的充电电压 包含上述压敏粘合剂的层,其在23℃,相对湿度为50%的环境下剥离与上述压敏粘合剂层接触的剥离膜5秒钟后测量为1.0 kV以下。

    Pressure-sensitive adhesive for polarizing plates, polarizing plate having pressure-sensitive adhesive and production process for the polarizing plate
    8.
    发明申请
    Pressure-sensitive adhesive for polarizing plates, polarizing plate having pressure-sensitive adhesive and production process for the polarizing plate 审中-公开
    用于偏光板的压敏粘合剂,具有压敏粘合剂的偏振片和偏振片的制造方法

    公开(公告)号:US20060223938A1

    公开(公告)日:2006-10-05

    申请号:US11368385

    申请日:2006-03-07

    IPC分类号: C08L33/00

    摘要: There are disclosed a pressure-sensitive adhesive for polarizing plates which is formed by irradiating a pressure-sensitive adhesive material with an active energy beam, the material containing an acrylic copolymer (A) and an acrylic copolymer bearing an active energy beam-polymerizable group on a side chain (B), and which has a storage elastic modulus (G′) at 23 ° C. in the range of 0.3 to 10 MPa: a polarizing plate which is having a pressure-sensitive adhesive, and which comprises a layer composed of the above pressure-sensitive adhesive; and a process for the production of the polarizing plate having a pressure-sensitive adhesive, which comprises sticking a polarizing plate on a pressure-sensitive adhesive material layer formed on a releasing layer of a releasing sheet, and thereafter irradiating the polarizing plate with an active energy-beam from the releasing sheet side. The pressure-sensitive adhesive for polarizing plates is characterized in that it can favorably sticking a polarizing plate to a liquid crystal cell and that a resultant liquid crystal display unit is less liable to cause light leakage even in an environment of high temperature and high humidity.

    摘要翻译: 公开了一种用于通过用活性能量束照射压敏粘合剂材料而形成的偏振片用压敏粘合剂,该材料含有丙烯酸共聚物(A)和带有活性能量束聚合性基团的丙烯酸共聚物 侧链(B),并且其在23℃下的储能弹性模量(G')在0.3〜10MPa的范围内:具有压敏粘合剂的偏振片,其包含由 的上述压敏粘合剂; 以及制造具有压敏粘合剂的偏光板的方法,该方法包括将偏光板粘贴在形成在剥离片的剥离层上的粘合剂层上,然后用活性物质 来自释放片侧的能量束。 用于偏振片的压敏粘合剂的特征在于,其可以有利地将偏振片粘附到液晶单元,并且所得到的液晶显示单元即使在高温和高湿度的环境中也不太容易引起漏光。

    Pressure sensitive adhesive sheet for semiconductor wafer processing
    9.
    发明授权
    Pressure sensitive adhesive sheet for semiconductor wafer processing 有权
    半导体晶片加工用压敏粘合片

    公开(公告)号:US06723619B2

    公开(公告)日:2004-04-20

    申请号:US10150686

    申请日:2002-05-17

    IPC分类号: H01L2146

    摘要: Disclosed herein is a pressure sensitive adhesive sheet for fixing a semiconductor wafer during semiconductor wafer processing in vacuum, comprising a substrate and, superimposed on one side or both sides thereof, a layer of ultraviolet curable pressure sensitive adhesive composition comprising an ultraviolet curable copolymer having ultraviolet polymerizable groups as side chains and a phosphorous photopolymerization initiator. The pressure sensitive adhesive sheet for semiconductor wafer processing, even in the processing of a semiconductor wafer in vacuum, is free from generating gases from the pressure sensitive adhesive sheet, thereby avoiding wafer deformation attributed to evaporated gas components and adhesive transfer caused thereby.

    摘要翻译: 本发明公开了一种用于在真空中半导体晶片加工期间固定半导体晶片的压敏粘合片,其包括基底,并且在其一侧或两侧上叠加一层紫外线固化型压敏粘合剂组合物,其包含具有紫外线的紫外线固化共聚物 作为侧链的聚合性基团和磷光聚合引发剂。 用于半导体晶片处理的压敏粘合片,即使在真空中的半导体晶片的加工中,也不会产生来自压敏粘合片的气体,从而避免由于蒸发的气体成分引起的晶片变形和由此引起的粘合剂转移。

    Suction apparatus for engine
    10.
    发明授权
    Suction apparatus for engine 失效
    发动机吸油装置

    公开(公告)号:US5040495A

    公开(公告)日:1991-08-20

    申请号:US458289

    申请日:1989-12-28

    IPC分类号: F02B27/00 F02M35/12

    摘要: A suction apparatus for an engine is provided with an intake path which has an opening portion at one end, and the other end of which is connected to an intake pulsation generation source. A resonator is connected to a downstream portion of said intake path through a connecting pipe, for eliminating a (0.5+n)th-order (where n is an integer equal to or larger than 0) resonant wave in the intake path which is induced by a compression wave generated from said intake pulsation generation source toward the upstream side.