摘要:
A projection apparatus includes a casing having a first surface, a modular device having a second surface, and a tongue member complementing with the first surface and protruding outwardly from the second surface. The tongue member has an approximate section and a distal section with a cross-section greater than a cross-section of the approximate section. A U-shaped resilient member has a lower portion fixed securely on the first surface of the casing, and an upper portion defining an entrance with a width smaller than a width of the distal section of the tongue member. The distal section of the tongue member is inserted into the U-shaped resilient member via the entrance so as to mount the second surface of the modular device on the first surface of the casing.
摘要:
A heat dissipation device of a projector for transmitting the heat from a lamp out of the projector, the heat dissipation device comprises a fan, a diversion duct, and a division vane. The diversion duct is used for changing the direction of the air flow that generated by the fan to a second direction from a first direction; and the division vane is disposed within the diversion duct for splitting the air flow to discharge the air flow with uniform distributing heat off the diversion duct.
摘要:
A heat dissipation device of a projector for transmitting the heat from a lamp out of the projector, the heat dissipation device comprises a fan, a diversion duct, and a division vane. The diversion duct is used for changing the direction of the air flow that generated by the fan to a second direction from a first direction; and the division vane is disposed within the diversion duct for splitting the air flow to discharge the air flow with uniform distributing heat off the diversion duct.
摘要:
A debugging device for performing a debugging process through an electronic device external connector system is provided. The debugging device performs the debugging process to a target system, and the device comprises a first external connector, a switch, and a debugging module. The first external connector is connected to the external port of the target system. The switch is connected to the first external connector, and the switch chooses to activate the debugging process. The debugging module is connected to the switch, and the debugging module receives a universal asynchronous receiver/transmitter (UART) signal provided by the target system.
摘要:
A semiconductor light-emitting device and a manufacturing method thereof are provided, wherein the semiconductor light-emitting device includes a first type doped semiconductor structure, a light-emitting layer, a second type doped semiconductor layer, a first conductive layer and a dielectric layer. The first type doped semiconductor structure includes a base and a plurality of columns extending outward from the base. Each of the columns includes a top surface and a plurality of sidewall surfaces. The light-emitting layer is disposed on the sidewall surfaces and the top surface, wherein the surface area of the light-emitting layer gradually changes from one side adjacent to the columns to a side away from the columns. The dielectric layer exposes the first conductive layer locating on the top surface of each of the columns, wherein the dielectric layer includes at least one of a plurality of quantum dots, phosphors, and metal nanoparticles.
摘要:
A fabrication method of nanoparticles is provided. A substrate having a plurality of pillar structures is provided and then a plurality of ring structures is formed to surround the plurality of the pillar structures. The inner wall of each ring structure surrounds the sidewall of each pillar structure. A portion of each pillar structure is removed to reduce the height of each pillar structure and to expose the inner wall of each ring structure. The ring structures are separated from the pillar structures to form a plurality of nanoparticles. Surface modifications are applied to the ring structures before the ring structures are separated from the pillar structures on the substrate.
摘要:
The invention is directed to a method for forming a nitride on a silicon substrate. In the method of the present invention, a silicon substrate is provided and a buffer layer is formed on the silicon substrate. The formation of the buffer layer includes a multi-level temperature modulation process having a plurality temperature levels and a plurality of temperature modulations. For each of the temperature modulations, the temperature is gradually decreased. A nitride is formed on the buffer layer.
摘要:
A method for forming a periodic structure is disclosed. A structural layer and an optical modulation element are provided. A light is emitted to pass through the optical modulation element to irradiate interference strips on the structural layer. A photoelectrochemical etching (PEC) is performed to form the periodic structure according the interference strips irradiated on the structural layer.
摘要:
A mirror image suppression method adapted to an optical coherence tomography (OCT) system is provided. The mirror image suppression method includes the following steps: obtaining a tomography image of an object to be tested by using the OCT system; calculating one real image signal obtained from an nth specific-mode scan for a specific pixel of the tomography image based on image signals obtained from an (n−1)th and the nth specific-mode scans; obtaining one real image signal of each of a plurality of pixels in the tomography image based on the calculation in the step of calculating the one real image signal; and reconstructing the tomography image based on the real image signal of each of the pixels obtained in the step of obtaining the one real image signal to suppress mirror image signals of the tomography image.
摘要:
The present invention relates to a method for manufacturing a chip resistor having a low resistance. The method includes the following steps: (a) providing a substrate having a top surface; (b) sputtering a conducting layer directly on the top surface of the substrate, so that the conducting layer and the substrate contact each other, wherein the material of the conducting layer comprises nickel or copper; and (c) plating at least one metal layer directly on the conducting layer, so that the metal layer and the conducting layer contact each other, wherein the material of the metal layer comprises nickel or copper, and the conducting layer and the metal layer provide a resistive layer. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, so the yield rate and the efficiency are improved and the manufacturing cost is cut down.