公开(公告)号：US10791645B1

公开(公告)日：2020-09-29

申请号：US16791478

申请日：2020-02-14

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

IPC分类号： H05K5/00 ,  H05K7/14 ,  H05K1/18 ,  B29C45/14 ,  H05K1/11 ,  B29C45/16 ,  B29K63/00 ,  B29C45/00

摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

公开(公告)号：US10264664B1

公开(公告)日：2019-04-16

申请号：US14731287

申请日：2015-06-04

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Patrick R. Lavery ,  Rudolph F. Mutter ,  Jeffery J. Kirk ,  Andrew T. D'Amico

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/20 ,  H05K3/18 ,  H05K3/16 ,  H05K3/38 ,  H05K3/24

摘要： Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

公开(公告)号：US10158357B1

公开(公告)日：2018-12-18

申请号：US15091346

申请日：2016-04-05

申请人： VLT, Inc

发明人： Patrizio Vinciarelli ,  Andrew T. D'Amico

IPC分类号： H03B1/00 ,  H03K17/691 ,  H03K5/08

摘要： A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

公开(公告)号：US10701828B1

公开(公告)日：2020-06-30

申请号：US15150875

申请日：2016-05-10

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K7/14 ,  H05K1/11 ,  B29C45/14 ,  B29C45/00 ,  B29C45/16 ,  B29K63/00

摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

公开(公告)号：US20150181727A1

公开(公告)日：2015-06-25

申请号：US14635467

申请日：2015-03-02

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

IPC分类号： H05K5/00 ,  H05K5/02 ,  H05K5/04 ,  B23P15/00 ,  H01F27/28 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H01F27/24 ,  B29C45/16 ,  H05K7/14

CPC分类号： H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

摘要翻译： 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

公开(公告)号：US10784765B1

公开(公告)日：2020-09-22

申请号：US16299243

申请日：2019-03-12

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Andrew T. D'Amico

IPC分类号： H02M1/08 ,  H02M3/155 ,  H01L23/64 ,  H01L23/538 ,  H01L25/18

摘要： A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die. Multi-output POL circuits may be used in conjunction with on-chip rail-selection and regulation circuitry to further improve efficiency. A three-stage power conversion system includes off-package, on-package and on-chip conversion stages.

公开(公告)号：US10757816B2

公开(公告)日：2020-08-25

申请号：US15186189

申请日：2016-06-17

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

IPC分类号： H05K3/28 ,  H05K1/18 ,  H05K1/11 ,  B29C45/00 ,  B29C45/14 ,  H01R43/20 ,  H01R43/24 ,  H05K5/06 ,  H05K7/20 ,  H01R27/02 ,  H05K3/00 ,  H05K1/02

摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

公开(公告)号：US10537015B1

公开(公告)日：2020-01-14

申请号：US15969882

申请日：2018-05-03

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Patrick R. Lavery ,  Rudolph F. Mutter ,  Jeffery J. Kirk ,  Andrew T. D'Amico

IPC分类号： H05K3/30 ,  H05K1/02 ,  H05K3/38 ,  H05K3/00 ,  H05K3/24 ,  H05K1/18 ,  H05K3/18 ,  H05K3/20 ,  H05K1/11 ,  H05K3/16 ,  H01L23/28 ,  H01L21/44 ,  H01L23/053 ,  H01L23/057 ,  H01L23/14

摘要： Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

公开(公告)号：US10277105B1

公开(公告)日：2019-04-30

申请号：US15616288

申请日：2017-06-07

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Andrew T. D'Amico

IPC分类号： H02M1/08 ,  H01L25/18 ,  H01L23/538 ,  H01L23/64 ,  H02M3/155

摘要： A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die. Multi-output POL circuits may be used in conjunction with on-chip rail-selection and regulation circuitry to further improve efficiency. A three-stage power conversion system includes off-package, on-package and on-chip conversion stages.

公开(公告)号：US20160302312A1

公开(公告)日：2016-10-13

申请号：US15186189

申请日：2016-06-17

申请人： VLT, Inc.

发明人： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

IPC分类号： H05K3/28 ,  H01R27/02 ,  H05K1/11 ,  H05K3/00 ,  H05K5/06

摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

摘要翻译： 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在封装之后切割成一个或多个单独的部件。 模具可以用于形成成品的一部分，例如， 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。 可以使用可再利用的板来代替散热板。 或者，面板可以在固化之后被封装在可再使用的模具中并与其分离。