公开(公告)号：US08759814B2

公开(公告)日：2014-06-24

申请号：US13615548

申请日：2012-09-13

申请人： Chih-Chung Yang ,  Che-Hao Liao ,  Shao-Ying Ting ,  Horng-Shyang Chen ,  Wen-Ming Chang ,  Yu-Feng Yao ,  Chih-Yen Chen ,  Hao-Tsung Chen

发明人： Chih-Chung Yang ,  Che-Hao Liao ,  Shao-Ying Ting ,  Horng-Shyang Chen ,  Wen-Ming Chang ,  Yu-Feng Yao ,  Chih-Yen Chen ,  Hao-Tsung Chen

IPC分类号： H01L31/00

CPC分类号： H01L33/18 ,  H01L33/08 ,  H01L33/24 ,  H01L33/44 ,  H01L33/502

摘要： A semiconductor light-emitting device and a manufacturing method thereof are provided, wherein the semiconductor light-emitting device includes a first type doped semiconductor structure, a light-emitting layer, a second type doped semiconductor layer, a first conductive layer and a dielectric layer. The first type doped semiconductor structure includes a base and a plurality of columns extending outward from the base. Each of the columns includes a top surface and a plurality of sidewall surfaces. The light-emitting layer is disposed on the sidewall surfaces and the top surface, wherein the surface area of the light-emitting layer gradually changes from one side adjacent to the columns to a side away from the columns. The dielectric layer exposes the first conductive layer locating on the top surface of each of the columns, wherein the dielectric layer includes at least one of a plurality of quantum dots, phosphors, and metal nanoparticles.

摘要翻译： 提供一种半导体发光器件及其制造方法，其中半导体发光器件包括第一掺杂半导体结构，发光层，第二掺杂半导体层，第一导电层和介电层 。 第一类型掺杂半导体结构包括从基底向外延伸的基部和多个列。 每个柱包括顶表面和多个侧壁表面。 发光层设置在侧壁表面和顶表面上，其中发光层的表面积从相邻列的一侧逐渐变为离开立柱的一侧。 电介质层暴露位于每个列的顶表面上的第一导电层，其中介电层包括多个量子点，磷光体和金属纳米颗粒中的至少一个。

公开(公告)号：US08753559B2

公开(公告)日：2014-06-17

申请号：US13530104

申请日：2012-06-21

申请人： Chih-Chung Yang ,  Hung-Yu Tseng ,  Wei-Fang Chen ,  Che-Hao Liao ,  Yu-Feng Yao

发明人： Chih-Chung Yang ,  Hung-Yu Tseng ,  Wei-Fang Chen ,  Che-Hao Liao ,  Yu-Feng Yao

IPC分类号： B22D29/00 ,  B29C33/42

CPC分类号： B82Y40/00 ,  B81C99/008

摘要： A fabrication method of nanoparticles is provided. A substrate having a plurality of pillar structures is provided and then a plurality of ring structures is formed to surround the plurality of the pillar structures. The inner wall of each ring structure surrounds the sidewall of each pillar structure. A portion of each pillar structure is removed to reduce the height of each pillar structure and to expose the inner wall of each ring structure. The ring structures are separated from the pillar structures to form a plurality of nanoparticles. Surface modifications are applied to the ring structures before the ring structures are separated from the pillar structures on the substrate.

摘要翻译： 提供了纳米颗粒的制造方法。 提供具有多个柱结构的基板，然后形成多个环形结构以围绕多个柱结构。 每个环结构的内壁围绕每个支柱结构的侧壁。 每个柱结构的一部分被去除以减小每个柱结构的高度并暴露每个环结构的内壁。 环结构与柱结构分离以形成多个纳米颗粒。 在将环结构与衬底上的柱结构分离之前，对环结构进行表面改性。

公开(公告)号：US20110024627A1

公开(公告)日：2011-02-03

申请号：US12533173

申请日：2009-07-31

申请人： Yu Feng Yao

发明人： Yu Feng Yao

IPC分类号： H01L27/14 ,  G01J5/02 ,  H05K3/30 ,  H01L21/00

CPC分类号： H01L31/101 ,  G01J1/02 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0466 ,  G01J1/06 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/12 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/3025 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical proximity sensor is provided that comprises an infrared light emitter, an infrared light detector, a ceramic housing, a substrate, and a cover or shield. The ceramic housing is mounted on or attached to the substrate, and comprises first and second recesses separated by a light barrier. The cover is mounted over the ceramic housing, the light emitter and the light detector. The infrared light emitter is located within the first recess and mounted on the substrate. The infrared light detector is located within the second recess and mounted on the substrate. The light barrier between the first and second recesses, in conjunction with the remainder of the ceramic housing, the substrate, and the cover or shield substantially attenuates or blocks the transmission of undesired direct, scattered or reflected infrared light between the light emitter and the light detector, and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.

