公开(公告)号：US20170268097A1

公开(公告)日：2017-09-21

申请号：US15527754

申请日：2015-06-16

Applicant: ULVAC, INC.

Inventor： Shinya Nakamura ,  Yoshihiro Ikeda ,  Yuusuke Miyaguchi ,  Kazuyoshi Hashimoto ,  Kengo Tsutsumi ,  Yoshinori Fujii

IPC: C23C14/34 ,  H01J37/34

CPC classification number: C23C14/3407 ,  C23C14/081 ,  H01J37/3491

Abstract: A target assembly is provided in which an abnormal discharging between a projected portion of a backing plate and a side surface of the target is prevented and also in which a bonding material to bond the target and the backing plate can be surely prevented from seeping to the outside and also which is easy in reusing the backing plate. The target assembly according to this invention having: a target made of an insulating material; and a backing plate bonded to one surface of the target via a bonding material, the backing plate having a projected portion which is projected outward beyond an outer peripheral edge of the target, further has an annular insulating plate. The annular insulating plate: encloses a circumference of the target while maintaining a predetermined clearance to a side surface of the target; and covers that surface of the projected portion.

公开(公告)号：US08883632B2

公开(公告)日：2014-11-11

申请号：US13737875

申请日：2013-01-09

Applicant: ULVAC, Inc.

Inventor： Youhei Endo ,  Shuji Kodaira ,  Yuta Sakamoto ,  Junichi Hamaguchi ,  Yohei Uchida ,  Yasushi Higuchi ,  Shinya Nakamura ,  Kazuyoshi Hashimoto ,  Yoshihiro Ikeda ,  Hiroaki Iwasawa

IPC: H01L21/768

CPC classification number: H01L21/76882 ,  H01L21/76883

Abstract: A manufacturing method of a device including: a first process in which a barrier film is formed on a substrate with a concave portion provided on one surface thereof so as to cover an inner wall surface of the concave portion; a second process in which a conductive film is formed so as to cover the barrier film; and a third process in which the conductive film is melted by a reflow method, wherein the method includes a process α between the second process and the third process, in which the substrate with the barrier film and the conductive film laminated thereon in this order is exposed to an atmosphere under a pressure A for a time period B, and wherein in the process α, control is carried out such that a product of the pressure A and the time period B is not greater than 6×10−4 [Pa·s].

Abstract translation: 一种器件的制造方法，包括：第一工序，其中在基板上形成阻挡膜，所述基板的一个表面上设有凹部以覆盖所述凹部的内壁面; 形成导电膜以覆盖阻挡膜的第二工序; 以及其中导电膜通过回流方法熔化的第三工艺，其中该方法包括第二工艺和第三工艺之间的工艺α，其中具有阻挡膜的衬底和其上的导电膜依次层压在其上 在压力A下暴露于气氛一段时间B，并且其中在过程α中，进行控制，使得压力A和时间段B的乘积不大于6×10-4 [Pa· s]。

公开(公告)号：US11972932B2

公开(公告)日：2024-04-30

申请号：US18546697

申请日：2021-11-09

Applicant: ULVAC, INC.

Inventor： Toshihiko Nakahata ,  Kazuyoshi Hashimoto ,  Harumasa Yamaguchi

IPC: H01J37/32 ,  C23C14/34

CPC classification number: H01J37/32577 ,  C23C14/3492 ,  H01J37/32183

Abstract: [Object] To improve step coverage of a coating film
[Solving Means] A deposition apparatus that includes a first electrode, a second electrode, a first power supply source, a second power supply source, and a phase adjuster is used. The first power supply source includes a first high-frequency power source and a first matching circuit, the first high-frequency power source outputting first high-frequency power, the first matching circuit being connected between the first high-frequency power source and the first electrode. The second power supply source includes a second matching circuit that outputs second high-frequency power, the second high-frequency power having the same period as the first high-frequency power and being lower than the first high-frequency power. A second high-frequency power source is caused to output the second high-frequency power and the phase adjuster is caused to operate to provide a phase difference θ between a phase of the first high-frequency power and a phase of the second high-frequency power. A voltage value Vpp of the second high-frequency power and a capacitance value C1 of a first variable capacitor that correspond to the phase difference θ in a state where output impedance of the second high-frequency power source and load-side impedance connected to the second high-frequency power source match are detected. The voltage value Vpp and the capacitance value C1 are selected in combination in a predetermined range of the phase difference θ.

公开(公告)号：US20210079514A1

公开(公告)日：2021-03-18

申请号：US16954441

申请日：2018-12-04

Applicant: ULVAC, INC.

Inventor： Yoshinori Fujii ,  Shinya Nakamura ,  Mitsunori Noro ,  Kazuyoshi Hashimoto

IPC: C23C14/34 ,  C23C14/06

Abstract: [SUMMARY] A sputtering method includes disposing a carbon target (Tg) and a film-forming object (Wf) inside a vacuum chamber (1); evacuating the vacuum chamber to a predetermined pressure by a vacuum pump (Vp); subsequently introducing a sputtering gas into the vacuum chamber; charging the target with electric power to form a plasma atmosphere such that the target gets sputtered by the ions of the sputtering gas in the plasma, whereby carbon particles splashed from the target are caused to be adhered to, and deposited on, a surface of the film-forming object, thereby forming a carbon film. The target is cooled by heat exchanging with a first refrigerant at least during the time when the target receives radiant heat from the plasma; wherein the temperature of the first refrigerant is controlled to keep the temperature of the first refrigerant below 263K.

公开(公告)号：US10435783B2

公开(公告)日：2019-10-08

申请号：US15527754

申请日：2015-06-16

Applicant: ULVAC, INC.

Inventor： Shinya Nakamura ,  Yoshihiro Ikeda ,  Yuusuke Miyaguchi ,  Kazuyoshi Hashimoto ,  Kengo Tsutsumi ,  Yoshinori Fujii

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/08

Abstract: A target assembly is provided in which an abnormal discharging between a projected portion of a backing plate and a side surface of the target is prevented and also in which a bonding material to bond the target and the backing plate can be surely prevented from seeping to the outside and also which is easy in reusing the backing plate. The target assembly according to this invention having: a target made of an insulating material; and a backing plate bonded to one surface of the target via a bonding material, the backing plate having a projected portion which is projected outward beyond an outer peripheral edge of the target, further has an annular insulating plate. The annular insulating plate: encloses a circumference of the target while maintaining a predetermined clearance to a side surface of the target; and covers that surface of the projected portion.