摘要:
A DC voltage value is obtained at least at an inside position, an intermediate position, and an outside position on a disc (1) from a drive signal that is supplied to a focusing coil (4) built into an optical pickup (2). From the DC voltage values is obtained a relationship of a position between the respective positions and the DC voltage value, and this relationship is stored into a memory circuit (12). Then, during recording or playback, the DC voltage value that is calculated on the basis of the recording or playback position of the signal at that time and the AC signal included in the drive signal that is supplied to the focusing coil (4) are added to create a signal to be supplied to a tilt adjustment coil (6).
摘要:
In an optical disk recording and reproducing device which uses an optical disk having at least a first recording layer and a second recording layer, a thickness of a spacer section between the first recording layer and the second recording layer is measured, an amount of defocus with respect to the second recording layer is set based on the measured spacer thickness, and a focus servo operation is performed for focusing the laser light irradiated from an optical pickup device on the second recording layer.
摘要:
In an optical disk recording and reproducing device which uses an optical disk having at least a first recording layer and a second recording layer, a thickness of a spacer section between the first recording layer and the second recording layer is measured, an amount of defocus with respect to the second recording layer is set based on the measured spacer thickness, and a focus servo operation is performed for focusing the laser light irradiated from an optical pickup device on the second recording layer.
摘要:
On a through-electrode (7) formed by filling a conductive material into a though hole of a substrate, nano-metal particles are adhered to form a connection electrode (9). An LED element (3) is electrically connected to the through-electrode (7) via the connection electrode (9). The nano-metal particles can be applied into a desired shape by an inkjet method or a dispenser method, and hence a light emitting device (1) having high electrical connection reliability is realized at low cost.
摘要:
A light-emitting element is mounted in a cup-like portion formed on a substrate and a case. The cup-like portion is filled with a sealing member made of a light-transmissible resin. A layer made of a material having a refractive index lower than that of the sealing member is provided between the sealing member and a surface of the case.
摘要:
A low-cost, compact, high-reliability optical sensor device has an optical sensor element mounted in a package comprised of a light shielding glass lid substrate, a part of which has a light filter function, adhered to a light shielding glass substrate having a cavity. In a through hole in the light shielding glass lid substrate, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded. The light shielding glass substrate is made of glass having light shielding property as its own property.
摘要:
Provided is a method of manufacturing an optical filter for an illuminance sensor, which has spectral characteristics close to human luminosity characteristics, has high detection accuracy, and can be manufactured at low cost. The method includes the steps of: (a) punching a glass; (b) feeding a small piece of glass (7) having a filter effect; (c) softening the small piece of glass (7); and (d) abrading.
摘要:
A light emitting device (1) includes a glass substrate (4) having a recess (2) in a front surface, and a lead frame (5a). A copper material (7) is embedded so that the copper material (7) passes through the lead frame (5a). A light emitting element (6) is mounted on the copper material (7). The glass substrate (4) and the lead frame (5a) are bonded to each other so that the light emitting element (6) is exposed from the recess of the glass substrate (4). Thus, the copper material is embedded in a pass-through manner directly under a region of the lead frame where the light emitting element is disposed. Therefore, adhesion between the glass substrate and the lead frame is ensured, and heat generated by the light emitting element may be efficiently radiated from the rear surface of the glass substrate.