摘要翻译： 提供了一种光学接近传感器，其包括红外光发射器，红外光检测器，陶瓷壳体，基板和盖或屏蔽件。 陶瓷外壳安装在基板上或附着在基板上，并且包括由光屏隔开的第一和第二凹槽。 盖子安装在陶瓷外壳，发光器和光检测器上。 红外光发射器位于第一凹槽内并安装在基板上。 红外光检测器位于第二凹槽内并安装在基板上。 第一和第二凹部之间的光屏障与陶瓷壳体的其余部分，基底和盖子或屏蔽件相结合，基本上衰减或阻挡在光发射器和光线之间的不期望的直接，散射或反射的红外光的透射 检测器，从而使光发射器和光检测器之间的光串扰和干扰最小化。

公开(公告)号：US20140042387A1

公开(公告)日：2014-02-13

申请号：US13615548

申请日：2012-09-13

申请人： Chih-Chung Yang ,  Che-Hao Liao ,  Shao-Ying Ting ,  Horng-Shyang Chen ,  Wen-Ming Chang ,  Yu-Feng Yao ,  Chih-Yen Chen ,  Hao-Tsung Chen

发明人： Chih-Chung Yang ,  Che-Hao Liao ,  Shao-Ying Ting ,  Horng-Shyang Chen ,  Wen-Ming Chang ,  Yu-Feng Yao ,  Chih-Yen Chen ,  Hao-Tsung Chen

IPC分类号： H01L33/04 ,  H01L33/44

CPC分类号： H01L33/18 ,  H01L33/08 ,  H01L33/24 ,  H01L33/44 ,  H01L33/502

摘要： A semiconductor light-emitting device and a manufacturing method thereof are provided, wherein the semiconductor light-emitting device includes a first type doped semiconductor structure, a light-emitting layer, a second type doped semiconductor layer, a first conductive layer and a dielectric layer. The first type doped semiconductor structure includes a base and a plurality of columns extending outward from the base. Each of the columns includes a top surface and a plurality of sidewall surfaces. The light-emitting layer is disposed on the sidewall surfaces and the top surface, wherein the surface area of the light-emitting layer gradually changes from one side adjacent to the columns to a side away from the columns. The dielectric layer exposes the first conductive layer locating on the top surface of each of the columns, wherein the dielectric layer includes at least one of a plurality of quantum dots, phosphors, and metal nanoparticles.

摘要翻译： 提供一种半导体发光器件及其制造方法，其中半导体发光器件包括第一掺杂半导体结构，发光层，第二掺杂半导体层，第一导电层和介电层 。 第一类型掺杂半导体结构包括从基底向外延伸的基部和多个列。 每个柱包括顶表面和多个侧壁表面。 发光层设置在侧壁表面和顶表面上，其中发光层的表面积从与列相邻的一侧逐渐变为远离柱的一侧。 电介质层暴露位于每个列的顶表面上的第一导电层，其中介电层包括多个量子点，磷光体和金属纳米颗粒中的至少一个。

公开(公告)号：US20130285267A1

公开(公告)日：2013-10-31

申请号：US13530104

申请日：2012-06-21

申请人： Chih-Chung Yang ,  Hung-Yu Tseng ,  Wei-Fang Chen ,  Che-Hao Liao ,  Yu-Feng Yao

发明人： Chih-Chung Yang ,  Hung-Yu Tseng ,  Wei-Fang Chen ,  Che-Hao Liao ,  Yu-Feng Yao

IPC分类号： B29B9/12 ,  B82Y40/00

CPC分类号： B82Y40/00 ,  B81C99/008

摘要： A fabrication method of nanoparticles is provided. A substrate having a plurality of pillar structures is provided and then a plurality of ring structures is formed to surround the plurality of the pillar structures. The inner wall of each ring structure surrounds the sidewall of each pillar structure. A portion of each pillar structure is removed to reduce the height of each pillar structure and to expose the inner wall of each ring structure. The ring structures are separated from the pillar structures to form a plurality of nanoparticles. Surface modifications are applied to the ring structures before the ring structures are separated from the pillar structures on the substrate.

摘要翻译： 提供了纳米颗粒的制造方法。 提供具有多个支柱结构的基板，然后形成多个环形结构以围绕多个支柱结构。 每个环结构的内壁围绕每个支柱结构的侧壁。 每个柱结构的一部分被去除以减小每个柱结构的高度并暴露每个环结构的内壁。 环结构与柱结构分离以形成多个纳米颗粒。 在将环结构与衬底上的柱结构分离之前，对环结构进行表面改性。

公开(公告)号：US20120293472A1

公开(公告)日：2012-11-22

申请号：US13108985

申请日：2011-05-17

申请人： Chee Heng Wong ,  Yu Feng Yao ,  Sze Ping Ong

发明人： Chee Heng Wong ,  Yu Feng Yao ,  Sze Ping Ong

IPC分类号： G09G5/00 ,  G01J1/42

CPC分类号： G01J1/4257 ,  G01J1/0219 ,  G01J1/0228 ,  G01J1/0437 ,  G01J1/06 ,  G01J1/4204 ,  G01J1/4228 ,  G09G3/3406 ,  G09G2360/144

摘要： Various embodiments of an ambient light sensor configured to determine the direction of a beam of light incident thereon are disclosed. In one embodiment, an ambient light sensor is provided that comprises a plurality of light detectors arranged in a spatial array upon a light sensing surface. Each of the light detectors in the array is configured to generate an analog output voltage in response to the beam of ambient light falling thereon. The amount of light incident on the individual light detectors in the spatial array varies according to the position of each such sensor with respect to direction of the beam of ambient light. An analog-to-digital converter (ADC) is operably coupled to the plurality of light detectors and is configured to receive the analog output signals generated thereby as inputs thereto, and to provide digital output values representative of the analog signals. Control logic circuitry is operably coupled to the ADC and configured to receive the digital output values therefrom, and is further configured to process such digital output values to determine the direction of the beam of light incident upon the spatial array.

摘要翻译： 公开了配置成确定入射在其上的光束的方向的环境光传感器的各种实施例。 在一个实施例中，提供环境光传感器，其包括在光感测表面上以空间阵列布置的多个光检测器。 阵列中的每个光检测器被配置成响应于其上的环境光束而产生模拟输出电压。 入射到空间阵列中的各个光检测器的光量根据每个这样的传感器相对于环境光束的方向的位置而变化。 模数转换器（ADC）可操作地耦合到多个光检测器，并且被配置为接收由此产生的模拟输出信号作为其输入，并且提供表示模拟信号的数字输出值。 控制逻辑电路可操作地耦合到ADC并被配置为从其接收数字输出值，并且还被配置为处理这样​​的数字输出值以确定入射在空间阵列上的光束的方向。

公开(公告)号：US08711093B2

公开(公告)日：2014-04-29

申请号：US12822352

申请日：2010-06-24

申请人： Chi-Boon Ong ,  Yu-Feng Yao ,  Sze-Ping Ong

发明人： Chi-Boon Ong ,  Yu-Feng Yao ,  Sze-Ping Ong

IPC分类号： G06F3/033

CPC分类号： G06F3/033 ,  G06F3/0304 ,  G06F3/042

摘要： Input devices configured to provide user interface by detecting three dimensional movement of an external object are disclosed. The input device comprises at least two photodetector pairs, a radiation source and a circuit configurable to detect differential and common mode signals generated in the photodetector pairs. By detecting the common mode and differential signals, movement of an external object may be determined and used to control a pointer, or a cursor.

摘要翻译： 公开了通过检测外部对象的三维运动来配置为提供用户界面的输入设备。 输入装置包括至少两个光电检测器对，辐射源和可配置为检测在光电检测器对中产生的差模和共模信号的电路。 通过检测共模和差分信号，可以确定外部对象的移动并用于控制指针或光标。

公开(公告)号：US07678610B2

公开(公告)日：2010-03-16

申请号：US11260091

申请日：2005-10-28

申请人： Chuen Khiang Wang ,  Hien Boon Tan ,  Anthony Yi Sheng Sun ,  Sin Nee Song ,  Steven Yu Feng Yao ,  Hua Hong Tan

发明人： Chuen Khiang Wang ,  Hien Boon Tan ,  Anthony Yi Sheng Sun ,  Sin Nee Song ,  Steven Yu Feng Yao ,  Hua Hong Tan

IPC分类号： H01L21/00

CPC分类号： H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package and method of making the same. A first chip unit includes a first substrate and a first IC chip electrically connected to the first substrate. A second chip unit includes a second substrate and a second IC chip electronically connected to the second substrate. An adhesive material is provided on a surface of the first IC chip and the second chip unit is mounted onto the surface of the first chip unit including the adhesive material so that at least a portion of the second structure is encapsulated by the adhesive material, thereby providing some encapsulation in the same step as mounting. The first chip unit and the second chip unit may be separated by a spacer which may also provide an electrical connection.

摘要翻译： 一种半导体芯片封装及其制造方法。 第一芯片单元包括电连接到第一基板的第一基板和第一IC芯片。 第二芯片单元包括电子连接到第二基板的第二基板和第二IC芯片。 粘合材料设置在第一IC芯片的表面上，第二芯片单元安装在包括粘合材料的第一芯片单元的表面上，使得第二结构的至少一部分被粘合材料封装，从而 在与安装相同的步骤中提供一些封装。 第一芯片单元和第二芯片单元可以由也可以提供电连接的间隔件分开。

公开(公告)号：US08681137B2

公开(公告)日：2014-03-25

申请号：US13108985

申请日：2011-05-17

申请人： Chee Heng Wong ,  Yu Feng Yao ,  Sze Ping Ong

发明人： Chee Heng Wong ,  Yu Feng Yao ,  Sze Ping Ong

IPC分类号： G06F3/038

CPC分类号： G01J1/4257 ,  G01J1/0219 ,  G01J1/0228 ,  G01J1/0437 ,  G01J1/06 ,  G01J1/4204 ,  G01J1/4228 ,  G09G3/3406 ,  G09G2360/144

摘要： Various embodiments of an ambient light sensor configured to determine the direction of a beam of light incident thereon are disclosed. In one embodiment, an ambient light sensor is provided that comprises a plurality of light detectors arranged in a spatial array upon a light sensing surface. Each of the light detectors in the array is configured to generate an analog output voltage in response to the beam of ambient light falling thereon. The amount of light incident on the individual light detectors in the spatial array varies according to the position of each such sensor with respect to direction of the beam of ambient light. An analog-to-digital converter (ADC) is operably coupled to the plurality of light detectors and is configured to receive the analog output signals generated thereby as inputs thereto, and to provide digital output values representative of the analog signals. Control logic circuitry is operably coupled to the ADC and configured to receive the digital output values therefrom, and is further configured to process such digital output values to determine the direction of the beam of light incident upon the spatial array.

摘要翻译： 公开了配置成确定入射在其上的光束的方向的环境光传感器的各种实施例。 在一个实施例中，提供环境光传感器，其包括在光感测表面上以空间阵列布置的多个光检测器。 阵列中的每个光检测器被配置成响应于其上的环境光束而产生模拟输出电压。 入射到空间阵列中的各个光检测器的光量根据每个这样的传感器相对于环境光束的方向的位置而变化。 模数转换器（ADC）可操作地耦合到多个光检测器，并且被配置为接收由此产生的模拟输出信号作为其输入，并且提供表示模拟信号的数字输出值。 控制逻辑电路可操作地耦合到ADC并被配置为从其接收数字输出值，并且还被配置为处理这样​​的数字输出值以确定入射在空间阵列上的光束的方向。

公开(公告)号：US20130256650A1

公开(公告)日：2013-10-03

申请号：US13481856

申请日：2012-05-27

申请人： Chih-Chung Yang ,  Horng-Shyang Chen ,  Shao-Ying Ting ,  Che-Hao Liao ,  Chih-Yen Chen ,  Chieh Hsieh ,  Hao-Tsung Chen ,  Yu-Feng Yao ,  Dong-Ming Yeh

发明人： Chih-Chung Yang ,  Horng-Shyang Chen ,  Shao-Ying Ting ,  Che-Hao Liao ,  Chih-Yen Chen ,  Chieh Hsieh ,  Hao-Tsung Chen ,  Yu-Feng Yao ,  Dong-Ming Yeh

IPC分类号： H01L33/28 ,  H01L33/34 ,  H01L33/32 ,  H01L33/26

CPC分类号： H01L33/025 ,  H01L33/22 ,  H01L33/382 ,  H01L2933/0091

摘要： A semiconductor device and fabrication method thereof are provided, wherein the fabrication method of the semiconductor device includes the following steps. Forming a semiconductor layer on a substrate, wherein the semiconductor layer has a top surface and a bottom surface that is opposite to the top surface. The bottom surface is in contact with the substrate, and the top surface has a plurality of pits, the pits are extended from the top surface toward the bottom surface. Preparing a solution, wherein the solution includes a plurality of nanoparticles. Filling the nanoparticles into the pits. Forming a conducting layer on the semiconductor layer after filling the nanoparticles into the pits.

摘要翻译： 提供了半导体器件及其制造方法，其中半导体器件的制造方法包括以下步骤。 在基板上形成半导体层，其中半导体层具有与顶表面相对的顶表面和底表面。 底表面与基底接触，并且顶表面具有多个凹坑，凹坑从顶表面向底表面延伸。 制备溶液，其中溶液包括多个纳米颗粒。 将纳米颗粒填充到凹坑中。 在将纳米颗粒填充到凹坑中之后，在半导体层上形成导电层。